Abstract:
A method for patterning an article, the article comprising a first layer (14) of a first material, the method comprising providing a thread (20) carrying a first species, e.g. a solvent in which the first material is soluble, and contacting the thread with the first layer to remove at least part of the first layer. Apparatuses suitable for the method are also disclosed.
Abstract:
The present invention refers to a method for selectively structuring of a polymer matrix comprising CNT (carbon nano tubes) on a flexible plastic substructure. The method also includes a suitable etching composition, which allows to proceed the method in a mass production.
Abstract:
A method of removing portions of a conductive layer comprising a transparent conductive material (14) and/or a metallic material (115') disposed on a plastic substrate (12) used for capacitive touchscreen devices (10) includes providing a plastic substrate having a conductive layer disposed on a surface thereof and removing portions of the conductive layer at the surface of the plastic substrate to establish a pattern of electrically isolated conductive portions on the surface of the plastic substrate. The conductive portions or traces are electrically connected to a touchscreen controller (20), which is operable to determine a location of a touch or proximity of an object at or near the surface of the plastic substrate responsive to a detected change in capacitance. The removal process may comprise etching or laser ablating portions of the conductive layer at the surface of the plastic substrate.
Abstract:
A method of patterning the surface of a substrate with at least one organic semiconducting compound, comprising the steps of: (a) providing a stamp having a surface including a plurality of indentations formed therein defining an indentation pattern, said indentations being contiguous with a stamping surface and defining a stamping pattern, (b) coating said stamping surface with at least one compound (C1) capable of binding to the surface of the substrate and of binding at least one organic semiconducting compound (S), (c) contacting at least a portion of the surface of a substrate with said stamping surface to allow deposition of said compound (C1) on the substrate, (d) removing said stamping surface to provide a pattern of binding sites on the surface of the substrate, (e) applying a plurality of crystallites of the organic semiconducting compound (S) to the surface of the substrate to enable at least a portion of the applied crystallites to bind to at least a portion of the binding sites on the surface of the substrate.
Abstract:
A method for forming an electronic device, comprising: forming a first conductive or semiconductive layer; forming a sequence of at least one insulating layer and at least one semiconducting layer over the first conductive or semiconductive layer; locally depositing solvents at a localised region of the insulating layer so as to dissolve the sequence of insulating and semiconducting layers in the region to leave a void extending through the sequence of layers; and depositing conductive or semiconductive material in the void.
Abstract:
The disclosure relates to a method and apparatus for micro-patterning organic layers of OLEDs. The disclosed methods do not require applying pressure to the film, nor do they require heat treatment, surface treatment or fast release rate of a stamp from the substrate. The disclosed methods are particularly advantageous over the conventional shadow masking techniques for providing large array fabrication with small features. In one embodiment of the disclosure, one or more organic films are selected for the OLED as a function of their individual or combined sublimation temperature. The material is selected in view of the depth and shape of the features that are to be formed in the organic layer. The disclosed embodiments can provide minimum feature size of 13 µm which is suitable for high resolution OLED displays.