公开(公告)号：EP2756040A1

公开(公告)日：2014-07-23

申请号：EP11872399.8

申请日：2011-10-11

申请人： Dow Corning (China) Holding Co. Ltd. ,  Dow Corning Corporation

发明人： FANG, Lei ,  HARKNESS, Brian ,  LI, Xiucuo ,  TONGE, Lauren ,  TONGE, James

IPC分类号： C08L83/14

CPC分类号： C08K9/06 ,  C08G77/12 ,  C08G77/20 ,  C08G77/50 ,  C08K3/36 ,  C08L83/00 ,  C08L83/04 ,  C08L83/14 ,  C09D183/04 ,  C09D183/14 ,  C09J183/04

摘要： Filled silicone composition, in situ preparation and use thereof are provided. The composition comprises a mixture of (A) an in situ-prepared treated silica, (B) an in situ-prepared (siloxane-alkylene)-endblocked polydiorganosiloxane, (c) a cure catalyst and (D) a crosslinker. Moreover, the composition can be used as adhesive, coating and sealant.

公开(公告)号：EP2756040B1

公开(公告)日：2018-06-20

申请号：EP11872399.8

申请日：2011-10-11

申请人： Dow Corning (China) Holding Co. Ltd. ,  Dow Silicones Corporation

发明人： FANG, Lei ,  HARKNESS, Brian ,  LI, Xiucuo ,  TONGE, Lauren ,  TONGE, James

IPC分类号： C08L83/14 ,  C09D183/14

CPC分类号： C08K9/06 ,  C08G77/12 ,  C08G77/20 ,  C08G77/50 ,  C08K3/36 ,  C08L83/00 ,  C08L83/04 ,  C08L83/14 ,  C09D183/04 ,  C09D183/14 ,  C09J183/04

摘要： Filled silicone composition, in situ preparation and use thereof are provided. The composition comprises a mixture of (A) an in situ-prepared treated silica, (B) an in situ-prepared (siloxane-alkylene)-endblocked polydiorganosiloxane, (c) a cure catalyst and (D) a crosslinker. Moreover, the composition can be used as adhesive, coating and sealant.

公开(公告)号：EP1442071A1

公开(公告)日：2004-08-04

申请号：EP02776148.5

申请日：2002-10-04

申请人： DOW CORNING CORPORATION

发明人： BOISVERT, Ronald ,  GRIGORAS, Stelian ,  HA, David ,  HARKNESS, Brian ,  YEAKLE, Craig

IPC分类号： C08G77/12 ,  C09D183/04 ,  H01L21/312

CPC分类号： C08L83/04 ,  C08G77/06 ,  C08G77/12 ,  C08G77/16 ,  C08G77/70 ,  C09D183/04 ,  H01L21/02126 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/76801 ,  Y10T428/24917

摘要： Silicone resins comprising 5 to 50 mole% of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole% (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.

公开(公告)号：EP2052292A2

公开(公告)日：2009-04-29

申请号：EP07836621.8

申请日：2007-08-08

申请人： Dow Corning Corporation

发明人： MEYNEN, Herman C.G.D.C. ,  HARKNESS, Brian

IPC分类号： G03F7/075 ,  G03F7/32

CPC分类号： G03F7/0757 ,  G03F7/325 ,  Y10T428/24802

摘要： A method of preparing a patterned film on a substrate includes applying a silicone composition onto a substrate to form a film of the silicone composition. A portion of the film is exposed to radiation to produce a partially exposed film having an exposed region and a non-exposed region. The partially exposed film is heated for a sufficient amount of time and at a sufficient temperature to substantially insolubilize the exposed region in a developing solvent that includes a siloxane component. The non-exposed region of the partially exposed film is removed with the developing solvent to reveal a film-free region on the substrate and to form the patterned film including the exposed region that remains on the substrate. The film-free regions is substantially free of residual silicone due to the presence of the siloxane component in the developing solvent.

公开(公告)号：EP1803033A2

公开(公告)日：2007-07-04

申请号：EP05793402.8

申请日：2005-08-31

申请人： Dow Corning Corporation

发明人： BAHADUR, Maneesh ,  CHEN, Wei ,  ALBAUGH, John ,  HARKNESS, Brian ,  TONGE, James

IPC分类号： G03F7/00 ,  G03F7/027 ,  G03F7/004

CPC分类号： B82Y10/00 ,  B82Y40/00 ,  C08F220/18 ,  C08F220/22 ,  C08F222/1006 ,  G03F7/0002 ,  G03F7/0046 ,  G03F7/027

摘要： A method includes the steps of: A) filling a silicone mold having a patterned surface with a curable (meth)acrylate formulation, B) curing the curable (meth)acrylate formulation to form a patterned feature, C) separating the silicone mold and the patterned feature, optionally D) etching the patterned feature, and optionally E) repeating steps A) to D) reusing the silicone mold. The curable (meth)acrylate formulation contains a fluorofunctional (meth)acrylate, a (meth)acrylate, and a photoinitiator.

