公开(公告)号：WO2010107851A2

公开(公告)日：2010-09-23

申请号：PCT/US2010/027560

申请日：2010-03-17

Applicant: SUSS MICROTEC, INC. ,  MOORE, John ,  HERMANOWSKI, James

Inventor： MOORE, John ,  HERMANOWSKI, James

IPC: H01L23/12 ,  B81C1/00

CPC classification number: B29C35/08 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/544 ,  H01L2221/68327 ,  H01L2221/6834 ,  H01L2221/68381 ,  H01L2223/54426 ,  H01L2223/54453 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A method for fabricating a rigid temporary support used for supporting inorganic substrates during processing includes providing an inorganic substrate comprising a first surface to be processed and a second surface opposite to the first surface. Next, applying a liquid layer to the second surface of the inorganic substrate and then curing the applied liquid layer and thereby forming a rigid temporary support attached to the second surface of the inorganic substrate. Next, processing the first surface of the inorganic substrate while supporting the inorganic substrate upon the rigid temporary support. The curing includes first exposing the applied liquid layer to ultraviolet (UV) radiation and then performing a post exposure bake (PEB) at a temperature sufficient to complete the curing of the applied liquid layer and to promote outgassing of substances.

Abstract translation: 制造用于在加工过程中支撑无机基材的刚性临时载体的方法包括提供包括第一待加工表面和与第一表面相对的第二表面的无机基材。 接下来，将液体层施加到无机基板的第二表面，然后固化所施加的液体层，从而形成附着到无机基板的第二表面的刚性临时支撑。 接下来，在刚性临时支撑件上支撑无机基板的同时处理无机基板的第一表面。 固化包括首先将施加的液体层暴露于紫外线（UV）辐射，然后在足以完成施加的液体层的固化并促进物质的除气的温度下进行后曝光烘烤（PEB）。

公开(公告)号：WO2011079170A2

公开(公告)日：2011-06-30

申请号：PCT/US2010/061725

申请日：2010-12-22

Applicant: SUSS MICROTEC, INC., ,  HERMANOWSKI, James

Inventor： HERMANOWSKI, James

IPC: H01L21/683 ,  H01L21/304

CPC classification number: H01L21/67745 ,  H01L21/67132 ,  H01L21/6719 ,  H01L21/67207 ,  H01L21/67748 ,  H01L21/6836 ,  H01L21/6838 ,  H01L21/68742 ,  H01L2221/68318 ,  H01L2221/68331 ,  H01L2924/30105 ,  Y10T156/1132 ,  Y10T156/15 ,  Y10T156/1944

Abstract: An improved apparatus for debonding temporary bonded wafers includes a debonder, a cleaning module and a taping module. A vacuum chuck is used in the debonder for holding the debonded thinned wafer and remains with the thinned debonded wafer during the follow up processes steps of cleaning and mounting onto a dicing tape. In one embodiment the debonded thinned wafer remains onto the vacuum chuck and is moved with the vacuum chuck into the cleaning module and then the taping module. In another embodiment the debonded thinned wafer remains onto the vacuum chuck and first the cleaning module moves over the thinned wafer to clean the wafer and then the taping module moves over the thinned wafer to mount a dicing tape onto the wafer.

Abstract translation: 用于剥离临时粘合晶片的改进的装置包括剥离器，清洁模块和胶带模块。 在脱粘器中使用真空吸盘来保持脱粘的薄化晶片，并且在清洁和安装到切割带上的后续处理步骤期间保持与变薄的脱粘晶片。 在一个实施例中，剥离的薄化晶片保留在真空卡盘上，并且随着真空卡盘移动到清洁模块中，然后移动到胶带模块。 在另一个实施例中，脱粘的薄化晶片保留在真空卡盘上，并且首先清洁模块在薄的晶片上移动以清洁晶片，然后胶带模块在薄的晶片上移动以将切割带安装到晶片上。

公开(公告)号：WO2010121068A3

公开(公告)日：2010-10-21

申请号：PCT/US2010/031302

申请日：2010-04-15

Applicant: SUSS MICROTEC, INC.

Inventor： GEORGE, Gregory ,  JOHNSON, Hale ,  GORUN, Patrick ,  HUGHLETT, Emmett ,  HERMANOWSKI, James ,  STILES, Matthew ,  KUHNLE, Michael ,  PATRICIO, Dennis

IPC: H01L21/68

Abstract: An improved apparatus for temporary wafer bonding includes a temporary bonder cluster and a debonder cluster. The temporary bonder cluster includes temporary bonder modules that perform electronic wafer bonding processes including adhesive layer bonding, combination of an adhesive layer with a release layer bonding and a combination of a UV-light curable adhesive layer with a laser absorbing release layer bonding. The debonder cluster includes a thermal slide debonder, a mechanical debonder and a radiation debonder.

公开(公告)号：WO2012167041A2

公开(公告)日：2012-12-06

申请号：PCT/US2012/040411

申请日：2012-06-01

Applicant: NATHANIEL GROUP, INC. ,  COGGER, Jeffrey ,  HERMANOWSKI, James ,  MELNICK, Joel

Inventor： COGGER, Jeffrey ,  HERMANOWSKI, James ,  MELNICK, Joel

IPC: G02B21/06 ,  G02B23/24 ,  G02B27/10 ,  A61B1/06

CPC classification number: G02B27/149 ,  A61B1/043 ,  A61B1/063 ,  A61B1/0638 ,  A61B1/0669 ,  G02B21/06 ,  G02B23/2461 ,  G02B27/10 ,  G02B27/1006 ,  G02B27/126 ,  G02B27/145

Abstract: Systems for providing high-intensity and high-quality illumination and other electromagnetic radiation (EMR) to target regions. The systems each include multiple EMR sources and a radiation combiner for combining the output radiation of the multiple sources. In some examples, the EMR sources are visible light sources, such as light-emitting diodes and laser diodes. In some of those examples, the light sources are of differing colors that are combined to form output illumination having user-selected qualities, such as color and intensity. The output of the radiation combiner can be directed into an optical fiber or bundle of optical fibers for remote delivery of the output to a target, such as in endoscopy and remote-illumination microscopy. Systems disclosed can also include additional EMR beams, such as visible light beams used for pointing/targeting and non-visible beams used, for example, for heating and fluoroscopic excitation of dyes/stains, among other things.

Abstract translation: 向目标地区提供高强度和高质量照明等电磁辐射（EMR）系统。 这些系统各自包括多个EMR源和用于组合多个源的输出辐射的辐射组合器。 在一些示例中，EMR源是可见光源，例如发光二极管和激光二极管。 在这些示例中的一些示例中，光源具有不同的颜色，其被组合以形成具有用户选择的质量（例如颜色和强度）的输出照明。 辐射组合器的输出可以被引导到光纤或光纤束中，用于将输出远程传送到目标，例如在内窥镜和远程照明显微镜中。 所公开的系统还可以包括附加的EMR光束，例如用于指向/瞄准的可见光束和所使用的不可见光束，例如用于染料/污渍的加热和透视激发等。