公开(公告)号：WO01009944A1

公开(公告)日：2001-02-08

申请号：PCT/FR2000/002065

申请日：2000-07-18

IPC分类号： H01L21/768 ,  H01L23/48 ,  H05K1/03 ,  H05K3/00 ,  H05K3/04 ,  H05K3/40 ,  H05K3/46

CPC分类号： H01L21/76898 ,  H01L23/481 ,  H01L2224/0557 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K3/0094 ,  H05K3/045 ,  H05K3/4076 ,  H05K3/4608 ,  H05K2201/0959 ,  H05K2203/025 ,  H05K2203/1338 ,  H01L2224/05552

摘要： The invention concerns a method for producing conductive via-connections in a substrate and substrates equipped with such connections. The method for producing conductive via-connections between the front face (2) and the rear face (3) of a substrate consists in: producing in the substrate (1) on the side of the rear face (3), cavities (5) with predetermined depth and cross-section for defining pads (4) with specific cross-section designed to ensure electrical conduction between the two faces (2, 3) and filling up the cavities (5) with a dielectric material (7). The substrate is equipped with conductive via-connections between its front face (2) and its rear face (3). The conductive connections are provided by the pads (4) defined by the cavities (5) filled with a dielectric material (7). The invention is particularly applicable to substrates used for making microsensors.

摘要翻译： 本发明涉及一种用于在衬底中制造导电通孔连接的方法和配备有这种连接的衬底。 用于在基板的前表面（2）和背面（3）之间产生导电通孔连接的方法包括：在背面（3）侧的基板（1）中产生空腔（5） 具有预定的深度和横截面，用于限定具有设计成确保两个面（2,3）之间的电传导并用电介质材料（7）填充空腔（5））的特定横截面的焊盘（4）。 基板在其前表面（2）和其后表面（3）之间配备有导电通孔连接。 导电连接由由填充有介电材料（7）的空腔（5）限定的焊盘（4）提供。 本发明特别适用于制造微型传感器的基板。

公开(公告)号：WO2017044736A1

公开(公告)日：2017-03-16

申请号：PCT/US2016/050935

申请日：2016-09-09

申请人： AHMAD, Syed, Taymur ,  ACTON, Bruce

发明人： AHMAD, Syed, Taymur ,  ACTON, Bruce

IPC分类号： H05K3/28

CPC分类号： C09D183/04 ,  C09D133/16 ,  H01R12/716 ,  H05K1/0353 ,  H05K3/282 ,  H05K3/284 ,  H05K3/285 ,  H05K3/40 ,  H05K7/1427 ,  H05K2201/0162 ,  H05K2201/0187 ,  H05K2203/1173 ,  H05K2203/121 ,  H05K2203/1322 ,  H05K2203/1338 ,  H05K2203/1361 ,  H05K2203/1366 ,  H05K2203/1572

摘要： Methods for protecting an electronic device from contaminants by applying different polymeric materials to different vital components of a device are disclosed. In one embodiment, the method comprises applying (110,120) a first polymer, such as (210,220) an acrylic-based polymer, to one or more connectors and components located on the printed circuit board of the device. The method further comprises applying (140) a second polymer, such as a silicone-based polymer, to different connectors and components on the printed circuit board. The method leads to different components being coated with a different polymers, without the need for multilayer coatings on any component. Electronic devices that are protected by such polymeric, hydrophobic coatings are also disclosed. Non-limiting examples of such devices include smart phones, computers, and gaming devices.

摘要翻译： 公开了通过将不同的聚合物材料施加到装置的不同重要部件来保护电子装置免受污染物的方法。 在一个实施例中，该方法包括将（110,120）第一聚合物（例如（210,220）基于丙烯酸的聚合物）施加到位于所述装置的印刷电路板上的一个或多个连接器和部件。 该方法还包括将第二聚合物（例如硅氧烷基聚合物）施加（140）到印刷电路板上的不同连接器和部件。 该方法导致不同的组分被不同的聚合物涂覆，而不需要任何组分上的多层涂层。 还公开了由这种聚合物疏水涂层保护的电子器件。 这种设备的非限制性示例包括智能电话，计算机和游戏设备。

公开(公告)号：WO2015013142A1

公开(公告)日：2015-01-29

申请号：PCT/US2014/047291

申请日：2014-07-18

申请人： APPLIED MATERIALS, INC.

