公开(公告)号：WO2017030704A1

公开(公告)日：2017-02-23

申请号：PCT/US2016/042641

申请日：2016-07-15

Applicant: INTEL CORPORATION

Inventor： KRAJNIAK, Jan ,  DEPPISCH, Carl L. ,  MIRPURI, Kabirkumar J. ,  JIANG, Hongjin ,  HUA, Fay ,  WEI, Yuying ,  CANHAM, Beverly J. ,  LU, Jiongxin ,  RENAVIKAR, Mukul P.

IPC: H01L23/00 ,  H01L21/56 ,  H01L23/488

CPC classification number: H01L23/49833 ,  B23K1/0016 ,  B23K1/20 ,  B23K3/0623 ,  B23K35/025 ,  B23K35/262 ,  B23K35/264 ,  B23K35/3006 ,  B23K35/302 ,  B23K35/3613 ,  H01L21/4853 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/81 ,  H01L2224/10126 ,  H01L2224/11334 ,  H01L2224/11848 ,  H01L2224/11849 ,  H01L2224/13005 ,  H01L2224/13014 ,  H01L2224/13016 ,  H01L2224/13017 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/1339 ,  H01L2224/13565 ,  H01L2224/136 ,  H01L2224/1369 ,  H01L2224/1601 ,  H01L2224/16058 ,  H01L2224/16227 ,  H01L2224/8102 ,  H01L2224/81594 ,  H01L2224/816 ,  H01L2224/81611 ,  H01L2224/8169 ,  H01L2224/81815 ,  H01L2224/81862 ,  H01L2924/1511 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/20104 ,  H01L2924/20105 ,  H01L2924/20106 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  H05K1/141 ,  H05K3/363 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/01083 ,  H01L2924/01028 ,  H01L2924/01025 ,  H01L2924/01049 ,  H01L2924/01051 ,  H01L2924/01038 ,  H01L2924/01024 ,  H01L2924/01022 ,  H01L2924/05341 ,  H01L2924/0665 ,  H01L2924/00012

Abstract: Embodiments herein may relate to a patch on interposer (PoINT) architecture. In embodiments, the PoINT architecture may include a plurality of solder joints between a patch and an interposer. The solder joints may include a relatively high temperature solder ball and a relatively low temperature solder paste that at least partially surrounds the solder ball. Other embodiments may be described and/or claimed.

Abstract translation: 这里的实施例可以涉及内插器（PoINT）架构上的补丁。 在实施例中，PoINT架构可以包括贴片和插入器之间的多个焊接点。 焊点可以包括相对高温的焊球和至少部分地围绕焊料球的相对低温的焊膏。 可以描述和/或要求保护其他实施例。