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公开(公告)号:WO2022012076A1
公开(公告)日:2022-01-20
申请号:PCT/CN2021/082189
申请日:2021-03-22
IPC: C08L79/08 , C08K9/04 , C08K3/04 , C08J5/18 , C08G73/10 , C08G73/1007 , C08G73/1039 , C08G73/1067 , C08G73/1071 , C08J2379/08 , C08K2201/011 , C08K3/042
Abstract: 一种低介电聚酰亚胺复合薄膜材料及其制备方法,包括以下步骤:二元胺与二元酐反应制得聚酰胺酸溶液;柠檬酸水热法制得石墨烯量子点,并与二氨基吡啶进行酰胺化反应得到氨基吡啶功能化石墨烯量子点;将聚酰胺酸溶液与功能化石墨烯量子点室温混合,旋涂,并经梯度亚胺化处理得低介电聚酰亚胺复合薄膜材料。经功能化后的石墨烯量子点均匀分散在聚酰亚胺基体中,形成厚度均匀可控的薄膜材料。
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公开(公告)号:WO2021198987A1
公开(公告)日:2021-10-07
申请号:PCT/IB2021/052756
申请日:2021-04-01
Applicant: SHPP GLOBAL TECHNOLOGIES B.V.
Inventor: LEENDERS, Chiel Albertus , BAJAJ, Devendra , VERGHESE, Nikhil , VAN DER AA, Sam
IPC: C08J5/10 , B32B5/30 , C08J2379/08
Abstract: Fiber-reinforced composite (e.g., for portable electronic devices), and methods of molding such fiber-reinforced composite parts. Such a fiber-reinforced composite part comprises one or more fiber layers and a plurality of ceramic particles within a polymer matrix such that ceramic particles and polymer are disposed above and below each of the fiber layer(s), with the ceramic particles comprising from 30% to 90% by volume of the composite part, the polymer matrix comprising from 6% to 50% by volume of the composite part, and the fiber layer(s) comprising from 1% to 40% by volume of the composite part; the ceramic particles having a Dv50 of from 50 nanometers to 100 micrometers; the ceramic particles being substantially free of agglomeration; and the composite part having a relative density greater than 90%. The present methods of molding such fiber-reinforced composite parts comprise: disposing one or more fiber layers in a working portion of a cavity in a mold such that the fiber layer(s) extends laterally across the composite part; and disposing ceramic particles and polymer above and below each of the fiber layer(s) in the working portion; heating the mold to a first temperature that exceeds a melting temperature (Tm) of the first polymer; subjecting the polymer, ceramic particles, and fiber layer(s) in the mold to a first pressure while maintaining the temperature of the mold to or above the first temperature to define a composite part in which the ceramic particles are substantially free of agglomeration; cooling the housing component to a temperature below the Tg or Tm of the first polymer; and removing the housing component from the mold. In some such methods, the core-shell particles comprise a ceramic core comprising a particle of a ceramic, and a polymer shell around the core, the shell comprising a polymer, where the ceramic cores comprise from 50% to 90% by volume of the powder, and the polymer shells comprise from 10% to 50% by volume of the powder. In such composite parts and methods, the ceramic particles comprise AI2O3, Fe3O4, Fe2O3, ZnO, ZrO2, SiO2, and/or a combination of any two or more of these ceramics; and the polymer comprises PPE, PPS, PC copolymers, PEI, PEI copolymers, PPSU, PAES, PES, PAEK, PBT, PP, PE, semi-crystalline PI, or semi-crystalline polyamide.