发明人： COX, Michael S. ,  YUAN, Zheng

IPC分类号： H01L21/683 ,  H02N13/00 ,  B23Q3/15

CPC分类号： H01L21/6833 ,  H05K1/0306 ,  H05K1/162 ,  H05K3/285 ,  H05K2201/017 ,  H05K2201/068 ,  H05K2201/09236 ,  H05K2201/09254 ,  H05K2203/0195 ,  H05K2203/1338 ,  Y10T29/49155

摘要： Embodiments of the present invention provide a substrate support assembly including an electrostatic chuck with enhanced heat resistance. In one embodiment, an electrostatic chuck includes a support base, an electrode assembly having interleaved electrode fingers formed therein, and an encapsulating member disposed on the electrode assembly, wherein the encapsulating member is fabricated from one of a ceramic material or glass.

摘要翻译： 本发明的实施例提供一种包括具有增强的耐热性的静电卡盘的基板支撑组件。 在一个实施例中，静电卡盘包括支撑基座，其中形成有交错电极指的电极组件和设置在电极组件上的封装构件，其中封装构件由陶瓷材料或玻璃之一制成。

公开(公告)号：WO2013192222A3

公开(公告)日：2014-02-13

申请号：PCT/US2013046392

申请日：2013-06-18

申请人： HZO INC

发明人： STEVENS BLAKE ,  SORENSON MAX ,  CLAYSON PAUL S ,  GORDON SCOTT B

IPC分类号： B05C9/10

CPC分类号： H05K13/00 ,  C23C16/00 ,  H05K3/284 ,  H05K5/00 ,  H05K5/02 ,  H05K13/0046 ,  H05K2201/0129 ,  H05K2203/1322 ,  H05K2203/1338 ,  H05K2203/1344 ,  H05K2203/1366 ,  Y10T29/49716 ,  Y10T29/5313

摘要： Methods for applying protective coatings to electronic devices that have already been assembled, and are in a consumer-ready or aftermarket form, are disclosed. In such a method, an electronic device may be at least partially disassembled to expose at least a portion of an interior of the electronic device. A protective coating is applied to some or all of the exposed surfaces of the electronic devices, including one or more internal surfaces, features or components of the electronic device. Thereafter, the electronic device may be reassembled. During and after reassembly, the protective coating resides internally within the electronic device. Systems for applying protective coatings to interior components of previously assembled electronic devices are also disclosed.

摘要翻译： 公开了对已经组装并处于消费者准备或售后形式的电子设备施加保护涂层的方法。 在这种方法中，电子设备可以至少部分地拆卸以暴露电子设备内部的至少一部分。 对电子设备的一些或全部暴露的表面施加保护涂层，包括电子设备的一个或多个内表面，特征或部件。 此后，可以重新组装电子设备。 在重新组装期间和之后，保护涂层位于电子设备内部。 还公开了将保护涂层施加到先前组装的电子器件的内部部件的系统。

公开(公告)号：WO2018048541A1

公开(公告)日：2018-03-15

申请号：PCT/US2017/045611

申请日：2017-08-04

申请人： INTEL CORPORATION

发明人： DOBRIYAL, Priyanka ,  RAMALINGAM, Suriyakala ,  LEE, Chester C. ,  ASPANDIAR, Raiyomand F.

IPC分类号： H05K3/28 ,  H05K1/18

CPC分类号： H05K3/284 ,  H01L21/563 ,  H05K1/18 ,  H05K3/285 ,  H05K2201/09872 ,  H05K2201/10977 ,  H05K2203/1338 ,  H05K2203/304

摘要： An electronic system may include a printed circuit board (PCB), a component affixed to the PCB, and a conformal coating layer on the PCB and the component. The conformal coating layer may include parylene. Furthermore, the electronic system may include an underfill layer adjacent to the conformal coating layer, filling a gap between the PCB and the component. Other embodiments may be described and/or claimed.

摘要翻译： 电子系统可以包括印刷电路板（PCB），固定到PCB上的部件以及PCB和部件上的保形涂层。 保形涂层可以包括聚对二甲苯。 此外，电子系统可以包括与保形涂层相邻的底部填充层，填充PCB和部件之间的间隙。 其他实施例可以被描述和/或要求保护。

公开(公告)号：WO2016198870A1

公开(公告)日：2016-12-15

申请号：PCT/GB2016/051702

申请日：2016-06-09

申请人： SEMBLANT LIMITED

发明人： ARESTA, Gianfranco ,  HENNIGHAN, Gareth ,  BROOKS, Andrew Simon Hall ,  SINGH, Shailendra Vikram

