-
公开(公告)号：WO2017027202A9
公开(公告)日：2017-02-16
申请号：PCT/US2016/044068
申请日：2016-07-26
IPC分类号： H01L21/02 , H01L21/52 , H01L21/58 , H01L23/48 , H01L23/495
摘要： According to various embodiments, systems and methods for packaging a semiconductor device are provided. The disclosure discusses a semiconductor die having a top side and a bottom side that is disposed on a lead frame. An adhesive paste is then applied to attach the semiconductor die to the lead frame such that the adhesive paste fixes the die to a portion of the lead frame. The adhesive paste may be applied directly between die and the lead frame or may be applied in conjunction with a frame tape.
-
公开(公告)号：WO2017027202A1
公开(公告)日：2017-02-16
申请号：PCT/US2016/044068
申请日：2016-07-26
IPC分类号： H01L21/02 , H01L21/52 , H01L21/58 , H01L23/48 , H01L23/495
CPC分类号： H01L23/49513 , H01L21/4825 , H01L21/565 , H01L23/3107 , H01L23/3114 , H01L23/4951 , H01L23/4952 , H01L23/49558 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/83 , H01L2224/27003 , H01L2224/27334 , H01L2224/29013 , H01L2224/29014 , H01L2224/29082 , H01L2224/29099 , H01L2224/2919 , H01L2224/29294 , H01L2224/2939 , H01L2224/32245 , H01L2224/83191 , H01L2224/83868 , H01L2224/83871 , H01L2224/83874 , H01L2924/00014 , H01L2924/07802 , H01L2924/0781 , H01L2924/00012
摘要： According to various embodiments, systems and methods for packaging a semiconductor device are provided. The disclosure discusses a semiconductor die having a top side and a bottom side that is disposed on a lead frame. An adhesive paste is then applied to attach the semiconductor die to the lead frame such that the adhesive paste fixes the die to a portion of the lead frame. The adhesive paste may be applied directly between die and the lead frame or may be applied in conjunction with a frame tape.
摘要翻译： 根据各种实施例，提供了用于封装半导体器件的系统和方法。 本公开内容讨论了具有设置在引线框架上的顶侧和底侧的半导体管芯。 然后施加粘合剂膏以将半导体管芯附接到引线框架，使得粘合剂浆料将管芯固定到引线框架的一部分。 粘合剂糊剂可以直接施加在管芯和引线框架之间，或者可以与框架带一起使用。
-
搜索结果
2 条记录 (耗时 0.01 秒)
