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公开(公告)号:WO2022005820A1
公开(公告)日:2022-01-06
申请号:PCT/US2021/038507
申请日:2021-06-22
Applicant: MICRON TECHNOLOGY, INC.
Inventor: MATSUBARA, Yasushi , JONO, Yusuke , MORGAN, Donald, Martin , YAMAMOTO, Nobuo
IPC: G11C11/22 , G11C7/06 , G11C11/2273 , G11C11/2275 , G11C2207/2281 , G11C2207/229 , G11C7/065 , G11C7/1027 , G11C7/1039 , G11C7/18 , G11C7/20
Abstract: Methods, systems, and devices for system and method for reading and writing memory management data through a non-volatile cell based register are described. A memory device may include a set of latch units addressable via a set of row lines and a set of column lines. Each latch unit may include a sense amplifier coupled with a first line and a first non-volatile capacitor coupled with the first line and a second line, where the first capacitor is configured to store a charge representing one or more bits. Additionally, each latch unit may include a second capacitor coupled with the first line and a third line, where the second capacitor is configured to amplify a voltage at the first line based on the charge stored in the first capacitor.
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公开(公告)号:WO2021030750A1
公开(公告)日:2021-02-18
申请号:PCT/US2020/046506
申请日:2020-08-14
Applicant: SUPERMEM, INC.
Inventor: LU, Yu , LIN, Chieh-yu
IPC: G11C7/00 , G11C11/1675 , G11C11/2273 , G11C11/408 , G11C11/4091 , G11C11/4096 , G11C13/0004 , G11C13/0007 , G11C13/004 , G11C16/26 , G11C7/06 , G11C7/106
Abstract: Memories, memory controllers, and computing systems and their methods of operation are disclosed. In some embodiments, a method of accessing a memory includes accessing a first bit line corresponding to a sense amplifier and accessing a second bit line corresponding to the sense amplifier. In some embodiments, a memory controller includes a second memory configured to store data of a second data type. In some embodiments, a method includes operating a memory in a second mode in response to receiving an input to change the operation of the memory from a first mode to the second mode.
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公开(公告)号:WO2021194996A1
公开(公告)日:2021-09-30
申请号:PCT/US2021/023535
申请日:2021-03-22
Applicant: HSU, Fu-Chang
Inventor: HSU, Fu-Chang
IPC: H01L27/11551 , H01L27/11553 , H01L27/11563 , H01L27/11578 , H01L27/1158 , G11C11/1673 , G11C11/1675 , G11C11/2273 , G11C11/2275 , G11C13/004 , G11C13/0069 , G11C16/10 , G11C16/26 , G11C17/18 , G11C2213/71 , G11C2213/75 , H01L27/11206 , H01L27/11582 , H01L27/11597 , H01L27/228 , H01L27/2454 , H01L27/249
Abstract: A three dimensional double-density memory array is disclosed. In an embodiment, a three-dimensional (3D) double density array comprises a string of memory devices that are configured so that a first portion of the memory devices form a first channel and a second portion of the memory devices form a second channel. The array also comprises a plurality of word lines coupled to the string of memory devices. Each word line is coupled to a memory device that forms the first channel and a memory device that forms the second channel. The array also comprises at least one drain select gate that couples the first and second channels to a bit line.
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公开(公告)号:WO2021194834A1
公开(公告)日:2021-09-30
申请号:PCT/US2021/022897
申请日:2021-03-18
Applicant: MICRON TECHNOLOGY, INC.
Inventor: VIMERCATI, Daniele
IPC: G11C11/22 , G11C11/221 , G11C11/2259 , G11C11/2273
Abstract: Methods, systems, and devices for memory array with multiplexed select lines are described. In some cases, a memory cell of the memory device may include a storage component, a first transistor coupled with a word line, and a second transistor coupled with a first select line to selectively couple the memory cell with a first digit line. A third transistor may be coupled with the first digit line and a sense component common to a set of digit lines and a set of select lines. A second select line may be coupled with the third transistor and configured to couple the sense component with the first digit line and to couple the sense component with a second digit line. The sense component may determine a logic state stored by the memory cell based on the signal from the first digit line and the signal from the second digit line.
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公开(公告)号:WO2021194833A1
公开(公告)日:2021-09-30
申请号:PCT/US2021/022895
申请日:2021-03-18
Applicant: MICRON TECHNOLOGY, INC.
Inventor: VISCONTI, Angelo , PAZZOCCO, Riccardo , STRAND, Jonathan, J. , MAJERUS, Kevin, T.
IPC: G11C11/22 , G11C5/14 , G11C11/221 , G11C11/2259 , G11C11/2273 , G11C11/2275 , G11C29/50
Abstract: Methods, systems, and devices for charge leakage detection for memory system reliability are described. In accordance with examples as disclosed herein, a memory system may employ memory management techniques configured to identify precursors of charge leakage in a memory device, and take preventative action based on such identified precursors. For example, a memory system may be configured to perform a leakage detection evaluation for a memory array, which may include various biasing and evaluation operations to identify whether a leakage condition of the memory array may affect operational reliability. Based on such an evaluation, the memory device, or a host device in communication with the memory device, may take various preventative measures to avoid operational failures of the memory device or host device that may result from ongoing operation of a memory array associated with charge leakage, thereby improving reliability of the memory system.
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公开(公告)号:WO2023278948A1
公开(公告)日:2023-01-05
申请号:PCT/US2022/073036
申请日:2022-06-17
Applicant: MICRON TECHNOLOGY, INC.
