Abstract:
The present invention relates to a method, device, and system for improved mapping and/or ablation of a tissue. The device may generally include an elongate body and a distal assembly affixed to the elongate body that includes a treatment electrode having a conductive mapping region and a selectively conductive ablation region that is conductive of high-frequency current and substantially non-conductive of low-frequency current. Alternatively, the device may generally include a treatment electrode having a conductive mapping or ablation region and a region that is coated with an electrically insulated but thermally conductive layer.
Abstract:
Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.
Abstract:
Systems and methods relating to integration of circuitry including a transmitter or transceiver component into energy storage devices, such as battery packs for portable electronic equipment. Fiulher embodiments also relate to providing a tuned miniature antenna and/or encapsulating such antenna inside the energy storage device.
Abstract:
A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.
Abstract:
A device and system for mapping and/or ablation wherein conductive portions of the electrodes and insulated portions of the electrode are composed of the same material. The system may generally include a medical device coupled to a console, the device including a distal assembly positionable at or near a target tissue region. The distal assembly may include one or more electrodes that include an integrated electrode head and electrode wire. The wire may be insulated by an oxidized layer. Alternatively, the distal assembly may include a plurality of protruding circumferential electrodes that are spaced apart by substantially insulated portions. The electrodes and insulated portions may be composed of the same material, with the insulated portions including an oxidized layer on an external surface.
Abstract:
Systems and methods relating to integration of circuitry including a transmitter or transceiver component into energy storage devices, such as battery packs for portable electronic equipment. Fiulher embodiments also relate to providing a tuned miniature antenna and/or encapsulating such antenna inside the energy storage device.
Abstract:
A sensor assembly is disclosed that includes a hollow casing having a radiation entrance opening. A radiation-transmissive optic is at the radiation entrance opening. A substrate is inside and sealed against the hollow casing. An optical sensing element is coupled to the substrate and configured to sense radiation that has passed through the radiation-transmissive optic. A method of manufacturing the sensor assembly also is disclosed.
Abstract:
Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.
Abstract:
Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.
Abstract:
Embodiments in accordance with the present invention encompass polymer compositions that are useful in the assembly of microelectronic components onto a variety of substrate materials. Such polymer compositions providing for both holding the microelectronic components at desired positions on a substrate, providing fluxing for the solder bonding of such components to the substrate and remaining in place as an underfill for such components.