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公开(公告)号:WO2021197660A1
公开(公告)日:2021-10-07
申请号:PCT/EP2020/088033
申请日:2020-12-30
Applicant: EVONIK OPERATIONS GMBH
Inventor: WURSCHE, Roland , TRASSL, Christian , GEERKENS, Sebastian , BLASCHKE, Jörg , BERNHARD, Kay , HOLLEYN, Denis
IPC: C08J9/06 , C08J9/12 , C08J9/232 , B29B9/06 , B29B9/065 , B29B9/12 , C08J2201/03 , C08J2203/00 , C08J2371/10 , C08J2379/08 , C08J2471/10 , C08J2479/08
Abstract: Polymer foams based on polyetherimides (PEI) or blends of polyetherimides and polyether ether ketone (PEEK) meet the legal requirements demanded by the aviation industry for aircraft interiors and for aircraft exteriors too.
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公开(公告)号:WO2022118137A2
公开(公告)日:2022-06-09
申请号:PCT/IB2021/060884
申请日:2021-11-23
Applicant: SHPP GLOBAL TECHNOLOGIES B.V.
Inventor: RAMALINGAM, Hariharan , WANG, Zheng , HOOGLAND, Gabrie
IPC: C08K3/22 , C08K7/10 , G02B1/04 , C08L23/08 , C08L45/00 , C08L81/06 , C08L79/08 , C08J3/20 , C08J5/18 , C08J3/21 , C08J2323/08 , C08J2345/00 , C08J2379/08 , C08J2381/06 , C08J3/212 , C08K2003/2227 , C08K2201/003 , C08K2201/004 , C08K2201/005 , C08K2201/006
Abstract: A composition including particular amounts of a polyetherimide, a poly(arylene ether sulfone), or a cyclic olefin copolymer and a filler is described herein. Samples of the composition can exhibit an advantageous combination of properties, and the composition can be used in various articles. Methods of making the composition are also described.
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公开(公告)号:WO2022002628A1
公开(公告)日:2022-01-06
申请号:PCT/EP2021/066551
申请日:2021-06-18
Applicant: EVONIK OPERATIONS GMBH
Inventor: TRASSL, Christian , BERNHARD, Kay , ROOSEN, Dirk , HOLLEYN, Denis , PAREMAL, Vinod
IPC: C08J9/04 , C08J9/232 , C08J9/36 , C08J2205/04 , C08J2379/08
Abstract: Polymer foams based on polyetherimides (PEI) meet the legal requirements of the aerospace industry for both the interior and exterior of aircraft.
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公开(公告)号:WO2021120348A1
公开(公告)日:2021-06-24
申请号:PCT/CN2020/070603
申请日:2020-01-07
Applicant: 武汉华星光电半导体显示技术有限公司
Inventor: 汪亚民
IPC: C08G73/10 , C08J5/18 , C08L79/08 , C08G73/1085 , C08J2379/08
Abstract: 一种薄膜材料及其制备方法。该薄膜材料的制备方法包括:化合物A和第一反应物反应形成化合物B;化合物B和第二反应物反应形成化合物C;化合物C和第三反应物反应形成聚合物D;聚合物D反应得到包括聚合物F或包括聚合物H的混合物;包括聚合物F的溶液或包括聚合物H的溶液在基板上形成聚合物F或聚合物H。
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公开(公告)号:WO2021189723A1
公开(公告)日:2021-09-30
申请号:PCT/CN2020/101893
申请日:2020-07-14
Applicant: 中天电子材料有限公司
IPC: C08L79/08 , C08J5/18 , G09F9/30 , C08J2379/08 , G09F9/301
Abstract: 本发明提供一种聚酰亚胺无色透明薄膜及其制备方法、光学PI膜。所述聚酰亚胺无色透明薄膜不但具有优良的透光性(≥85%@500nm),同时具有高模量(拉伸模量≥3.8GPa)、低热膨胀系数(≤30ppm/℃,50-200℃)等特点,可满足柔性光电显示器件的使用需求。