IPC分类号： H05K3/28

CPC分类号： H05K3/467 ,  C23C16/30 ,  C23C16/505 ,  H05K1/181 ,  H05K3/285 ,  H05K2201/0104 ,  H05K2201/0162 ,  H05K2201/09872 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10037 ,  H05K2201/10053 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10098 ,  H05K2201/10106 ,  H05K2201/10121 ,  H05K2201/10128 ,  H05K2201/10166 ,  H05K2201/10174 ,  H05K2201/10181 ,  H05K2203/095 ,  H05K2203/121 ,  H05K2203/1322 ,  H05K2203/1338

摘要： An electrical assembly which has a multi-layer conformal coating on at least one surface of the electrical assembly, wherein each layer of the multi-layer coating is obtainable by plasma deposition of a precursor mixture comprising (a) one or more organosilicon compounds, (b) optionally O 2 , N 2 O, NO 2 , H 2 , NH 3 , N 2 , SiF 4 and/or hexafluoropropylene (HFP), and (c) optionally He, Ar and/or Kr. The chemistry of the resulting plasma-deposited material chemistry can be described by the general formula: SiO x H y C z F a N b . The properties of the conformal coating are tailored by tuning the values of x, y, z, a and b.

摘要翻译： 一种电组件，其在所述电组件的至少一个表面上具有多层共形涂层，其中所述多层涂层的每层可通过等离子体沉积前体混合物获得，所述前体混合物包含（a）一种或多种有机硅化合物， b）任选的O 2，N 2 O，NO 2，H 2，NH 3，N 2，SiF 4和/或六氟丙烯（HFP），和（c）任选的He，Ar和/或Kr。 所得到的等离子体沉积材料的化学性质可以用通式如下来描述：SiOxHyCzFaNb。 通过调整x，y，z，a和b的值来调整保形涂层的性能。

公开(公告)号：WO2015041953A1

公开(公告)日：2015-03-26

申请号：PCT/US2014/055474

申请日：2014-09-12

申请人： CALIFORNIA INSTITUTE OF TECHNOLOGY

发明人： TAI, Yu-Chong ,  CHANG, Han-Chieh ,  ZHANG, Xiaoxiao

IPC分类号： H05K3/40

CPC分类号： H05K3/242 ,  A61N1/0543 ,  C23C14/14 ,  C23C14/24 ,  C25D1/04 ,  H05K1/189 ,  H05K3/064 ,  H05K3/244 ,  H05K3/28 ,  H05K3/321 ,  H05K3/4007 ,  H05K2203/0191 ,  H05K2203/0361 ,  H05K2203/0723 ,  H05K2203/1338

摘要： Methods, and devices produced by the methods, for electroplating a multitude of micro-scale electrodes that are electrically isolated from each other on a cable or other device is described. A localized area of connections on another end of the cable is shorted together by depositing a metal sheet or other conductive material over the localized area. The metal sheet is connected to a terminal of a power supply, and the electrode end of the cable is immersed in an electrolyte solution for electrodeposition by electroplating. After the electrodes are electroplated, the metal sheet is removed from the cable in order to re-isolate the electrodes.

摘要翻译： 描述了通过该方法产生的用于电镀多个在电缆或其它设备上彼此电隔离的微尺度电极的方法和装置。 通过在局部区域上沉积金属片或其它导电材料，将电缆的另一端上的局部连接区域短路在一起。 金属片与电源的端子连接，将电缆的电极端浸渍在电解液中，通过电镀电沉积。 在电极电镀之后，将金属片从电缆中取出，以便重新隔离电极。

公开(公告)号：WO2015164593A1

公开(公告)日：2015-10-29

申请号：PCT/US2015/027276

申请日：2015-04-23

申请人： ROGERS CORPORATION

发明人： KILHENNY, Brett W.

IPC分类号： H05K1/05 ,  H01L23/373 ,  H01L23/498 ,  H05K3/44 ,  H05K7/20 ,  H01L23/14 ,  H05K1/02

CPC分类号： H05K1/0201 ,  H01L23/142 ,  H01L23/3735 ,  H01L23/49827 ,  H01L23/49894 ,  H01L33/62 ,  H01L33/641 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48464 ,  H01L2933/0066 ,  H01L2933/0075 ,  H05K1/0206 ,  H05K1/0298 ,  H05K1/03 ,  H05K1/053 ,  H05K1/09 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/0097 ,  H05K3/12 ,  H05K3/32 ,  H05K3/4038 ,  H05K3/44 ,  H05K3/445 ,  H05K2201/09563 ,  H05K2201/10106 ,  H05K2201/10166 ,  H05K2203/0315 ,  H05K2203/1338 ,  H01L2924/00014

