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    METHOD FOR PRODUCING AN ELECTRONIC APPLIANCE, AND CORRESPONDING ELECTRONIC APPLIANCE
    2.
    发明申请
    METHOD FOR PRODUCING AN ELECTRONIC APPLIANCE, AND CORRESPONDING ELECTRONIC APPLIANCE 审中-公开
    方法用于制造电子和电子设备

    公开(公告)号：WO2006099977A8

    公开(公告)日：2016-06-30

    申请号：PCT/EP2006002359

    申请日：2006-03-15

    Applicant: SEW EURODRIVE GMBH & CO ,  PRAUTZSCH HARALD ,  KUHFUSS VALENTIN

    Inventor： PRAUTZSCH HARALD ,  KUHFUSS VALENTIN

    IPC: H05K1/02 ,  H01L23/367 ,  H01L23/40 ,  H05K7/20

    CPC classification number: H05K1/0203 ,  H01L21/6835 ,  H01L2023/4031 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/09127 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H01L2924/00

    Abstract: The invention relates to an electronic appliance and a method for producing an electronic appliance comprising semiconductors (l) and a cooling body (31) for heat dissipation to the surrounding environment or another medium. A highly heat-conductive part (24) is arranged on the cooling body (31), especially for conducting the heat of the semiconductor to the cooling body. According to the invention, a printed circuit board (23) is provided with semiconductors, cooling surfaces (2) of the semiconductors being applied to a partial region (21) of the printed circuit board, especially for adjustment purposes; the partial region (21) of the printed circuit board is broken off and/or removed; and the printed circuit board is connected, especially detachably connected, to the cooling body in such a way that the cooling surfaces (2) are applied to the highly conductive part (24) in an especially plane manner.

    Abstract translation: 一种电子装置和方法，用于制造电子器件，所述半导体（l）和散热器（31）与散热到周围环境或另一种介质，其特征在于，所述散热器（31），高导热性的部件（24），特别是用于进行 半导体的热被布置在所述散热片，其特征在于， - 一个印刷电路板（23）安装有所述半导体，冷却表面的半导体的（2） - 与电路板的部分区域（21）被放置，特别是用于 - 对准， - 所述 是部分区域（21）取消电路板和/或移除， - 因此连接到散热器上的电路板，尤其是可释放地连接，是在热传导性高邻接，特别计划的部分（24）的冷却表面（2）。

    COMPACT THERMAL MODULE
    4.
    发明申请
    COMPACT THERMAL MODULE 审中-公开
    紧凑型热模块

    公开(公告)号：WO2013002875A1

    公开(公告)日：2013-01-03

    申请号：PCT/US2012/033114

    申请日：2012-04-11

    Applicant: APPLE INC. ,  DEGNER, Brett W. ,  TICE, Gregory

    Inventor： DEGNER, Brett W. ,  TICE, Gregory

    IPC: H01L23/40 ,  H05K7/12 ,  H05K3/30 ,  H01L23/473 ,  H05K7/20

    CPC classification number: G06F1/20 ,  H01L23/4006 ,  H01L23/427 ,  H01L23/473 ,  H01L2924/0002 ,  H05K3/301 ,  H05K7/12 ,  H05K7/20 ,  H05K7/20254 ,  H05K2201/064 ,  H05K2201/10265 ,  H05K2201/10325 ,  H05K2201/10393 ,  H05K2201/10704 ,  H05K2203/0278 ,  Y10T29/49124 ,  Y10T29/49826 ,  Y10T29/53113 ,  H01L2924/00

    Abstract: A low Z profile consolidated thermal module suitable for securing and removing excess heat generated by an integrated circuit (208) mounted to a printed circuit board (214) and operating in a compact computing environment is disclosed. The consolidated thermal module comprises a heat removal assembly (202, 204, 206) with a reduced footprint and disposed on a first surface of the printed circuit board and in thermal contact with the integrated circuit. A retaining mechanism (210) is disposed on a second surface of the printed circuit board and a backer plate (218) is disposed between the retaining mechanism and the printed circuit board. At least one fastener (212) secures the heat removal assembly to the backer plate and the retaining mechanism, wherein the retaining mechanism causes a substantially uniform retaining force to be applied across the backer plate, thereby minimizing an amount of torque applied to the integrated circuit.

