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公开(公告)号：EP3526354B1
公开(公告)日：2024-05-01
申请号：EP17860092.0
申请日：2017-10-06
CPC分类号： C22C9/00 , C23C8/10 , C23C10/28 , C23C12/02 , C25D5/48 , C25D5/50 , C25D7/0607 , C23C28/321 , C23C28/345 , B23H7/08 , B23K35/282 , B23K35/302 , B23K35/40 , B23K35/02 , B23K35/0216 , B23K35/0272 , C22F1/08 , C22C9/04 , B23K35/30
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公开(公告)号：EP2759622B1
公开(公告)日：2018-11-28
申请号：EP12834344.9
申请日：2012-09-10
IPC分类号： B32B15/01 , C22C5/06 , C22C5/08 , C22C5/10 , C22C9/02 , C22C9/04 , C22C13/02 , C22C19/03 , C22C19/07 , C22C22/00 , C22C27/06 , C22C38/00 , C25D5/10 , C25D5/12 , C25D5/50 , C23C18/16 , H05K3/24 , H01B1/02 , C25D3/12 , C25D3/20 , C25D3/30 , C25D3/38 , C25D3/46 , C25D3/50 , C25D3/56 , C25D3/62 , C25D3/64 , H01R13/03 , H05K1/11
CPC分类号： H01B1/02 , B32B15/01 , B32B15/018 , C22C5/06 , C22C5/08 , C22C5/10 , C22C9/00 , C22C9/02 , C22C9/04 , C22C13/00 , C22C13/02 , C22C19/03 , C22C19/07 , C22C22/00 , C22C27/06 , C22C38/00 , C23C18/1651 , C23C18/1692 , C25D3/12 , C25D3/20 , C25D3/30 , C25D3/38 , C25D3/46 , C25D3/50 , C25D3/567 , C25D3/62 , C25D3/64 , C25D5/10 , C25D5/12 , C25D5/505 , H01R13/03 , H05K1/117 , H05K1/118 , H05K3/244 , H05K2201/0341 , Y10T428/12681 , Y10T428/12708 , Y10T428/12715 , Y10T428/12722
摘要： There are provided a metal material for electronic component which has low insertability/extractability, low whisker formability, and high durability, and a method for manufacturing the metal material. The metal material 10 for electronic components has a base material 11, an A layer 14 constituting a surface layer on the base material 11 and formed of Sn, In or an alloy thereof, and a B layer 13 constituting a middle layer provided between the base material 11 and the A layer 14 and formed of Ag, Au, Pt, Pd, Ru, Rh, Os, Ir or an alloy thereof, wherein the surface layer (A layer) 14 has a thickness of 0.002 to 0.2 µm, and the middle layer (B layer) 13 has a thickness of 0.001 to 0.3 µm.
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公开(公告)号：EP3368701A1
公开(公告)日：2018-09-05
申请号：EP17751673.9
申请日：2017-07-27
发明人： GUMMERT, Hermann , PLETT, Thomas , REETZ, Björn
CPC分类号： C22C9/04 , C22F1/08 , F01L3/08 , F01L2101/00 , F01L2103/00 , F01L2820/01 , F16C33/121 , F16C2204/14
摘要： The invention relates to a special brass alloy product comprising 62 – 68 wt.% Cu, 0.2 – 2.2 wt.% Fe, 5.5 – 9.0 wt.% Mn, 3.5 – 7.5 wt.% Al, 0.6 – 2.5 wt.% Si, max. 0.7 wt.% Sn, max. 0.7 wt.% Ni, max. 0.1 wt.% Pb, with the rest being Zn together with unavoidable impurities, and having a portion of α-phase between 15% and 40%. The invention also relates to a method for producing a special brass alloy product of this type, wherein, in a first step, a semi-finished product is produced from a blank with at least one hot forming step, and wherein the semi-finished product is subsequently subjected to a heat treatment between 300°C and 450°C for 3 to 12 hours, in order to form the α-phase portion.
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公开(公告)号：EP3255161B1
公开(公告)日：2018-08-08
申请号：EP17177799.8
申请日：2015-05-13
发明人： REETZ, Björn , GUMMERT, Hermann , PLETT, Thomas
CPC分类号： C22F1/08 , B21C1/003 , C22C9/04 , F16C33/12 , F16C33/121 , F16C2204/10 , F16C2204/14 , F16C2360/24
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公开(公告)号：EP3128019A4
公开(公告)日：2018-06-27
申请号：EP15772250
申请日：2015-03-30
发明人： TAKAZAWA TSUKASA
摘要： {Problem} To provide, at low cost, a copper alloy wire that has high in elongation and that is excellent in workability, i.e. coil formability, and in addition to those, that is also excellent in coil characteristics (service life of the coil), which is obtained by using the copper alloy wire, and that is used, for example, in magnet wires. {Solution means} A copper alloy wire containing 0.1 to 4.0 mass% of Ag, and/or at least one selected from the group consisting of Sn, Mg, Zn, In, Ni, Co, Zr and Cr each at a content of 0.05 to 0.30 mass%, with the balance being Cu and unavoidable impurities, wherein when a cross-section perpendicular to the longitudinal direction of the wire is observed by EBSD in a direction normal to the cross-section, the area ratio of grains having direction is 10% or more of the entire measurement area; and a method of producing the copper alloy wire.
