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公开(公告)号:CN1674252A
公开(公告)日:2005-09-28
申请号:CN200410102893.7
申请日:2004-12-24
申请人: LG电线株式会社
IPC分类号: H01L21/78 , H01L21/301 , H01L21/304 , C09J7/00 , C09J5/00
CPC分类号: H01L21/78 , C09J7/22 , C09J7/35 , C09J2201/134 , C09J2203/326 , C09J2463/00 , C09J2467/006 , C09J2479/08 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83856 , H01L2224/85201 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247
摘要: 本发明提供一种切割膜及使用该切割膜的半导体组件制造方法,该切割膜在切割后的拾取步骤,可以容易地从切割用粘着膜分离晶粒及晶粒粘结膜,并可以防止剩余的粘着物残留在晶粒粘结膜的背面。该切割膜包括:收缩性离型膜,其由加热时收缩的材料构成;晶粒粘结膜,其被涂布在所述收缩性离型膜的一个面上;切割用粘着膜,其结合在所述收缩性离型膜的另一个面上。
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公开(公告)号:CN1320634C
公开(公告)日:2007-06-06
申请号:CN200410102893.7
申请日:2004-12-24
申请人: LG电线株式会社
IPC分类号: H01L21/78 , H01L21/301 , H01L21/304 , C09J7/00 , C09J5/00
CPC分类号: H01L21/78 , C09J7/22 , C09J7/35 , C09J2201/134 , C09J2203/326 , C09J2463/00 , C09J2467/006 , C09J2479/08 , H01L21/6836 , H01L24/27 , H01L24/29 , H01L24/45 , H01L24/73 , H01L24/83 , H01L2221/68327 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/73265 , H01L2224/83191 , H01L2224/83856 , H01L2224/85201 , H01L2224/92247 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/0665 , H01L2924/07802 , H01L2924/10253 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2224/32245 , H01L2224/48247
摘要: 本发明提供一种切割膜及使用该切割膜的半导体组件制造方法,该切割膜在切割后的拾取步骤,可以容易地从切割用粘着膜分离晶粒及晶粒粘结膜,并可以防止剩余的粘着物残留在晶粒粘结膜的背面。该切割膜包括:收缩性离型膜,其由加热时收缩的材料构成;晶粒粘结膜,其被涂布在所述收缩性离型膜的一个面上;切割用粘着膜,其结合在所述收缩性离型膜的另一个面上。
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