    Abstract translation: 公开了一种适于固定和去除由安装到印刷电路板（214）并在紧凑的计算环境中操作的集成电路（208）产生的多余热量的低Z形固结热模块。 整合的热模块包括具有减小的占地面积的散热组件（202,204,206），并且布置在印刷电路板的第一表面上并与集成电路热接触。 保持机构（210）设置在印刷电路板的第二表面上，并且支撑板（218）设置在保持机构和印刷电路板之间。 至少一个紧固件（212）将散热组件固定到支撑板和保持机构，其中保持机构使得基本上均匀的保持力施加在支撑板上，从而最小化施加到集成电路的扭矩的量 。

    VERBINDUNGSANORDNUNG
    5.
    发明申请
    VERBINDUNGSANORDNUNG 审中-公开
    连接装置

    公开(公告)号：WO2011033059A1

    公开(公告)日：2011-03-24

    申请号：PCT/EP2010/063693

    申请日：2010-09-17

    Applicant: WÜRTH ELEKTRONIK ICS GMBH & CO. KG ,  KALLEE, Werner

    Inventor： KALLEE, Werner

    IPC: H01R12/77

    CPC classification number: H01R12/67 ,  H05K3/308 ,  H05K3/325 ,  H05K2201/0382 ,  H05K2201/1028 ,  H05K2201/10393 ,  H05K2201/1059

    Abstract: Zur Herstellung einer Verbindung zwischen einer leitenden Folie und einem Plattenelement mit mindestens einer Bohrung wird vorgeschlagen, die Verbindung in der Weise zu gestalten, dass die nicht gelochte Folie mithilfe von Kontaktstiften in Bohrungen des Plattenelements eingetrieben wird. Die Kontaktstifte legen die umgebogenen Teile der Folie an die Wand der Bohrung an und verklemmen sich in der Bohrung. Die Einpresstiefe der Kontaktstifte wird dadurch begrenzt, dass das Klemmelement, aus dem sie hervortreten, an der Oberseite des Plattenelements zur Anlage kommt. Dadurch werden auch Bereiche der Folie zwischen der Oberseite der Platte und dem Klemmelement direkt verklemmt.

    Abstract translation: 用于生产导电膜和具有至少一个孔的板构件之间的化合物提出了使在使用接触销到板构件的通孔的非多孔膜被驱动的方式连接。 接触销在孔的壁中创建所述膜的弯曲部分，并成为卡住在孔。 接触针的插入深度由以下事实：所述夹紧元件，从它们的出现，是在板元件到植株顶端的高度的限制。 这也板的顶部和夹持构件之间的膜的部分被直接夹持。

    TEST OF ELECTRONIC DEVICES WITH BOARDS WITHOUT SOCKETS BASED ON INDEPENDENT MECHANICAL CLIPPING
    6.
    发明申请
    TEST OF ELECTRONIC DEVICES WITH BOARDS WITHOUT SOCKETS BASED ON INDEPENDENT MECHANICAL CLIPPING 审中-公开
    基于独立机械剪辑的无插座的电子设备测试

    公开(公告)号：WO2009147518A3

    公开(公告)日：2010-05-27

    申请号：PCT/IB2009005877

    申请日：2009-06-03

    Applicant: ELES SEMICONDUCTOR EQUIPMENT S ,  DI LELLO STEFANO

    Inventor： DI LELLO STEFANO

    IPC: G01R31/319 ,  G01R31/28

    CPC classification number: G01R31/2891 ,  G01R1/0483 ,  G01R3/00 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10204 ,  H05K2201/10393 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0108 ,  H05K2203/162

    Abstract: A test board (115;115') is proposed for testing electronic devices (105;105'), each one of them having a plurality of terminals (220;220') for electrically contacting the electronic device. The test board includes a support substrate (205;205'). A set of banks of electrically conductive receptacles (210;210') are arranged on the substrate each one for resting a corresponding electronic device; each receptacle (250,255;250',255') is adapted to receive a terminal of the corresponding electronic device. Locking means (225) are further arranged on the substrate for mechanically locking the electronic devices on the test board. The test board further includes assembly means (230-245) for mounting the locking means on the substrate independently of the receptacles.

    Abstract translation: 提出了一种用于测试电子设备（105; 105'）的测试板（115; 115'），每个测试板具有用于电接触电子设备的多个端子（220; 220'）。 测试板包括支撑衬底（205; 205'）。 一组电导体插座（210; 210'）布置在基板上，每个用于搁置相应的电子设备; 每个插座（250,255; 250'，255'）适于接收相应电子设备的终端。 锁定装置（225）还布置在基板上，用于将电子装置机械地锁定在测试板上。 测试板还包括用于独立于插座将锁定装置安装在基板上的组装装置（230-245）。

    TEST OF ELECTRONIC DEVICES WITH BOARDS WITHOUT SOCKETS BASED ON INDEPENDENT MECHANICAL CLIPPING
    7.
    发明申请
    TEST OF ELECTRONIC DEVICES WITH BOARDS WITHOUT SOCKETS BASED ON INDEPENDENT MECHANICAL CLIPPING 审中-公开
    基于独立机械剪辑的无插座的电子设备测试

