Abstract:
A ceramic heater for heating the whole of a semiconductor wafer uniformly by supporting it stably without causing it to bend. The ceramic heater having a heating body on the surface of or inside a disk−shaped ceramic base and having through holes for passing lifter pins therethrough in the ceramic base is characterized in that the number of through holes is three or more, and the through holes are formed in an area at a distant from the center of the ceramic base, the distance being over 1/2 of the distance from the center of the ceramic base to the edge.
Abstract:
In a semiconductor device production/inspection step, it is possible to provide a ceramic joint body in which a ceramic substrate having an excellent corrosion resistance is firmly attached to a ceramic member such as a cylindrical member. The ceramic substrate has a conductive body inside. A ceramic member is attached to the bottom of the ceramic substrate. An area not having the conductive body exists at least at a part of an upper region of the joint boundary between the ceramic substrate and the ceramic member.
Abstract:
A ceramic bonded body and its manufacturing method and a ceramic structure for a semiconductor wafer are disclosed. The ceramic bonded body is used especially for a semiconductor manufacturing system and a semiconductor inspecting instrument such as a hot plate (ceramic heater), an electrostatic chuck, or a wafer prober and is produced by bonding the same or different kinds of ceramic bodies. The ceramic bonded body is characterized in that ceramic grown particles so grown as to invade ceramic bodies on both sides of the bond interface of the ceramic bodies are present at the interface and in that no concentration layer of sintering assistant is formed at the bond interface.
Abstract:
An optical waveguide optical module (100) in which a temperature control element (1) is supported through a pedestal (5) in a casing (11) and an optical waveguide element (12) is provided on the temperature control element (1). The optical waveguide optical module (100) having favorable demultiplexing wavelength characteristics is characterized in that it is composed of a platelike body (2) having a heat−generating body (3) or heat−absorbing body on the heated surface or inside, in that the total area of the contact portion of the pedestal (5) disposed in contact with the heated surface of the platelike body (2) to support it and the platelike body (2) including the contact portion in contact with the heat−generating body (3) or heat−absorbing body exceeds 30% of the area of the heated surface of the platelike body (2), and in that the sum of the surface roughnesses Ra1+Ra2 of the pedestal (5), the platelike body (2) in contact with the pedestal (5), and the heat−generating body (3) is 0.05 µm or more. A temperature control component for the waveguide optical module having a uniform in−plane temperature distribution and a temperature control element are also disclosed.
Abstract:
A waveguide type optical module comprises a temperature control element supported in a casing via a pedestal and an optical waveguide element provided on the temperature control element. The temperature control element has a heating body or a heat-absorbing body on a surface of or inside of a counter-heating surface side of a plate-like body. The plate-like body is supported so that the contact area with the pedestal is 30% or under. With this configuration, it is possible to provide the waveguide type optical module having excellent demultiplexing wavelength characteristic, and the temperature control component and the temperature control element for the waveguide type optical module producing less particles and having high uniformity in the in-plane temperature distribution.
Abstract:
A ceramic connection body effectively used for a semiconductor manufacturing and inspecting device including a hot plate, a method of connecting the ceramic bodies to each other, and a ceramic structural body, the ceramic connection body formed of ceramic bodies connected to each other wherein coarse pores having an average diameter larger than the average particle size of ceramic particles forming the ceramic body and 2000 μm or less are formed in a connection boundary surface between one ceramic body and the other ceramic body.
Abstract:
A ceramic heater comprising a resistance heating element provided inside a ceramic substrate, characterized in that the resistance heating element consists of conductive ceramics, and a sintering assistant−containing layer exists on at least the surface of the resistance heating element. This heater is free from cracks even when a rapid temperature rise is involved, effective in making heating uniform and accelerating a temperature rise rate, and used in industrial fields such as semiconductor production testing devices and optical devices that include electrostatic chucks and plasma generators.
Abstract:
A ceramic heater for a semiconductor manufacturing/inspecting apparatus which can realize a uniform distribution in temperature of a semiconductor wafer without the corrosion of an external terminal, wiring, etc. of a ceramic heater during the semiconductor manufacturing process. This ceramic heater has a resistance heating element inside a ceramic substrate which is characterized by exposing a power feed terminal outside a wafer heating region.