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公开(公告)号:WO2021128544A1
公开(公告)日:2021-07-01
申请号:PCT/CN2020/075830
申请日:2020-02-19
Applicant: 深圳市华星光电半导体显示技术有限公司
Inventor: 李林霜
IPC: C08G73/10 , C08L79/08 , C08J5/18 , C08G73/1007 , C08G73/1039 , C08G73/1042 , C08G73/1082 , C08J2379/08 , G09F9/301
Abstract: 提供一种柔性基板及其制备方法,柔性基板包括柔性衬底,柔性衬底为聚酰亚胺薄膜,聚酰亚胺的结构式为: (I) 聚酰亚胺具有刚性链段和柔性链段;聚酰亚胺薄膜分为刚性区域和柔性区域,刚性区域上以刚性链段为主,柔性区域上以柔性链段为主。因聚酰亚胺具有刚性链段和柔性链段,可将聚酰亚胺应用于柔性基板中。
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公开(公告)号:WO2019160287A8
公开(公告)日:2019-08-22
申请号:PCT/KR2019/001631
申请日:2019-02-11
Applicant: 주식회사 엘지화학
IPC: C08L63/00 , H05K1/03 , C08L79/02 , C08L79/04 , C08L79/08 , C08K3/013 , C08L65/00 , C08J5/24 , B32B15/08 , B32B15/043 , B32B15/12 , B32B15/14 , B32B15/18 , B32B15/20 , B32B2250/03 , B32B2250/40 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/02 , B32B2262/0261 , B32B2262/0269 , B32B2262/0276 , B32B2262/062 , B32B2262/101 , B32B2264/101 , B32B2264/102 , B32B2264/12 , B32B2307/30 , B32B2307/538 , B32B2307/728 , B32B2307/732 , B32B2457/08 , B32B2457/14 , B32B2553/00 , B32B27/20 , B32B5/022 , B32B5/024 , B32B5/028 , C08G14/06 , C08G73/0253 , C08J2363/00 , C08J2379/08 , C08J2463/00 , C08J2479/04 , C08J2479/08 , C08J2481/06 , C08J5/043 , C08J5/121 , C08L2203/20 , C08L2205/025 , C08L2205/035 , C08L61/34 , C08L79/085 , H01L23/145 , H05K1/0366
Abstract: 본 발명은 흐름성과 강성이 우수한 반도체 패키지용 열경화성 수지 조성물 및 이를 이용한 프리프레그 (THERMOSETTING RESIN COMPOSITION FOR SEMICONDUCTOR PAKAGE AND PREPREGE USING THE SAME)에 관한 것이다. 구체적으로, 에폭시 수지, 비스말레이미드 수지, 디아미노디페닐 설폰 수지 및 벤즈옥사진 수지를 포함하는 바인더 수지 시스템에, 평균 입경이 서로 다른 3종의 특정 충진제를 포함함으로써, 종래보다 충진제의 함량이 높아도 우수한 흐름성과 강성을 확보할 수 있어서 박형화된 전자 기기의 구동성에 기여할 수 있는 반도체 패키지용 열경화성 수지 조성물 및 이를 이용한 프리프레그, 이러한 프리프레그를 포함한 금속박 적층판이 제공된다.
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公开(公告)号:WO2021217074A8
公开(公告)日:2021-10-28
申请号:PCT/US2021/028949
申请日:2021-04-23
Applicant: MAGUIRE, Stephen, B.
Inventor: MAGUIRE, Stephen, B.
IPC: C08K5/09 , C08J3/205 , C08K5/00 , B29C48/06 , B29C48/29 , B29C45/00 , C08J3/22 , C08K3/013 , B29K105/00 , B29C45/0001 , B29C48/022 , B29K2105/0032 , B29K2995/002 , C08J2300/30 , C08J2325/06 , C08J2327/06 , C08J2327/18 , C08J2379/08 , C08J2491/00 , C08J3/2053 , C08K5/0041 , C08K5/005 , C08K5/103
Abstract: A method of fabricating plastic products having a preselected color, comprising preparing a dispersion of pigment of the preselected color in cottonseed oil; supplying a preselected plastic resin for the product to be fabricated to a process machine having a rotating screw; furnishing the dispersion to the process machine at a position adjacent to threaded portion of the rotating screw; and blending the dispersion and the resin by rotating the screw.
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