摘要： A thermal management circuit material comprises a thermally conductive metallic core substrate having at least one through-hole via, non-metallic dielectric layers deposited on both sides of the metallic core substrate and on the containing walls of the through-hole via, electrically conductive metal layers on the non-metallic dielectric layers and an electrically conductive metal-containing core element filling the insulated through-hole via connecting at least a portion of each of the electrically conductive metal layers. Also disclosed are methods of making such circuit materials, comprising forming non-metallic dielectric layers by vapor deposition of a non-metallic material, for example by reacting an oxygen-containing precursor with an aluminum containing precursor and/or reacting a nitrogen-containing precursor with an aluminum or boron containing precursor on the surface of the metallic core substrate. Articles having a heat-generating electronic device such as an HBLED mounted in the circuit material are also disclosed.

摘要翻译： 热管理电路材料包括导热金属芯基板，其具有沉积在金属芯基板的两侧和通孔通孔的容纳壁上的至少一个通孔非金属电介质层，导电金属 在非金属电介质层上的层和通过连接每个导电金属层的至少一部分而填充绝缘通孔的导电含金属芯体元件。 还公开了制造这种电路材料的方法，包括通过非金属材料的气相沉积形成非金属电介质层，例如通过使含氧前体与含铝前体反应和/或使含氮前体 在金属芯基材的表面上具有含铝或硼的前体。 还公开了具有安装在电路材料中的诸如HBLED之类的发热电子器件的制品。

公开(公告)号：WO2015164552A1

公开(公告)日：2015-10-29

申请号：PCT/US2015/027193

申请日：2015-04-23

申请人： THE TRUSTEES OF THE UNIVERSITY OF PENNSYLVANIA ,  JOHNSON, Alan, T. ,  GUDIBANDE, Rajatesh, R.

发明人： JOHNSON, Alan, T. ,  GUDIBANDE, Rajatesh, R. ,  QI, Zhengqing, John

IPC分类号： B05D5/12 ,  H05K3/12

CPC分类号： H05K1/09 ,  H01G11/32 ,  H01L29/1606 ,  H05K1/0306 ,  H05K3/06 ,  H05K3/1216 ,  H05K3/125 ,  H05K3/1275 ,  H05K3/20 ,  H05K2201/0323 ,  H05K2203/1338

摘要： The present invention provides methods for fabricating graphene workpieces. The present invention also provides for products produced by the methods of the present invention and for apparatuses used to perform the methods of the present invention.

摘要翻译： 本发明提供了制造石墨烯工件的方法。 本发明还提供了通过本发明的方法生产的产品和用于执行本发明的方法的装置。

公开(公告)号：WO2015020700A1

公开(公告)日：2015-02-12

申请号：PCT/US2014/031759

申请日：2014-03-25

申请人： CALIFORNIA INSTITUTE OF TECHNOLOGY

发明人： TAI, Yu-Chong ,  CHANG, Han-Chieh

IPC分类号： A61J1/00 ,  B65D85/86 ,  B65D85/90 ,  A61F2/14 ,  A61B19/02

CPC分类号： H05K3/4038 ,  A61F9/0017 ,  H01L23/3135 ,  H01L2224/73204 ,  H01L2924/0002 ,  H05K1/032 ,  H05K3/0041 ,  H05K3/281 ,  H05K3/282 ,  H05K3/284 ,  H05K3/285 ,  H05K3/381 ,  H05K2201/017 ,  H05K2201/10015 ,  H05K2201/10022 ,  H05K2201/1003 ,  H05K2201/10075 ,  H05K2201/10083 ,  H05K2201/10287 ,  H05K2201/10356 ,  H05K2203/0139 ,  H05K2203/0514 ,  H05K2203/1316 ,  H05K2203/1322 ,  H05K2203/1338 ,  Y10T29/49165 ,  H01L2924/00

摘要： The present invention provides a micropackaged device comprising: a substrate for securing a device; a corrosion barrier affixed to said substrate; optionally at least one feedthrough disposed in said substrate to permit at least one input and or at least one output line into said micropackaged device; and an encapsulation material layer configured to encapsulate the micropackaged device.

摘要翻译： 本发明提供一种微封装装置，包括：用于固定装置的基板; 附着在所述基板上的腐蚀屏障; 可选地，至少一个馈通设置在所述衬底中以允许至少一个输入和/或至少一个输出线进入所述微封装装置; 以及被配置为封装所述微封装设备的封装材料层。