公开(公告)号：WO2006048846A3

公开(公告)日：2006-09-21

申请号：PCT/IB2005053625

申请日：2005-11-04

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  WYLAND CHRIS

Inventor： WYLAND CHRIS

IPC: H01L21/60 ,  H01L21/58 ,  H01L23/495

CPC classification number: H01L24/81 ,  B82Y10/00 ,  H01L23/49513 ,  H01L24/11 ,  H01L24/12 ,  H01L24/16 ,  H01L24/32 ,  H01L24/48 ,  H01L24/83 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Conductive connections between components of an integrated circuit package are made, wherein carbon nanotubes (130, 430) extend from a surface of a first integrated circuit package component (120, 410) and distal ends of the carbon nanotubes are embedded in a connector (422) at a second integrated circuit package component (110, 420). The embedding approach involves, e.g., physical coupling (i.e., pressing) of the carbon nanotubes and the connector together. This approach is applicable to coupling a variety of components together, such as integrated circuit dies (flip chip (120) and conventional (420) to package substrates (110, 410) and/or leadframes (410).

Abstract translation: 制造集成电路封装的部件之间的导电连接，其中碳纳米管（130,430）从第一集成电路封装部件（120,410）的表面延伸，并且碳纳米管的远端嵌入连接器（422） ）在第二集成电路封装部件（110,420）处。 嵌入方法涉及例如将碳纳米管和连接器物理耦合（即压制）在一起。 该方法适用于将各种组件（例如集成电路管芯（倒装芯片（120））和常规（420）耦合到封装衬底（110,410）和/或引线框架（410）。

公开(公告)号：WO2006048843A3

公开(公告)日：2006-10-12

申请号：PCT/IB2005053622

申请日：2005-11-04

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  WYLAND CHRIS

Inventor： WYLAND CHRIS

IPC: H01L23/373 ,  H01L23/538

CPC classification number: H05K1/056 ,  B82Y10/00 ,  H01L23/14 ,  H01L23/3128 ,  H01L23/373 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H05K1/0206 ,  H05K2201/026 ,  H05K2201/0323 ,  Y10T29/49117 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Carbon nanotube material is used in an integrated circuit substrate. According to an example embodiment, an integrated circuit arrangement (100) includes a substrate (110) with a carbon nanotube structure (120) therein. The carbon nanotube structure is arranged in one or more of a variety of manners to provide structural support and/or thermal conductivity. In some instances, the carbon nanotube structure is arranged to provide substantially all structural support for an integrated circuit arrangement. In other instances, the carbon nanotube structure is arranged to dissipate heat throughout the substrate. In still other instances, the carbon nanotube structure is arranged to remove heat from selected portions of the carbon nanotube substrate.

Abstract translation: 碳纳米管材料用于集成电路基板。 根据示例性实施例，集成电路装置（100）包括其中具有碳纳米管结构（120）的衬底（110）。 碳纳米管结构以各种方式中的一种或多种配置以提供结构支持和/或导热性。 在一些情况下，碳纳米管结构被布置成为集成电路装置提供基本上所有的结构支撑。 在其他情况下，碳纳米管结构被布置成在整个基板上散热。 在其他情况下，碳纳米管结构被布置成从碳纳米管基底的选定部分去除热量。

公开(公告)号：WO2006103620A3

公开(公告)日：2007-01-11

申请号：PCT/IB2006050929

申请日：2006-03-27

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  WYLAND CHRIS

Inventor： WYLAND CHRIS

IPC: H01L23/485 ,  H01L23/522

CPC classification number: H01L24/05 ,  H01L23/5226 ,  H01L23/53276 ,  H01L24/03 ,  H01L24/48 ,  H01L2224/04042 ,  H01L2224/05093 ,  H01L2224/05096 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/45015 ,  H01L2224/48463 ,  H01L2224/859 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/05042 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/1305 ,  H01L2924/1306 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/19043 ,  H01L2924/20752 ,  H01L2924/20753 ,  H01L2924/20755 ,  Y10S977/742 ,  Y10S977/932 ,  H01L2224/45099 ,  H01L2924/00