    公开(公告)号：WO2009147518A2

    公开(公告)日：2009-12-10

    申请号：PCT/IB2009/005877

    申请日：2009-06-03

    Applicant: ELES SEMICONDUCTOR EQUIPMENT S.P.A. ,  DI LELLO, Stefano

    Inventor： DI LELLO, Stefano

    CPC classification number: G01R31/2891 ,  G01R1/0483 ,  G01R3/00 ,  H05K3/326 ,  H05K3/4007 ,  H05K2201/0314 ,  H05K2201/0367 ,  H05K2201/09745 ,  H05K2201/10204 ,  H05K2201/10393 ,  H05K2201/10689 ,  H05K2201/10734 ,  H05K2203/0108 ,  H05K2203/162

    Abstract: A test board (115;115') is proposed for testing electronic devices (105;105'), each one of them having a plurality of terminals (220;220') for electrically contacting the electronic device. The test board includes a support substrate (205;205!). A set of banks of electrically conductive receptacles (210;210') are arranged on the substrate each one for resting a corresponding electronic device; each receptacle (250,255;250',255') is adapted to receive a terminal of the corresponding electronic device. Locking means (225) are further arranged on the substrate for mechanically locking the electronic devices on the test board. The test board further includes assembly means (230-245) for mounting the locking means on the substrate independently of the receptacles.

    Abstract translation: 提出了一种用于测试电子设备（105; 105'）的测试板（115; 115'），每个测试板具有用于电接触电子设备的多个端子（220; 220'）。 测试板包括支撑衬底（205; 205！）。 一组电导体插座（210; 210'）布置在基板上，每个用于搁置相应的电子设备; 每个插座（250,255; 250'，255'）适于接收相应电子设备的终端。 锁定装置（225）还布置在基板上，用于将电子装置机械地锁定在测试板上。 测试板还包括用于独立于插座将锁定装置安装在基板上的组装装置（230-245）。

    ELEKTROGERÄT UND ANTRIEB
    8.
    发明申请
    ELEKTROGERÄT UND ANTRIEB 审中-公开
    电气设备和驱动

    公开(公告)号：WO2009021633A1

    公开(公告)日：2009-02-19

    申请号：PCT/EP2008/006300

    申请日：2008-07-31

    Applicant: SEW-EURODRIVE GMBH & CO. KG ,  POLJAK, Anton

    Inventor： POLJAK, Anton

    IPC: H01L25/11 ,  H01L25/16 ,  H01L23/40

    CPC classification number: H01L25/162 ,  H01L23/40 ,  H01L25/115 ,  H01L2023/4081 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K1/148 ,  H05K1/189 ,  H05K3/0052 ,  H05K3/284 ,  H05K3/4691 ,  H05K7/20463 ,  H05K7/2049 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/1056 ,  H05K2203/1316 ,  H01L2924/00

    Abstract: Elektrogerät und Antrieb, umfassend eine elektronische Schaltung mit Leistungshalbleitern (21), wobei die Leistungshalbleiter mittels mindestens eines Federelements (22) an einen Kühlkörper (20) angedrückt sind zur Wärmeabfuhr der von den Leistungshalbleitern erzeugten Wärme an den Kühlkörper, wobei die Leistungshalbleiter auf einem Leiterplattenstück (5) angeordnet, insbesondere lötverbunden sind, wobei das Leiterplattenstück mittels eines flexiblen Bereiches (6) mit einer ersten Leiterplatte (1) der elektronischen Schaltung verbunden ist, wobei der flexible Bereich elektrische Leiterbahnen umfasst.

    Abstract translation: 电气装置和驱动器，包括用功率半导体的电子电路（21），所述功率半导体通过至少一个弹簧元件（22）（20）的散热片被压到由所述功率半导体的冷却体产生的热的散热性，在电路板上一块功率半导体 （5）布置，特别地，焊料键合的，其特征在于，具有电子电路的第一电路板（1）的布线层基板片经由柔性区域（6），其中，所述柔性部分包括电导体轨迹连接。

    SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD
    9.
    发明申请
    SCREEN PRINTING APPARATUS AND SCREEN PRINTING METHOD 审中-公开
    屏幕打印设备和画面打印方法

    公开(公告)号：WO2005112530A1

    公开(公告)日：2005-11-24

    申请号：PCT/JP2005/009203

    申请日：2005-05-13

    Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. ,  SAKAUE, Takaaki ,  OTAKE, Yuji ,  NISHIDA, Masafumi ,  TANAKA, Tetsuya

