Abstract:
An integrated circuit die includes conductive connection sites located at least on a surface of the integrated circuit die within a contiguous region thereof. The integrated circuit also includes a core circuit located outside the contiguous region. The core circuit is coupled to at least one of the connection sites.
Abstract:
The disclosed embodiments provide a dynamic memory device, comprising a set of dynamic memory cells and a set of replacement dynamic memory cells. The set of replacement dynamic memory cells includes data cells which contain replacement data bits for predetermined faulty cells in the set of dynamic memory cells, and address cells which contain address bits identifying the faulty cells, wherein each data cell is associated with a group of address cells that identify an associated faulty cell in the set of dynamic memory cells. The dynamic memory device also includes a remapping circuit, which remaps a faulty cell in the set of dynamic memory cells to an associated replacement cell in the set of replacement cells.
Abstract:
A method and apparatus for testing and characterizing circuits is provided. In one embodiment, a high-speed interface of a semiconductor component includes high-speed test circuitry. The high-speed test circuitry obviates the need for an external high-speed testing system for testing and characterization. In one embodiment, the high-speed test circuitry includes a test pattern generation circuit, and various differential comparators to compare low bandwidth reference signals with interface signals during testing and characterization. In one embodiment, an interface that includes the test circuitry can test itself or another interface. In one embodiment, a timing reference signal decouples the individual parameters of two interfaces testing each other to avoid any errors introduced by the combination of individual interface circuit parameters, such as receiver parameters and transmitter parameters. The testing can be performed at the wafer stage, at the component stage, and in a system.
Abstract:
Described are methods, devices, and systems to provide enhanced wireless coverage for wireless mobile stations by facilitating centralized authentication for a variety of unrelated networks. The mobile stations can then access Internet and telephony resources via the various networks for improved coverage and bandwidth. Some embodiments support the extension of network coverage using wireless-access points that can be partitioned into multiple virtual access points, one associated with an enterprise and another with an overlay network that facilitates mobile communication over multiple networks. One physical access point can support an enterprise network using one virtual access point and the overlay network using another. Users unaffiliated with an enterprise can access the overlay network via the enterprise's physical access point without gaining access to the enterprise network.
Abstract:
Described are mobile phones that incorporate radiation detectors formed using commonly available semiconductor memories. The radiation detectors require little or no additional hardware over what is available in a conventional phone, and can thus be integrated with little expense or packaging modifications. The low cost supports a broad distribution of detectors. Data collected from constellations of detector-equipped mobile phones can be used to locate mislaid or stolen nuclear materials or other potentially dangerous radiation sources. Phone users can be alerted to radiation dangers in their vicinity, and aggregated phone- specific error data can serve as user-specific dosimeters.
Abstract:
A memory module includes a plurality of signal paths that provide data to a memory module connector interface from a plurality of respective integrated circuit buffer devices that access data from an associated plurality of integrated circuit memory devices. The memory module forms a plurality of "data slices" or a plurality of portions of the memory module data bus that is coupled to the respective integrated circuit buffer devices. Each integrated circuit buffer device is also coupled to a bus that provides control information that specifies an access to at least one integrated circuit memory devices. According to an embodiment, a SPD device stores information regarding configuration information of the memory module. In embodiments, at least one integrated circuit buffer devices access information stored in the SPD device. In a package embodiment, a package houses an integrated circuit buffer die and a plurality of integrated circuit memory dies.
Abstract:
Memory controllers, devices, modules, systems and associated methods are disclosed. In one embodiment, a memory module includes a pin interface for coupling to a memory controller via a bus. The module includes at least two non-volatile memory devices, and a buffer disposed between the pin interface and the at least two non-volatile memory devices. The buffer receives non-volatile memory access commands from the memory controller that are interleaved with DRAM memory module access commands.
Abstract:
Various module structures are disclosed which may be used to implement modules having (1) to (N) channels. Bus systems may be formed by the interconnection of such modules.
Abstract:
The embodiments described herein describe technologies for non-volatile memory persistence in a multi-tiered memory system including two or more memory technologies for volatile memory and non-volatile memory, wherein the first memory device is volatile memory and the second memory device is non-volatile memory; and a control element coupled to the first memory device and the second memory device, the control element to: capture a base image of data stored in the first memory device; store the base image of data in the second memory device; capture incremental updates to the data stored in the first memory device; update the base image stored in the second memory device with the incremental updates; and in response to loss of power to the non-volatile memory module, restore the base image and any incremental updates to the first memory device.