公开(公告)号：WO2011079918A2

公开(公告)日：2011-07-07

申请号：PCT/EP2010007736

申请日：2010-12-17

Applicant: SCHWEIZER ELECTRONIC AG ,  GOTTWALD THOMAS ,  NEUMANN ALEXANDER

Inventor： GOTTWALD THOMAS ,  NEUMANN ALEXANDER

IPC: H05K3/46 ,  H01L21/48

CPC classification number: H05K1/186 ,  H01L21/4846 ,  H01L21/486 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3107 ,  H01L23/5389 ,  H01L24/11 ,  H01L24/13 ,  H01L24/19 ,  H01L24/20 ,  H01L2221/68304 ,  H01L2221/68327 ,  H01L2221/6835 ,  H01L2221/68363 ,  H01L2221/68381 ,  H01L2224/1134 ,  H01L2224/12105 ,  H01L2224/13144 ,  H01L2224/16225 ,  H01L2224/2101 ,  H01L2224/211 ,  H01L2224/214 ,  H01L2224/2201 ,  H01L2224/221 ,  H01L2224/224 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/9202 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01044 ,  H01L2924/01047 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H05K1/189 ,  H05K3/205 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/0367 ,  H05K2201/10977 ,  H05K2203/063 ,  H05K2203/1469 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/83851

Abstract: The present invention relates to a method for producing a conductor structural element, comprising the following steps: providing a rigid substrate (12), electrodepositing a copper coating (14) on the rigid substrate (12), applying a conductor pattern structure (16) to the copper coating (14), then possibly mounting components, laminating the substrate with at least one electrically insulating layer (24, 28), detaching the rigid substrate (12), at least partially removing the remaining copper coating (14) of the rigid substrate (12) in such a way that the conductor pattern structure (16, 14, 42) is exposed.

Abstract translation: 本发明涉及一种用于制造导体结构元件，其包括以下步骤： - 提供一个刚性载体（12）， - 电沉积在刚性支撑体（12）一个铜涂层（14）， - 在铜涂层上施加导体图案结构（16） （14），随后是任何元件放置， - 层压载体与至少一个电绝缘层（24，28）， - 汽提所述刚性支承件（12）的， - 至少部分地去除所述刚性支承件的剩余铜涂层（14）根据（12） 使得图案结构（16,14,42）的曝光发生。