摘要:
There is disclosed a method of placing a substrate into a controlled conductivity plasma electrolytic oxidation (PEO) bath configured for the substrate; wherein the PEO bath includes a nitrogen containing organic compound, and applying a voltage for a period of time to produce a substantially continuous nitride or nitrogen compound containing PEO layer of between about 1 to about 100 microns thick on the substrate. The substrates are preferably magnesium, titanium, or aluminium. The PEO process is preferably carried out under alkaline conditions and at voltages of less than about 160 volts.
摘要:
Summary The present invention relates to a method for producing coated substrate bodies, wherein a plurality of substrate bodies comprising surfaces to be coated are provided with a colored coating surface, the method comprising following steps: - providing the substrate bodies to be coated in the interior of a vacuum coating chamber, - depositing a coating on a surface of the substrate bodies to be coated, the deposition of the coating involving the deposition of a metallic layer comprising at least two different metals, - forming a colored oxide layer exhibiting a colored surface by anodic oxidation of the metallic layer, wherein: - the anodic oxidation takes place in an alkaline electrolyte bath with the coated substrate bodies connected as anodes.
摘要:
The present subject matter relates to fabrication of micro-arc oxidation (MAO) based insert-molded components. In an example implementation, a method of fabricating a MAO based insert-molded component comprises forming an insert-molded component and oxidizing the insert-molded component through MAO. The insert-molded component has a metal body molded with a plastic body. On oxidation of the insert-molded component through MAO an oxide layer is formed on the metal body.
摘要:
Die vorliegende Erfindung betrifft ein LED-Modul mit einem Substratkörper und einer LED (1) darauf, wobei der Substratkörper aus einem Kern aus einem Metallmaterial aufgebaut ist, der vorderseitig und rückseitig jeweils zumindest bereichsweise mit einer Schicht aus einem Keramikmaterial (5) versehen ist, und wobei ein auf der vorderseitigen Keramikschicht (5a) vorgesehener vorderseitiger Leiterzug (2a) mit einem auf der rückseitigen Keramikschicht (5b) vorgesehenen rückseitigen Leiterzug (2b) über einen ein Durchgangsloch in dem Metallkern (4) durchsetzenden Durchkontakt (2c) elektrisch leitend verbunden ist, wobei dieses Durchgangsloch auch mit dem Keramikmaterial (5) ausgekleidet und der Durchkontakt (2c) so von dem Metallkern (4) elektrisch isoliert ist.
摘要:
A metal substrate with insulated vias (MSIV) has a metallic layer with through- holes defined through a thickness of the layer, a dielectric layer formed on part of the surface of the metallic layer and extending to cover internal walls of the through-hole, a conductive material extending through the insulated through- hole to form an insulated via, and an electrical circuit formed on a portion of the dielectric layer in thermal and/or electrical contact with the conductive via. The dielectric layer is a dielectric nanoceramic layer having an equiaxed crystalline structure with an average grain size of 500 nanometres or less, a thickness of between 0.1 and 100 micrometres, a dielectric strength of greater than 20 KV mm-1, and a thermal conductivity of greater than 3 W/mK. Such a MSIV can be used as an electronic substrate to support devices such as power, microwave, optoelectronic, solid-state lighting and thermoelectric devices.
摘要:
A flexible electronic substrate (FES) comprises a metallic layer, a dielectric nanoceramic layer formed by oxidation of a surface of the metallic layer, and an electrical circuit formed on a surface of the dielectric layer. The FES may be used for supporting a device, for example a flexible display, an OLED, an optoelectronic device, or a rf device. The dielectric nanoceramic layer has a crystalline structure consisting of substantially equiaxed grains having an average grain size of 100 nanometres or less, a thickness of between 1 micrometre and 50 micrometres, a dielectric strength of greater than 20 KV mm-1, and a thermal conductivity of greater than 3 W/mK. The FES has a minimum bend radius of lower than 25 cm.
摘要翻译:柔性电子基板(FES)包括金属层,通过氧化金属层的表面形成的电介质纳米陶瓷层和形成在电介质层的表面上的电路。 FES可以用于支持设备,例如柔性显示器,OLED,光电子器件或rf器件。 电介质纳米陶瓷层具有由平均粒径为100纳米或更小,厚度为1微米至50微米,介电强度大于20KV /毫米-1的基本等轴晶粒和热导率 大于3 W / mK。 FES的最小弯曲半径低于25厘米。
摘要:
L'invention concerne un procédé d'obtention d'un récipient de cuisson (1) comportant les étapes suivantes: réalisation d'une cuve (10) présentant une face extérieure (11) en aluminium et une face intérieure (12), réalisation d'une anodisation dure d'au moins la face extérieure (11) de la cuve (10). Selon l'invention, au moins une étape de coloration est réalisée sur la face extérieure anodisée après l'anodisation dure, ladite étape de coloration mettant en œuvre au moins un pigment minéral hydrosoluble. L'invention concerne également un article culinaire ou un appareil électrique de cuisson comportant un récipient de cuisson obtenu selon le procédé précité.
摘要:
The invention relates to a removable anodising agent, in particular for local anodic oxidation of metal surfaces, and its use, and a method for anodic oxidation by means of an anodising agent according to the invention.