Inventor: VIMERCATI, Daniele
IPC: G11C11/22 , G11C11/2255 , G11C11/2257 , G11C11/2259 , G11C11/2273 , G11C11/2297 , G11C11/4074 , G11C11/4085 , G11C11/4091 , G11C11/4096 , G11C11/4097 , G11C2207/2281 , G11C2211/4013 , G11C5/063
Abstract: Methods, systems, and devices for sensing techniques for differential memory cells are described. A method may include selecting a pair of memory cells that comprise a first memory cell coupled with a first digit line and a second memory cell coupled with a second digit line for a read operation, the pair of memory cells storing one bit of information. The method may further include applying a first voltage to a plate line coupled with the first memory cell and the second memory cell and applying a second voltage to a select line to couple the first digit line and the second digit line with a sense amplifier. The amplifier may sense a logic state of the pair of memory cells based on a difference between a third voltage of the first digit line and a fourth voltage of the second digit line.
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公开(公告)号:WO2021202064A1
公开(公告)日:2021-10-07
申请号:PCT/US2021/021508
申请日:2021-03-09
Applicant: MICRON TECHNOLOGIES, INC.
Inventor: LOCATELLI, Andrea , SERVALLI, Giorgio , VISCONTI, Angelo
IPC: G11C11/22 , G11C11/221 , G11C11/2273 , G11C11/406 , G11C11/4091 , G11C11/4096 , G11C11/4097
Abstract: Methods, systems, and devices for biasing a memory cell during a read operation are described. For example, a memory device may bias a memory cell to a first voltage (e.g., a read voltage) during an activation phase of a read operation. After biasing the memory cell to the first voltage, the memory device may bias the memory cell to a second voltage greater than the first voltage (e.g., a write voltage) during the activation phase of the read operation. After biasing the memory cell to the second voltage, the memory device may initiate a refresh phase of the read operation. Based on a value stored by the memory cell prior to biasing the memory cell to the first voltage, the memory device may initiate a precharge phase of the read operation.
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公开(公告)号:WO2021126558A2
公开(公告)日:2021-06-24
申请号:PCT/US2020/063415
申请日:2020-12-04
Applicant: MICRON TECHNOLOGY, INC.
Inventor: SWAMI, Shivam , EILERT, Sean, S. , AKEL, Ameen, D.
IPC: H01L27/24 , H01L45/00 , G11C11/221 , G11C11/2255 , G11C11/2257 , G11C11/2259 , G11C11/2273 , G11C11/2275 , G11C11/2293 , G11C11/2297
Abstract: Methods, systems, and devices for via formation in a memory device are described. A memory cell stack for a memory array may be formed. In some examples, the memory cell stack may comprise a storage element. A via may also be formed in an area outside of the memory array, and the via may protrude from a material that surrounds the via. A material may then be formed above the memory cell stack and also above the via, and the top surface of the barrier material may be planarized until at least a portion of the via is exposed. A subsequently formed material may thereby be in direct contact with the top of the via, while a portion of the initially formed material may remain above the memory cell stack.
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公开(公告)号:WO2021126557A1
公开(公告)日:2021-06-24
申请号:PCT/US2020/063414
申请日:2020-12-04
Applicant: MICRON TECHNOLOGY, INC.
Inventor: SWAMI, Shivam , EILERT, Sean, S. , AKEL, Ameen, D.
IPC: G11C11/22 , G11C7/06 , G06F3/06 , G11C11/221 , G11C11/2255 , G11C11/2257 , G11C11/2259 , G11C11/2273 , G11C11/2275 , G11C11/2297
Abstract: Methods, systems, and devices for memory accessing with auto-precharge are described. For example, a memory system may be configured to support an activate with auto-precharge command, which may be associated with a memory device opening a page of memory cells, latching respective logic states stored by the memory cells at a row buffer, writing logic states back to the page of memory cells, and maintaining the latched logic states at the row buffer (e.g., while maintaining power to latches of the row buffer, after closing the page of memory cells, while the page of memory cells is closed).
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公开(公告)号:WO2022031349A1
公开(公告)日:2022-02-10
申请号:PCT/US2021/034643
申请日:2021-05-27
Applicant: SANDISK TECHNOLOGIES LLC
Inventor: CUI, Zhixin , CHIBVONGODZE, Hardwell , GAUTAM, Rajdeep
IPC: G11C16/10 , G11C11/22 , G11C16/04 , G11C16/26 , G11C17/16 , G11C17/18 , H01L23/522 , G11C11/005 , G11C11/223 , G11C11/2273 , G11C11/2275 , G11C16/0408 , G11C16/0466 , G11C2216/26 , H01L23/5226 , H01L27/11206 , H01L27/11519 , H01L27/11521 , H01L27/11556 , H01L27/11565 , H01L27/11568 , H01L27/11582 , H01L27/11587 , H01L27/1159 , H01L27/11597
Abstract: First alternating stacks of first insulating strips and first spacer material strips is formed in a first device region, second alternating stacks of second insulating strips and second spacer material strips are formed in a second device region. Each of the first line trenches is filled with a respective laterally alternating sequence of memory stack structures and first dielectric pillar structures to form a three-dimensional NAND memory. Each of the memory stack structures includes a vertical semiconductor channel and a vertical stack of memory elements. Each of the second line trenches with a respective laterally alternating sequence of active region assemblies of lateral field effect transistors and second dielectric pillar structures to form a three-dimensional NOR memory. Each of the active region assemblies includes a source pillar, a drain pillar, and a tubular channel region. The spacer material strips include, or are subsequently replaced with, electrically conductive strips.
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