Abstract:
A device for providing an aid for semi-automatic mounting in the purpose of providing the operator with the necessary precision, comprising a rotary table (3) with component containers (1) and an X-Y table (10) with attachment means for the circuit board (7) located there below. Adjacent the rotary table (3) and above the circuit board (7) is a hand support (9). A light spot is projected on the surface of the circuit board (7) on which the component is to be positioned for indicating the proper spot for positioning. A computer controls the X-Y table (10) while an indication surface (13) is activated on that component container (1) from which the component (8) to be positioned in the projected light spot (6) is to be picked up. The component containers (2) are positioned so that the hand handling a pickup tool (4) does not have to be raised resulting in that the hand is supported throughout the pickup motion.
Abstract:
A specialized tool is provided for the removal of components in a microwave module in which a fixed tool having a channeled tip is positioned adjacent the component to be removed. A hot stream of gas, in one embodiment nitrogen, is then forced through the channel onto the top surface of the component to be removed, with the microwave module lying on a heated platen, such that the local increase in temperature at the component to be removed in enough hotter than the ambient temperature of the module as determined by the heated platen to soften the silver epoxy used to mount the component to the module without damaging nearby components. With the fixed tool adjacent the component to be removed and with the component provided with targeted heating, the module is moved against the tool to cause a shear force to moves the component away from its original position, thus breaking the epoxy bond, after which the component is plucked from the module. The subject tool and technique eliminated collateral damage associated with the use of a ball peen hammer and chisel, and results in a tenfold decrease in rework time.
Abstract:
The invention relates to a tool for releasing a latched connection between a module which is provided with a parallelepiped housing that is open on one side and with a holding device. Said holding device comprises a detent element and is provided for the module, which can be displaced along the holding device by means of a guide and which, in the housing wall, comprises an opening for the engagement of the detent element. In order to easily disengage the module from the latching of the holding device, the tool is comprised of a parallelepiped body (1) which, on a partial length (L1), can be easily inserted into the housing of the module and which, inside the profile thereof, comprises a hand-actuated spring-loaded peg (6) for unlatching the detent element. The spring-loaded peg and the parallelepiped body (1) are provided together as one piece. To this end, the body (1) has a slot-like cavity (4) in which a spring element (5) is provided in the manner of a bending spring whose moveable end forms said peg (6).
Abstract:
A tool (46) and method for removing a chip carrier socket housing (2) from terminals (4) which are received in the housing (2) and which are mounted on a substrate (8). The tool (46) comprises a yoke (48) having pulling arms (66) pivoted thereto which have free ends (78) that engage the housing (2) at the corners (36) thereof. A central axial opening (62) extends through the yoke (48) and a slide (54) is slidable in the opening (62). The slide (54) has a reaction plate (50) on its end which is shaped to engage the upper free ends (26) of the terminals (4). A locking cam (82) is provided which locks the pulling arms (66) in their engaged positions with the housing (2). An actuating means (52, 54) causes the yoke (48) and the pulling arms (66) to move upwardly (relative to the substrate (8) on which the terminals (4) are mounted) with respect to the reaction plate (50). The housing (2) is thus pulled by the arms (66) upwardly and from the terminals (4).
Abstract:
An electronic component removal device comprising a cutting wire (110) routed through a cutting region (111) configured to receive an electronic component coupled to a substrate. The electronic component removal device can also include a leading actuator (120) coupled to a leading end of the cutting wire (110) to cause movement of the cutting wire (110) in a cutting direction at a cutting speed. The electronic component removal device can further include a trailing resistance device (130) coupled to a trailing end of the cutting wire (110) to resist movement of the cutting wire (110) in the cutting direction with a variable resistance. In addition, the electronic component removal device can include a leading tension sensor (140) to sense a leading tension in the cutting wire (110) between the cutting region (110) and the leading actuator (120). The trailing resistance device (130) can resist movement of the cutting wire (110) with a resistance that varies based on the leading tension in the cutting wire (110).
