SURFACE NANOFABRICATION METHODS USING SELF-ASSEMBLED POLYMER NANOMASKS
    3.
    发明申请
    SURFACE NANOFABRICATION METHODS USING SELF-ASSEMBLED POLYMER NANOMASKS 审中-公开
    使用自组装聚合物纳米颗粒的表面纳米化方法

    公开(公告)号:WO2014116547A1

    公开(公告)日:2014-07-31

    申请号:PCT/US2014/012228

    申请日:2014-01-21

    CPC classification number: B05D5/00 B82Y10/00 B82Y40/00 G03F7/0002 Y10S977/888

    Abstract: Methods for fabricating a nanopillared substrate surface include applying a polymer solution containing an amphiphilic block copolymer and a hydrophilic homopolymer to a substrate surface. The amphiphilic block copolymer and the hydrophilic homopolymer in the polymer solution self-assemble on the substrate surface to form a self-assembled polymer layer having hydrophobic domains adjacent to the substrate surface and hydrophilic domains extending into the self-assembled polymer layer. At least a portion of the hydrophilic domains may be removed to form a plurality of pores in the exposed surface of the self-assembled polymer layer. A protective layer may be deposited on the exposed surface as a mask for etching through the plurality of pores to form through-holes. A nanopillar-forming material may be deposited onto the substrate surface via the through-holes. Then, the remaining portion of the self-assembled polymer layer may be removed to expose a nanopillared substrate surface.

    Abstract translation: 用于制造纳米圆柱形基底表面的方法包括将含有两亲嵌段共聚物和亲水均聚物的聚合物溶液施加到基底表面。 聚合物溶液中的两亲性嵌段共聚物和亲水均聚物自组装在基材表面上以形成具有与基材表面相邻的疏水区域和延伸到自组装聚合物层中的亲水区域的自组装聚合物层。 亲水区域的至少一部分可以被去除以在自组装聚合物层的暴露表面中形成多个孔。 可以在暴露的表面上沉积保护层作为用于通过多个孔蚀刻的掩模以形成通孔。 可以通过通孔将纳米柱形成材料沉积到衬底表面上。 然后,可以除去自组装聚合物层的剩余部分以暴露出纳米圆柱形的衬底表面。

    FILMS FOR DISPLAY COVERS AND DISPLAY DEVICES COMPRISING THE SAME
    4.
    发明申请
    FILMS FOR DISPLAY COVERS AND DISPLAY DEVICES COMPRISING THE SAME 审中-公开
    用于显示盖板的膜和包含该膜的显示设备

    公开(公告)号:WO2014074406A2

    公开(公告)日:2014-05-15

    申请号:PCT/US2013068020

    申请日:2013-11-01

    CPC classification number: G02B5/045 G06F1/1601

    Abstract: Films for display device covers and display device covers comprising the same are disclosed. In one embodiment, a display cover for coupling to a display device includes a perimeter portion comprising a first surface and a second surface. A film of polymeric material may be attached to at least one of the first surface or the second surface of the perimeter portion. The film may include a first array of prisms extending from an edge of the perimeter portion to a distance L. The first array of prisms may be offset from and positioned below a surface of the film by an offset spacing dz.

    Abstract translation: 公开了用于显示设备盖的膜和包括该膜的显示设备盖。 在一个实施例中,用于耦合到显示装置的显示器盖包括周边部分,该周边部分包括第一表面和第二表面。 聚合物材料膜可以附接到周边部分的第一表面或第二表面中的至少一个。 该膜可以包括从周边部分的边缘延伸到距离L的第一棱镜阵列。第一棱镜阵列可以偏移并位于膜表面下方偏移间隔dz。

    NETWORK-WIDE FLOW MONITORING IN SPLIT ARCHITECTURE NETWORKS
    6.
    发明申请
    NETWORK-WIDE FLOW MONITORING IN SPLIT ARCHITECTURE NETWORKS 审中-公开
    分布式架构网络中的网络流量监控

