Abstract:
So as to simplify and improve flexibility of multiple step substrate vacuum processing a loadlock- and processing tower LLPTl comprises a loadlock arrangement LLA as well as a processing arrangement PMA. The loadlock arrangement LLA communicates on the one hand with an outside atmosphere AT and on the other hand with a vacuum atmosphere V in a transport arrangement TA. Handling of substrates between process module arrangement PMA and transport arrangement TA is performed via openings.
Abstract:
L'invention concerne un dispositif de support (100) pour le chargement de plaques ou substrats dans un four de traitement thermique (200), Ie dispositif comprenant un manche et une partie de chargement destinée à supporter les substrats ou plaques à l'intérieur du four. Le dispositif comprend au moins des premier et deuxième éléments de structure (110, 120) en matériau composite thermostructural, le premier élément (110) formant le manche du dispositif tandis que le deuxième élément (120) forme la partie de chargement dudit dispositif. Les premier et deuxième éléments (110, 120) sont assemblés entre eux par un système de fixation démontable (160). Un ou plusieurs éléments unitaires (130) peuvent en outre être ajoutés afin d'allonger le dispositif de support.
Abstract:
Methods are generally provided for forming a conductive oxide layer on a substrate by sputtering a target to deposit a transparent conductive oxide layer (e.g., comprising comprises cadmium, tin, and oxygen) on the substrate; positioning an anneal surface in close proximity to the transparent conductive oxide layer (e.g., about 3 cm or less); and, annealing the transparent conductive oxide layer while the anneal surface is in close proximity to the transparent conductive oxide layer (e.g., at an anneal temperature of about 500 C to about 700 C) to create a localized cadmium vapor between the transparent conductive oxide layer and the anneal surface. The anneal surface can include a material reactive with oxygen at the anneal temperature. Apparatus is also provided for annealing a thin film layer on a substrate.
Abstract:
A new class of work-piece conveyors, comprising zero-mass, shadow-less transport systems, with a drive having a pair of parallel, laterally spaced, movable chains defining a processing path, with fingers projecting transversely toward the process path centerline. The gap between fingers eliminates conveyor tube/rod supports, improving wafer quality and conserving energy. Implementations include wire chain, band and roller chain transports to which fingers are secured. Fingers are angled down so that the intersection of the bottom and side edges of the work-piece make only point contacts with each finger. A pair of finger chains implement a single lane drive; adding center bilateral finger drive chains with oppositely pointing fingers implement a multi-lane system. The inventive method includes individually configurable processing temperature profiles in side-by-side lanes, on a zone-by-zone, upper and lower half basis for broad processing flexibility. A novel transducer-based lamp-voltage control system provides stable lamp power for precise temperature control.
Abstract:
L'invention concerne un dispositif et un procédé pour recristalliser une plaquette de silicium ou une plaquette comportant au moins une couche de silicium. La plaquette de silicium ou la au moins une couche de silicium de la plaquette est totalement fondue.
Abstract:
본 발명의 일 실시예에 의하면, 기판 처리장치는, 일측에 형성된 통로를 통해 기판이 이송되며, 상부 및 하부가 개방된 챔버본체; 상기 챔버본체의 상부에 설치되어 상기 기판에 대한 공정이 이루어지는 공정공간을 제공하며, 하부가 개방된 형상을 가지는 내부반응튜브; 상기 챔버의 개방된 하부에 배치되어 상기 통로를 통해 이송된 상기 기판을 상하방향을 따라 적재하는 적재위치 및 상기 공정공간을 향해 상승하여 적재된 상기 기판에 대한 공정이 이루어지는 공정위치로 전환가능한 기판홀더; 상기 기판홀더의 하부에 연결되어 상기 기판홀더와 함께 승강하며, 상기 공정위치에서 상기 내부반응튜브의 개방된 하부를 폐쇄하는 차단플레이트; 상기 차단플레이트의 하부에 기립설치되어 상기 차단플레이트와 함께 승강하는 연결실린더; 상기 챔버본체의 개방된 하부면과 상기 연결실린더 사이에 연결되며, 개방된 상기 챔버본체의 하부를 외부로부터 격리하는 차단부재를 포함한다.
Abstract:
Methods are generally provided for forming a conductive oxide layer on a substrate by sputtering a target to deposit a transparent conductive oxide layer (e.g., comprising comprises cadmium, tin, and oxygen) on the substrate; positioning an anneal surface in close proximity to the transparent conductive oxide layer (e.g., about 3 cm or less); and, annealing the transparent conductive oxide layer while the anneal surface is in close proximity to the transparent conductive oxide layer (e.g., at an anneal temperature of about 500 C to about 700 C) to create a localized cadmium vapor between the transparent conductive oxide layer and the anneal surface. The anneal surface can include a material reactive with oxygen at the anneal temperature. Apparatus is also provided for annealing a thin film layer on a substrate.
Abstract:
A structural member for use in extremely high temperature environments that has substantially flat exterior for resting on a flat surface. The substantially flat exterior of the structural member has a low angle chamfer that is preferably less than 45 degrees and that rises far enough above the flat surface so that when the edge is rolled using conventional processing methods, the resulting high point does not extend a distance far enough to contact with the surface.