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公开(公告)号：EP3063308A4
公开(公告)日：2018-04-04
申请号：EP14857570
申请日：2014-11-03
申请人： KINALCO INC
发明人： UELAND STIAN M , DAVE VIVEK R
CPC分类号： C22C38/58 , A61L31/022 , A61L31/14 , A61L2400/16 , C21D2201/01 , C21D2211/001 , C21D2211/008 , C22C5/02 , C22C9/01 , C22C9/02 , C22C9/04 , C22C20/00 , C22C22/00 , C22C28/00 , C22C30/02 , C22C30/04 , C22C30/06 , C22C38/002 , C22C38/02 , C22C38/04 , C22C38/105 , C22C38/12 , C22C38/14 , C22C38/34 , C22F1/006 , F03G7/065 , H01B1/02 , H01B7/0009 , H01B7/40 , H04R1/1033 , H04R5/033
摘要： A conductor that resists plastic deformation is provided for an electronic signal-carrying or electric power-carrying cable, cable assembly, or device. The conducting element itself has favorable mechanical properties and therefore combines plastic deformation resistance with conductance. In one embodiment, the superelastic conductor is fabricated using a shape memory alloy such that the transformation temperature of the superelastic conductor is set outside the useful operating range of the conductor. In another embodiment, the conductor is fabricated using a shape memory alloy that is nominally in a martensitic phase under stress free conditions. In both embodiments, the conductor microstructures are able to accommodate externally applied strain, bending, deformation, or other external displacement through mechanisms which do not involve plastic deformation.
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8.发明公开
公开(公告)号：EP3187627A4
公开(公告)日：2018-02-28
申请号：EP15836786
申请日：2015-08-20
发明人： TSURU MASAHIRO , SUMINO YUYA
CPC分类号： C22C9/02 , C22C9/00 , C22C9/01 , C22C9/04 , C22C9/05 , C22C9/06 , C22C9/10 , C22C13/00 , C23C28/021 , C25D5/10 , C25D5/12 , C25D5/50 , C25D7/00 , H01B5/02 , H01R13/03
摘要： A conductive material for connection parts according to the present invention is configured in such a manner that a Cu-Sn alloy coating layer having a Cu content of 20 to 70 at% and an average thickness of 0.2 to 3.0 µm and an Sn coating layer having an average thickness of 0.05 to 5.0 µm are formed on the surface of a base material made from a copper alloy containing specified amounts of Cr and Zr, or specified amounts of Fe and P or a specified amount of Zn.
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9.发明公开RECTANGULAR ROLLED COPPER FOIL, FLEXIBLE FLAT CABLE, ROTATING CONNECTOR, AND METHOD FOR MANUFACTURING RECTANGULAR ROLLED COPPER FOIL 审中-公开矩形轧制铜箔，柔性扁平电缆，旋转连接器以及矩形轧制铜箔的制造方法
公开(公告)号：EP3279346A1
公开(公告)日：2018-02-07
申请号：EP16772470.7
申请日：2016-03-23
发明人： MATSUO Ryosuke , MITOSE Kengo
IPC分类号： C22C9/02 , B21B1/40 , C22C9/00 , C22C9/04 , C22C9/10 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00 , C22F1/00
CPC分类号： H01R35/025 , B21B1/40 , B21B3/00 , B21B2003/005 , C22C9/00 , C22C9/02 , C22C9/04 , C22C9/10 , C22F1/00 , C22F1/08 , H01B1/02 , H01B5/02 , H01B13/00 , H01R43/04
摘要： A rectangular rolled copper foil that can realize an excellent flex resistance at a small bend radius and a method of manufacturing the same are provided.
The rectangular rolled copper foil 1 of the present invention is a rectangular rolled copper foil comprising copper or a copper alloy having a 0.2% yield strength of greater than or equal to 250 MPa, wherein, in a cross section (RD surface 3) perpendicular to a rolling direction, an area ratio of crystal grains oriented at a deviation angle of less than or equal to 12.5° from a Cube orientation is greater than or equal to 8%.摘要翻译： 提供了一种矩形轧制铜箔及其制造方法，该矩形轧制铜箔能够实现在小弯曲半径下的优异的耐弯曲性。 本发明的长方形压延铜箔1是由0.2％屈服强度为250MPa以上的铜或铜合金构成的矩形压延铜箔，其特征在于，在垂直于（RD面3）的截面 在轧制方向上，相对于Cube取向的偏离角小于或等于12.5°的晶粒的面积比率大于或等于8％。
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公开(公告)号：EP3259379A1
公开(公告)日：2017-12-27
申请号：EP16719475.2
申请日：2016-02-16
申请人： Leofasi S.r.l.
摘要： The present invention concerns a metal alloy comprising the following components: - copper in a percentage varying between 62% and 57% by weight on the total weight of the alloy; - bismuth in a percentage varying between 3% and 1% by weight on the total weight of the alloy; and - zinc added to obtain 100% by weight on the total weight of the alloy.
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