    Inventor： SAKAUE, Takaaki ,  OTAKE, Yuji ,  NISHIDA, Masafumi ,  TANAKA, Tetsuya

    IPC: H05K3/12

    CPC classification number: H05K3/1216 ,  B41P2215/14 ,  H05K2201/10393 ,  H05K2203/0165

    Abstract: In a screen printing apparatus for contacting a lower surface of a mask plate (12) with a substrate (6) and moving a squeezee (16) in a sliding motion on an upper surface of the mask plate (12) thereby printing a paste onto the substrate, mask bend preventing members (117) are mounted on conveying rails (7) at front and rear parts of clamp members (8) clamping the substrate (6) in a Y-direction, and, at a mask separating operation after printing, the substrate is lowered while the lower surface of the mask plate (12) is supported by the clamp members (8) and the mask bend preventing members (117). Thus the mask separation can be achieved in a state where the mask plate (12) is supported from below on four sides of the substrate (6) and is thus prevented from a downward bending, and a satisfactory mask separating property can be ensured over the entire substrate (6).

    Abstract translation: 在用于使掩模板（12）的下表面与基板（6）接触并且在所述掩模板（12）的上表面上滑动移动挤压机（16）的丝网印刷设备中，从而将浆料印刷到 基板，掩模弯曲防止部件（117）安装在夹持基板（6）的Y方向的夹持部件（8）的前后部的输送轨道（7）上，在印刷后的掩模分离操作 通过夹持构件（8）和掩模弯曲防止构件（117）支撑掩模板（12）的下表面，降低基板。 因此，掩模分离可以在掩模板（12）从基板（6）的四侧的下方被支撑的状态下实现，并且因此防止其向下弯曲，并且可以确保令人满意的掩模分离性能 整个基板（6）。

    COMPONENT ALIGNMENT CASING SYSTEM
    10.
    发明申请
    COMPONENT ALIGNMENT CASING SYSTEM 审中-公开
    组件对齐系统

    公开(公告)号：WO01020737A1

    公开(公告)日：2001-03-22

    申请号：PCT/US2000/003952

    申请日：2000-02-16

    IPC: H05K1/18 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04 ,  H02G3/02

    CPC classification number: H05K3/303 ,  H05K1/189 ,  H05K3/301 ,  H05K3/3421 ,  H05K13/0465 ,  H05K13/0482 ,  H05K2201/0394 ,  H05K2201/10393 ,  H05K2201/10628 ,  H05K2203/0173 ,  H05K2203/167 ,  Y02P70/613

    Abstract: A component alignment casing system (10) for connecting circuits, and a method for making or assembling the component alignment casing system is disclosed. The system has at least one surface mountable component (12) which has a plurality of exposed leads (28), a prepared component (14) which has a plurality of exposed traces (16), an alignment base (18) onto which the prepared component (14) and the surface mountable component (12) are laid, and a compressive cover (20) that attaches to said alignment base (18). The alignment base (18) has a plurality of alignment ribs (22) to isolate and align the exposed traces (16) of the prepared component (14). The prepared component (14) and the at least one surface mountable components (12) are electrically connected and attached together, preferably by soldering. The method includes laying the prepared component (14) on the alignment base (18) and ribs (22), and overlaying the surface mountable component (12), with its exposed leads (28), onto the alignment base (18) and the prepared component (14), and electrically connecting the components together, preferably by soldering, to the alignment base (18). The cover (20) is then snapped on, and supplies compressive force to assure good contact between the leads (28) of the surface mountable component (12) and the traces (16) of the prepared component (14).

    Abstract translation: 公开了一种用于连接电路的部件对准套管系统（10），以及用于制造或组装部件对准套管系统的方法。 该系统具有至少一个表面可安装部件（12），其具有多个暴露引线（28），具有多个暴露迹线（16）的准备部件（14），其上制备的对准基座（18） 部件（14）和表面安装部件（12），以及附接到所述对准基座（18）的压缩盖（20）。 对准基座（18）具有多个对准肋（22），以隔离并对准所制备的部件（14）的暴露的迹线（16）。 所制备的组件（14）和至少一个表面可安装部件（12）优选通过焊接电连接并附接在一起。 该方法包括将准备的部件（14）放置在对准基座（18）和肋（22）上，并将表面安装部件（12）与其暴露的引线（28）重叠在对准基座（18）上，并且 制备的组件（14），并且通过焊接将组件电连接到对准基座（18）上。 然后将盖（20）卡在上面，并提供压缩力以确保表面可安装部件（12）的引线（28）与准备的部件（14）的迹线（16）之间的良好接触。

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