Abstract:
Dispositif de démontage d'au moins un composant électronique de puissance (10) d'un radiateur (16, 50) de refroidissement du composant, le composant et le radiateur comportant chacun une respective face de refroidissement (14, 22, 76) en contact thermique. Une partie (78) de la face de refroidissement du composant monté sur le radiateur est libre et accessible à un corps mobile (50) par rapport au radiateur. Le radiateur comporte un élément mobile (90) solidaire du radiateur destiné à pousser le corps mobile (52) contre la partie (78) libre de la face de refroidissement du composant pour séparer le composant du radiateur. Application : maintenance des cartes électroniques de puissance.
Abstract:
L'invention concerne un procédé de montage et/ou de démontage d'au moins un module électronique (1) sur une carte d'application (2), ledit module (1) comprenant au moins deux éléments constitutifs, à savoir au moins un circuit imprimé (12) et au moins un autre élément constitutif (11, 13) relié mécaniquement par au moins une brasure (14, 15) audit circuit imprimé (12), ledit module (1) comprenant en outre un jeu d'éléments de report (16) par refusion dudit module (1) sur une carte d'application (2). Selon l'invention, un tel procédé met en oeuvre une étape de maintien mécanique par effet ressort (3) desdits éléments constitutifs (11, 12, 13) dudit au moins un module (1), de façon à en assurer la cohésion mécanique lors de la refusion dudit jeu d'éléments de report (16) pour le montage et/ou le démontage dudit module (1) sur ladite carte d'application (2).
Abstract:
A tool (200) for installation and removal of a connector of a gas-insulated switchgear termination (800) is provided. The gas-insulated switchgear termination (800) includes a conical connector member (101) for receiving a cable core (301) of electric cable (300), a sleeve member (102) installed on the conical connector member (101), and a locating member (103) being mated with the conical connector member (101). The tool (200) comprises: a housing (203) defining an operation chamber (2030) therein; a mounting assembly selectively disposed in said operation chamber (2030) of said housing (203) and adapted for securely installing the sleeve member (102) on the conical connector member (101) or removing the sleeve member (102) securely sleeved on the conical connector member (101) from the conical connector member (101); an actuator assembly adapted for actuating motion of said mounting assembly; and a friction reducing assembly adapted for reducing friction and resistance occurring during the motion of said mounting assembly.
Abstract:
The invention relates to a tool for releasing a latched connection between a module which is provided with a parallelepiped housing that is open on one side and with a holding device. Said holding device comprises a detent element and is provided for the module, which can be displaced along the holding device by means of a guide and which, in the housing wall, comprises an opening for the engagement of the detent element. In order to easily disengage the module from the latching of the holding device, the tool is comprised of a parallelepiped body (1) which, on a partial length (L1), can be easily inserted into the housing of the module and which, inside the profile thereof, comprises a hand-actuated spring-loaded peg (6) for unlatching the detent element. The spring-loaded peg and the parallelepiped body (1) are provided together as one piece. To this end, the body (1) has a slot-like cavity (4) in which a spring element (5) is provided in the manner of a bending spring whose moveable end forms said peg (6).
Abstract:
A surface mount device desoldering and removal tool (10) including a flexible carrier plate (12) and a plurality of heated legs (14) attached to the flexible carrier plate (12) for contacting the leads (52) of an electrical component (50). The flexible carrier plate (12) is sufficiently flexible so that the flexing of the carrier plate (12) allows the plurality of legs (14) to deflect outward to accommodate electrical components (50) of varying sizes. The plurality of legs (14) are heated by electrical resistance heating elements (22) to melt the solder (56) which connects an electrical component (50) to a circuit board (54). The legs (14) provide a grip on the leads (52) of the electrical component (50) which allows the removal tool (10) to lift the electrical component (50) when all the solder connections have been melted. The flexible carrier plate (12) is advantageously provided with shoulders (66) which allow the electrical component (50) to be easily removed from the removal tool (10).