Abstract:
An integrated circuit with Built-in Self Test (BiST) is described. The integrated circuit includes a signal generator used to perform a BiST on the integrated circuit. The integrated circuit also includes a local oscillator used by the signal generator to generate one or more test signals used to perform the BiST on the integrated circuit.
Abstract:
In an example implementation, an integrated circuit (IC) (102) includes: a plurality of transistors (122) disposed in a plurality of locations (120) on a die of the IC; conductors (124) coupled to terminals of each of the plurality of transistors; a digital-to-analog converter (DAC) (108), coupled to the conductors, to drive voltage signals to the plurality of transistors in response to a digital input; and an analog-to-digital converter (ADC) (110), coupled to at least a portion of the conductors, to generate samples in response to current signals induced in the plurality of transistors in response to the voltage signals, the samples being indicative of at least one electrostatic characteristic for the plurality of transistors.
Abstract:
Systems, methods and devices which utilize Spread Spectrum Time Domain Reflectometry (SSTDR) techniques to measure degradation of electronic components are provided. Such measurements may be implemented while the components "live" or otherwise functioning within an overall system. In one embodiment, monitoring a power converter in a high power system is accomplished. In this embodiment, degradation of components within the power converter (e.g. metal-oxide-semiconductor field-effect transistors (MOSFETs), capacitors, insulated-gate bipolar transistors (IGBTs), and the like) may be monitored by processing data from reflections of an SSTDR signal to determine changes in impedance, capacitance, or any other changes that may be characteristic of components degrading. For example, an aging MOSFET may experience an increase of drain to source resistance which adds additional resistance to a current path within a power converter. Such a change is able to be analyzed monitored upon processing the reflected test signals.
Abstract:
A manufacturing test and programming system (100) is presented including providing a PCB tester (108), providing an in-system programmer (102) electrically attached to the PCB tester (108), mounting a device under test (114) having a programmable device (116) attached thereon and programming the programmable device (116) with the in-system programmer (102).
Abstract:
A device (10) for measuring an impedance (Z2) between first and second nodes (22, 24) in an electrical circuit (18) without removing components includes at least one current source (62 and/or 66) to provide first and second currents or current signals (i0, i1) of known values. First and second probes (30, 34) contact the respective first and second nodes to apply the first and second currents. A third common probe (46) contacts the circuit at a common node (50) that experiences the same current flow as between the first and second nodes. At least one voltage meter (70 and/or 74) measures voltages (V00, V01, V11 and V10) corresponding to the first and second currents. A processor (100) calculates the impedance based on the known values of the currents, and the measured values of the voltages.
Abstract:
A device (10) for measuring an impedance (Z 2 ) between first and second nodes (22, 24) in an electrical circuit (18) without removing components includes at least one current source (62 and/or 66) to provide first and second currents or current signals (i 0 , i 1 ) of known values. First and second probes (30, 34) contact the respective first and second nodes to apply the first and second currents. A third common probe (46) contacts the circuit at a common node (50) that experiences the same current flow as between the first and second nodes. At least one voltage meter (70 and/or 74) measures voltages (V 00 , V 01 , V 11 and V 10 ) corresponding to the first and second currents. A processor (100) calculates the impedance based on the known values of the currents, and the measured values of the voltages.
Abstract:
A device (10) for measuring an impedance (Z2) of a discrete component (14) coupled in an electrical circuit (18) at first and second nodes (22, 24) includes at least one current source (62 and/or 66) to provide first and second currents or current signals (i0, i1) of known values. First and second probes (30, 34) contact the respective first and second nodes to apply the first and second currents. A third common probe (46) contacts the circuit at a common location (50) different from the first and second nodes. At least one voltage meter (70 and/or 74) measures voltages (V00, V01, V11 and V10) corresponding to the first and second currents. A signal processor (100) may separate the voltages from each other.
Abstract:
Systems, methods, and devices for monitoring one or more capacitor banks are presented herein. One concept of the present disclosure is directed to a method of monitoring at least one capacitor bank having a plurality of steps. The method includes: receiving measurements indicative of voltages and/or currents on electrical lines coupled to the steps of the capacitor bank by corresponding contactors; receiving information indicative of the respective statuses of the contactors; timestamping the measurements and contactor status information; storing the timestamped measurements with corresponding timestamped contactor status information; determining a rate of change of a parameter indicative of or derived from at least the measurements associated with at least one of the steps in the capacitor bank; comparing the determined rate of change with a baseline rate of change to produce a deviation; determining if the deviation satisfies a criterion; and, if so, indicating the deviation satisfied the criterion.
Abstract:
A manufacturing test and programming system (100) is presented including providing a PCB tester (108), providing an in-system programmer (102) electrically attached to the PCB tester (108), mounting a device under test (114) having a programmable device (116) attached thereon and programming the programmable device (116) with the in-system programmer (102).