    公开(公告)号:WO2013038279A1

    公开(公告)日:2013-03-21

    申请号:PCT/IB2012/054030

    申请日:2012-08-07

    Inventor: ZHANG, Ying

    CPC classification number: H04L43/026 H04L43/04 H04L43/0876 H04L43/12

    Abstract: Flow monitoring tasks are assigned to a set of switches in a split architecture network to optimize network-wide flow monitoring. The assignment maximizes the number of monitored flows and reduces overhead of the flow monitoring. A controller receives an estimated traffic volume for each path in the network. The controller calculates, for all of the switches and all of the paths, sampling fractions that maximize the number of the flows sampled by the switches. In response to a request for setting up a new flow to traverse one of the paths in the network, the controller assigns the new flow to one of the switches that are located on the one of the paths, based on the sampling fraction for the assigned switch and the one of the paths, the bandwidth constraint and the memory constraint.

    Abstract translation: 分流架构网络中的一组交换机分配了流量监控任务,以优化全网络流量监控。 分配最大化监视流量的数量,并减少流量监控的开销。 控制器接收网络中每个路径的估计交通量。 控制器为所有交换机和所有路径计算采样分数,以使由交换机采样的流量数量最大化。 响应于设置新流程以遍历网络中的一条路径的请求,控制器基于所分配的采样分数将新流量分配给位于一条路径上的交换机之一 切换和路径之一,带宽约束和内存约束。

    MICROPOROUS THERMOPLASTIC SHEETS
    8.
    发明申请
    MICROPOROUS THERMOPLASTIC SHEETS 审中-公开
    微波热塑片

    公开(公告)号:WO2012027687A1

    公开(公告)日:2012-03-01

    申请号:PCT/US2011049379

    申请日:2011-08-26

    CPC classification number: C08J7/02 C08J2325/06 C08J2365/00

    Abstract: Thermoplastic polymeric sheets are rendered microporous and remain substantially flat by contacting the sheet with a first fluid composition that contains or more solvents for the polymeric sheet to render the sheet microporous and then contacting the microporous sheet with a second fluid composition that is substantially free of solvents for the polymer and that contains a non-solvent that is miscible with the one or more solvents of the first composition. Contacting the microporous sheet with the second fluid composition preferably occurs prior to substantial evaporation of the first fluid compositions, or solvents thereof, from the microporous sheet.

    Abstract translation: 将热塑性聚合物片材变成微孔并且通过使片材与含有或多于聚合物片材的溶剂的第一流体组合物接触而保持基本上平坦,以使片材微孔,然后使微孔片材与基本上不含溶剂的第二流体组合物接触 并且含有与第一组合物的一种或多种溶剂混溶的非溶剂。 在微孔片与第二流体组合物接触之前,优选在第一种流体组合物或其溶剂从微孔片大量蒸发之前进行。

    COMPOUNDS AND METHODS FOR KINASE MODULATION, AND INDICATIONS THEREFOR
    9.
    发明申请
    COMPOUNDS AND METHODS FOR KINASE MODULATION, AND INDICATIONS THEREFOR 审中-公开
    化合物及其调节方法及其适应症