Abstract: A bond pad structure (300) for an integrated circuit (IC) device uses carbon nanotubes to increase the strength and resilience of wire bonds (360). In an example embodiment there is, a bond pad structure (300) on an IC substrate, the bond pad structure comprises, a first conductive layer (310) having a top surface and a bottom surface, the bottom surface attached to the IC substrate. A dielectric layer (320) is deposited on the top surface of the first conductive layer (310), the dielectric layer having an array of vias (325), the array of vias filled with a carbon nanotube material (325), the carbon nanotube material (325) is electrically coupled to the first conductive layer (310). There is a second conductive layer (330) having a top surface and a bottom surface, the bottom surface of the second conductive layer is electrically coupled to the carbon nanotube material (325). A feature of this embodiment may include the first (410,510) or second (430, 530) conductive layer being comprised of carbon nanotube material, as well.

Abstract translation: 用于集成电路（IC）器件的接合焊盘结构（300）使用碳纳米管来增加引线键合的强度和弹性（360）。 在一个示例性实施例中，在IC衬底上存在接合焊盘结构（300），所述接合焊盘结构包括具有顶表面和底表面的第一导电层（310），所述底表面附接到所述IC衬底。 介电层（320）沉积在第一导电层（310）的顶表面上，介电层具有通孔阵列（325），填充有碳纳米管材料（325）的通孔阵列，碳纳米管 材料（325）电耦合到第一导电层（310）。 存在具有顶表面和底表面的第二导电层（330），第二导电层的底表面电耦合到碳纳米管材料（325）。 该实施例的特征还可以包括由碳纳米管材料构成的第一（410,510）或第二（430,530）导电层。

公开(公告)号：WO2007132432A3

公开(公告)日：2008-08-28

申请号：PCT/IB2007051864

申请日：2007-05-16

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  WYLAND CHRIS

Inventor： WYLAND CHRIS

IPC: H01L25/065

CPC classification number: H01L25/0657 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2225/0651 ,  H01L2225/06575 ,  H01L2924/01019 ,  H01L2924/10253 ,  H01L2924/00014 ,  H01L2924/00

Abstract: Stacked die arrangements are implemented using a variety of methods. Using one such method, a first (108) and second (104) die are bonded to a support structure (106) that substantially circumscribes an interface region (114). The interface region includes a material having a pliability that is consistent with the thermal coefficient of expansion of the dies and that is greater than the pliability of support structure (106).

Abstract translation: 使用各种方法实现堆叠管芯布置。 使用一种这样的方法，将第一（108）和第二（104）裸片结合到基本上限定界面区域（114）的支撑结构（106）。 界面区域包括具有与模具的热膨胀系数一致的柔韧性并且大于支撑结构（106）的柔韧性的材料。

公开(公告)号：WO2006048845A3

公开(公告)日：2006-08-03

申请号：PCT/IB2005053624

申请日：2005-11-04

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  WYLAND CHRIS

Inventor： WYLAND CHRIS

IPC: H01L23/495 ,  C01B31/02 ,  H01L21/60 ,  H01L23/498

CPC classification number: B82Y30/00 ,  B82Y10/00 ,  H01L23/49579 ,  H01L23/49877 ,  H01L24/48 ,  H01L24/81 ,  H01L2224/45193 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/81801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  Y10T29/49162 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: Electrical connection in an integrated circuit arrangement is facilitated with carbon nanotubes. According to various example embodiments, a carbon nanotube material (120, 135) is associated with another material (130, 125) such as a metal. The carbon nanotube material facilitates the electrical connection between different circuit components. Exemples include bond wires, leadframes and circuit board interconnects.

