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公开(公告)号：EP0371217A2
公开(公告)日：1990-06-06
申请号：EP89117107.6
申请日：1989-09-15
Applicant: SHIPLEY COMPANY INC.
Inventor： Sands, Philip William
CPC classification number: F16L41/00 , Y10S285/901
Abstract: A fitting (10) for connecting a drum (12) containing a fluid product to a pipeline (14) leading to a place of use without introducing contaminant.
Abstract translation: 一种用于连接容纳流体产品到管线（14）的滚筒（12）通向使用地点而不引入污染物接头（10）。
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公开(公告)号：EP0211180A3
公开(公告)日：1989-08-09
申请号：EP86107744.4
申请日：1986-06-06
Applicant: SHIPLEY COMPANY INC.
Inventor： Shipley, Charles R., Jr.
IPC: H05K3/46
CPC classification number: H05K3/465 , H05K3/0023 , H05K3/184 , H05K3/205 , H05K3/4661 , H05K3/4682 , H05K2201/09563 , H05K2203/0565 , H05K2203/1407
Abstract: The invention is for the formation of multilayer circuit boards where layers are formed sequentially using selective plating techniques and photoimaging of permanent dielectric materials to achieve fine line resolution and interconnections between circuits. The invention permits the sequential formation of multilayers of higher density using photoimaging techniques.
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公开(公告)号：EP0287750A3
公开(公告)日：1989-07-19
申请号：EP88100176.2
申请日：1988-01-08
Applicant: SHIPLEY COMPANY INC.
Inventor： Martin, Robert L. , Rajaratnam, M. Martha , Turci, Pamela
IPC: G03F7/02
Abstract: The subject invention involves reduction of light refraction into a photoresist coating over a reflective substrate by the use of a photoactive compound in a photoresist formulation that is the reaction product of a diazooxide and curcumin.
Abstract translation: 本发明涉及通过在作为重氮氧化物和姜黄素的反应产物的光致抗蚀剂制剂中使用光活性化合物将光折射减少到反射底物上的光致抗蚀剂涂层中。
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公开(公告)号：EP0298298A3
公开(公告)日：1989-07-05
申请号：EP88109859.4
申请日：1988-06-21
Applicant: SHIPLEY COMPANY INC.
Inventor： Bladon, Dr. John J.
CPC classification number: C25D5/54 , H05K3/188 , H05K3/424 , H05K3/427 , H05K2203/0716
Abstract: A method for metal plating the surface of an article formed from a nonconductor. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a catalytic metal chalcogenide conversion coating adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.
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公开(公告)号：EP0320601A2
公开(公告)日：1989-06-21
申请号：EP88117392.6
申请日：1988-10-19
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Foust, Donald F. , Philipose, George K.
IPC: C25D5/54
CPC classification number: C25D5/54 , H05K3/188 , H05K3/424 , H05K3/427 , H05K2203/0716 , Y10S205/92
Abstract: A method for metal plating the surface of an article formed from an organic plastic. The method includes a step of passing a current between two electrodes immersed in an electrolyte containing dissolved plating metal. One of the electrodes is the article to be plated and is provided with a surface having areas of a transition metal sulfide adjacent to and in contact with conductive areas. The method is especially useful for the formation of printed circuit boards and is sufficiently versatile to permit formation of a printed circuit board by a process that involves pattern plating.
Abstract translation: 由有机塑料形成的制品的表面进行金属电镀的方法。 该方法包括使浸入含有溶解电镀金属的电解质中的两个电极之间的电流通过的步骤。 其中一个电极是待镀的制品，并且具有与导电区域相邻并与其接触的过渡金属硫化物区域的表面。 该方法对印刷电路板的形成特别有用，并且通过涉及图案电镀的工艺能够形成印刷电路板是足够通用的。
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Patent Agency Ranking
公开(公告)号：EP0242530A3
公开(公告)日：1989-05-10
申请号：EP87102422.0
申请日：1987-02-20
Applicant: SHIPLEY COMPANY INC.