    公开(公告)号:WO2011133637A3

    公开(公告)日:2012-02-09

    申请号:PCT/US2011033192

    申请日:2011-04-20

    CPC classification number: C07D487/04 C07D471/04

    Abstract: Compounds and salts thereof, formulations thereof, conjugates thereof, derivatives thereof, forms thereof and uses thereof are described. In certain aspects and embodiments, the described compounds or salts thereof, formulations thereof, conjugates thereof, derivatives thereof, forms thereof are active on one or more of Fms, Kit, Flt3, TrkA, TrkB and TrkC kinase protein. Also described are methods of use thereof to treat diseases and conditions, including diseases and conditions associated with activity of one or more of Fms, Kit, Flt3, TrkA, TrkB and TrkC, including rheumatoid arthiritis, osteoarthritis, osteoporosis, peri-prosthetic osteolysis, systemic sclerosis, demyelinating disorders, multiple sclerosis, Charcot Marie Tooth syndrome, amyotrophic lateral sclerosis, Alzheimer's disease, Parkinson's disease, global ischemia, ulcerative colitis, Crohn's disease, immune thrombocytopenic purpura, atherosclerosis, systemic lupus erythematosis, myelopreparation for autologous transplantation, transplant rejection, glomerulonephritis, interstitial nephritis, Lupus nephritis, tubular necrosis, diabetic nephropathy, renal hypertrophy, type I diabetes, acute pain, inflammatory pain, neuropathic pain, acute myeloid leukemia, melanoma, multiple myeloma, breast cancer, prostate cancer, pancreatic cancer, lung cancer, ovarian cancer, gliomas, glioblastoma, neurofibromatosis, osteolytic bone metastases, brain metasteses, gastrointestinal stromal tumors, and giant cell tumors.

    Abstract translation: 其化合物及其盐,其制剂,其缀合物,其衍生物,其形式及用途。 在某些方面和实施方案中,所述的化合物或其盐,其制剂,其缀合物,其衍生物,其形式在Fms,Kit,Flt3,TrkA,TrkB和TrkC激酶蛋白中的一种或多种上是有活性的。 还描述了其用于治疗疾病和病症的方法,包括与Fms,Kit,Flt3,TrkA,TrkB和TrkC中的一种或多种的活性相关的疾病和病症,包括类风湿性关节炎,骨关节炎,骨质疏松症,假体周围骨质溶解, 系统性硬化症,脱髓鞘疾病,多发性硬化症,Charcot玛丽牙综合征,肌萎缩性侧索硬化症,阿尔茨海默氏病,帕金森病,全球缺血,溃疡性结肠炎,克罗恩病,免疫性血小板减少性紫癜,动脉粥样硬化,系统性红斑狼疮,自体移植骨髓造血,移植排斥 肾小球肾炎,间质性肾炎,狼疮性肾炎,肾小管坏死,糖尿病性肾病,肾肥大,I型糖尿病,急性疼痛,炎性疼痛,神经性疼痛,急性骨髓性白血病,黑素瘤,多发性骨髓瘤,乳腺癌,前列腺癌,胰腺癌,肺癌 癌症,卵巢癌,神经胶质瘤,成胶质细胞瘤,神经 纤维瘤病,溶骨性骨转移,脑转移,胃肠道间质瘤和巨细胞瘤。

    METHOD FOR FABRICATING AN INTEGRATED CIRCUIT
    10.
    发明申请
    METHOD FOR FABRICATING AN INTEGRATED CIRCUIT 审中-公开
    制造集成电路的方法

    公开(公告)号:WO2011054560A1

    公开(公告)日:2011-05-12

    申请号:PCT/EP2010/062955

    申请日:2010-09-03

    CPC classification number: H01L21/28132 H01L21/26586 H01L29/66787

    Abstract: A method for fabrication of features of an integrated circuit and device thereof include patterning a first structure on a surface of a semiconductor device and forming spacers about a periphery of the first structure. An angled ion implantation is applied to the device such that the spacers have protected portions and unprotected portions from the angled ion implantation wherein the unprotected portions have an etch rate greater than an etch rate of the protected portions. The unprotected portions and the first structure are selectively removed with respect to the protected portions. A layer below the protected portions of the spacer is patterned to form integrated circuit features.

    Abstract translation: 一种用于制造集成电路的特征的方法及其装置包括在半导体器件的表面上形成第一结构并在第一结构的周围形成间隔物。 将角度离子注入施加到器件,使得间隔物具有来自成角度离子注入的保护部分和未保护部分,其中未保护部分具有大于被保护部分的蚀刻速率的蚀刻速率。 相对于受保护部分,非保护部分和第一结构被选择性地去除。 将间隔物的受保护部分下面的层图案化以形成集成电路特征。

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