Abstract translation: 利用碳纳米管促进集成电路布置中的电连接。 根据各种示例性实施例，碳纳米管材料（120,135）与诸如金属的另一材料（130,125）相关联。 碳纳米管材料有助于不同电路部件之间的电连接。 示例包括接合线，引线框和电路板互连。

公开(公告)号：WO2004038795A3

公开(公告)日：2004-07-22

申请号：PCT/IB0304370

申请日：2003-10-04

Applicant: KONINKL PHILIPS ELECTRONICS NV ,  PHILIPS CORP

Inventor： WYLAND CHRIS

IPC: H01L23/31 ,  H01L23/367 ,  H01L23/433 ,  H01L23/498 ,  H01L23/373

CPC classification number: H01L23/49822 ,  H01L23/3733 ,  H01L23/3737 ,  H01L23/4334 ,  H01L24/32 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/32225 ,  H01L2224/45099 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/14 ,  H01L2924/15311 ,  H05K1/0203 ,  H05K1/0366 ,  H05K2201/0175 ,  Y10S428/901 ,  H01L2924/00 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A substrate material (130) for mounting an integrated circuit (100) contains a non-electrically-conductive mesh (135) of thermally-conductive material. Because the mesh is electrically-non-conductive, it can purposely be configured to contact any and all of the circuit traces (155) that are proximate to the substrate, thereby using the circuit traces (155) as thermally-coupled heat sinks. In a preferred embodiment, the thermally-conductive mesh (135) replaces the structural fiberglass mesh that is conventionally used in substrates, thereby allowing the mesh (135) to serve a dual structural and thermal function.

Abstract translation: 用于安装集成电路（100）的衬底材料（130）包含导热材料的非导电网（135）。 因为网状物是不导电的，所以它可以有目的地被配置为接触靠近基板的任何和全部电路迹线（155），由此使用电路迹线（155）作为热耦合散热片。 在一个优选的实施方案中，导热网（135）代替通常用于基材中的结构玻璃纤维网，由此允许网（135）提供双重结构和热功能。

公开(公告)号：WO2007069224A3

公开(公告)日：2007-11-15

申请号：PCT/IB2006054899

申请日：2006-12-15

Applicant: NXP BV ,  WYLAND CHRIS

Inventor： WYLAND CHRIS

IPC: H01L23/66 ,  H01P3/08 ,  H01Q15/00 ,  H05K1/02

CPC classification number: H01Q15/0086 ,  H01L23/64 ,  H01L2924/0002 ,  H01L2924/19051 ,  H01L2924/3011 ,  H05K1/0236 ,  H01L2924/00

Abstract: In enhancing signal quality through packages, meta-materials may be used. Meta-materials are designed to make the signal act in such a way as to make the shape of the signal behave as though the permittivity and permeability are different than the real permittivity and permeability of the insulator used. In an example embodiment, a substrate (10) is configured as a meta-material. The meta-material provides noise protection for a signal line (15) having a pre-determined length disposed on the meta-material. The substrate comprises a dielectric material (2, 4, 6) having a topside surface and an underside surface. A conductive material (30) is arranged into pre-determined shapes (35) having a collective length. Dielectric material envelops the conductive material and the conductive material is disposed at a first predetermined distance (55) from the topside surface and at a second predetermined distance from the underside surface. The collective length of the conductive material (30) is comparable to the pre-determined length of the signal line (15).

Abstract translation: 通过包装提高信号质量，可以使用超材料。 元材料被设计成使信号的作用方式使得信号的形状表现得如同介电常数和磁导率不同于使用的绝缘体的实际介电常数和磁导率。 在示例性实施例中，衬底（10）被配置为超常材料。 超临界材料为具有设置在超常材料上的预定长度的信号线（15）提供噪声保护。 衬底包括具有顶侧表面和下表面的电介质材料（2,4,6）。 导电材料（30）被布置成具有共同长度的预定形状（35）。 电介质材料包围导电材料，并且导电材料设置在与顶侧表面相距第一预定距离（55）处并且距离下表面第二预定距离。 导电材料（30）的总长度与信号线（15）的预定长度相当。