Inventor： Fisher, Gordon
CPC classification number: G01N27/423 , H05K3/241 , H05K3/423
Abstract: A method for determining the effective quantity of an organic additive in an electroplating bath involving passing an inert electrode through a predetermined sequence of voltammetric steps including a step of plating the electrode at a given applied potential, stripping the plated metal at a given applied potential, and conditioning the inert electrode without applied potential; correlating the quantity of additive with the coulombs utilized during the metal stripping step; and using the same predetermined sequence of voltammetric steps for a bath having an unknown quantity of additive.
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公开(公告)号：EP0287750A2
公开(公告)日：1988-10-26
申请号：EP88100176.2
申请日：1988-01-08
Applicant: SHIPLEY COMPANY INC.
Inventor： Martin, Robert L. , Rajaratnam, M. Martha , Turci, Pamela
IPC: G03F7/02
Abstract: The subject invention involves reduction of light refraction into a photoresist coating over a reflective substrate by the use of a photoactive compound in a photoresist formulation that is the reaction product of a diazooxide and curcumin.
Abstract translation: 本发明涉及通过在作为重氮氧化物和姜黄素的反应产物的光致抗蚀剂制剂中使用光活性化合物，将光折射减少为反射基底上的光致抗蚀剂涂层。
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98.发明公开
公开(公告)号：EP0273026A2
公开(公告)日：1988-06-29
申请号：EP87870199.4
申请日：1987-12-22
Applicant: SHIPLEY COMPANY INC.
Inventor： Daniels, Brian Kenneth , Madoux, David Charles , Templeton, Michael Karpovich , Trefonas III, Peter , Woodbrey, James Calvin , Zampani, Anthony
CPC classification number: G03F7/0226 , G03F7/0048 , G03F7/022
Abstract: This invention is directed to novel photoresist processes and compositions having high resolution novalac resins, high resolution photoactive components with several diazoquinone groups per molecule, and solvents having a high solvency power, better safety, improved photospeed, higher contrast and equivalent cast film thickness from lower percent sofids formulations.
Abstract translation: 本发明涉及具有高分辨率诺瓦克树脂的新型光致抗蚀剂工艺和组合物，每分子具有几个重氮醌基团的高分辨率光活性组分和具有高溶解能力，更好的安全性，更高的感光速度，更高的对比度和相当于从较低的 固体含量百分数。
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公开(公告)号：EP0163831A3
公开(公告)日：1987-08-26
申请号：EP85103389
申请日：1985-03-22
Applicant: SHIPLEY COMPANY INC.
Inventor： Gulla, Michael , Dutkewych, Oleh Borys , Bladon, John James
IPC: C23C18/30
CPC classification number: C23C18/30
Abstract: A catalytic adsorbate suspended in an aqueous solution comprising reduced catalytic metal on an organic suspending agent where the reduced catalytic metal has a maximum dimension not exceeding 500 angstroms. The catalytic adsorbate is useful for the electroless metal deposition of substrates that are non-catalytic to electroless metal deposition.
Abstract translation: 悬浮在含有还原的催化金属的有机悬浮剂中的水溶液中的催化吸附物，其中还原的催化金属的最大尺寸不超过500埃。 催化吸附物可用于无电金属沉积的非催化基材的无电金属沉积。
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公开(公告)号：EP0221283A1
公开(公告)日：1987-05-13
申请号：EP86112200.0
申请日：1986-09-03
Applicant: SHIPLEY COMPANY INC.
Inventor： Dutkewych, Oleh Boris
IPC: C23C18/40
CPC classification number: C23C18/40 , H05K1/09 , H05K2203/072 , Y10T428/24917
Abstract: An electroless copper deposit having an elongation capability of at least l0 percent as determined by a mechanical bulge test on a foil having a thickness of between l.5 and 2.0 mils.
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