公开(公告)号：EP1362364A2

公开(公告)日：2003-11-19

申请号：EP02717346.7

申请日：2002-01-17

申请人： DOW CORNING CORPORATION

发明人： BECKER, Gregory ,  GARDNER, Geoffrey ,  HARKNESS, Brian ,  MALENFANT, Louise ,  SARMAH, Satyendra

IPC分类号： H01L21/00

CPC分类号： G03F7/425 ,  G03F7/0012 ,  G03F7/0757 ,  H01L23/3107 ,  H01L23/3171 ,  H01L2924/0002 ,  H01L2924/00

摘要： A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the active surface of the wafer, provided at least a portion of each bond pad is not covered with the silicone layer and wherein the silicone layer is prepared by the method of the invention.

公开(公告)号：EP1987084B1

公开(公告)日：2014-11-05

申请号：EP07749880.6

申请日：2007-02-01

申请人： Dow Corning Corporation ,  Dow Corning Toray Co., Ltd.

发明人： CHENG, Tammy ,  HARKNESS, Brian ,  ENAMI, Hiroji ,  KATO, Tomoko ,  MORITA, Yoshitsugu ,  MURAKAMI, Masashi ,  TERADA, Masayoshi ,  YOSHITAKE, Makoto ,  CUMMINGS, Michelle ,  NORRIS, Ann, Walstrom ,  HOWELL, Malinda

IPC分类号： C08G77/52 ,  C08K5/5425 ,  C08L83/04 ,  H01L33/00 ,  C08L83/07

CPC分类号： C08K5/5425 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

公开(公告)号：EP1987084A2

公开(公告)日：2008-11-05

申请号：EP07749880.6

申请日：2007-02-01

申请人： Dow Corning Corporation ,  Dow Corning Toray Co., Ltd.

发明人： CHENG, Tammy ,  HARKNESS, Brian ,  ENAMI, Hiroji ,  KATO, Tomoko ,  MORITA, Yoshitsugu ,  MURAKAMI, Masashi ,  TERADA, Masayoshi ,  YOSHITAKE, Makoto ,  CUMMINGS, Michelle ,  NORRIS, Ann, Walstrom ,  HOWELL, Malinda

IPC分类号： C08G77/52 ,  C08K5/5425 ,  C08L83/04 ,  H01L33/00 ,  C08L83/07

CPC分类号： C08K5/5425 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08G77/80 ,  C08K5/5435 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L33/56 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014 ,  H01L2924/00

摘要： A composition includes: (I) an alkenyl functional, phenyl-containing polyorganosiloxane, an Si—H functional phenyl-containing polyorganosiloxane, or a combination thereof; (II) a hydrogendiorganosiloxy terminated oligodiphenylsiloxane having specific molecular weight, an alkenyl-functional, diorganosiloxy-terminated oligodiphenylsiloxane having specific molecular weight, or a combination thereof; and (III) a hydrosilylation catalyst. A light emitting device is made by applying the composition onto a light source followed by curing. The composition provides a cured material with mechanical properties suited for use as an encapsulant for a light emitting device.

公开(公告)号：EP2534218A1

公开(公告)日：2012-12-19

申请号：EP10795183.2

申请日：2010-12-15

申请人： Dow Corning Corporation

发明人： HARKNESS, Brian

IPC分类号： C09J5/06

CPC分类号： H01L21/6835 ,  C08G77/12 ,  C08G77/20 ,  C08K5/56 ,  C08L83/00 ,  C09J5/06 ,  C09J183/04 ,  C09J2203/326 ,  C09J2205/302 ,  H01L21/6836 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/6835

摘要： A method for temporary wafer bonding employs a curable adhesive composition and a degradation agent combined with the curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organosilicon compound containing an average of at least two silicon-bonded hydrogen atoms per molecule in an amount sufficient to cure the composition, (C) a catalytic amount of a hydrosilylation catalyst, and (D) a base. The film prepared by curing the composition is degradable and removable by heating.

公开(公告)号：EP1442071B1

公开(公告)日：2011-03-23

申请号：EP02776148.5

申请日：2002-10-04

申请人： Dow Corning Corporation

发明人： BOISVERT, Ronald ,  GRIGORAS, Stelian ,  HA, David ,  HARKNESS, Brian ,  YEAKLE, Craig

IPC分类号： C08G77/12 ,  C09D183/04 ,  H01L21/312

CPC分类号： C08L83/04 ,  C08G77/06 ,  C08G77/12 ,  C08G77/16 ,  C08G77/70 ,  C09D183/04 ,  H01L21/02126 ,  H01L21/02282 ,  H01L21/3122 ,  H01L21/76801 ,  Y10T428/24917

摘要： Silicone resins comprising 5 to 50 mole% of (PhSiO3-x)/2(OH)x) units and 50 to 95 mole% (HSiO(3-x)/2(OH)x), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.