公开(公告)号：EP2581954A4

公开(公告)日：2014-07-30

申请号：EP11792439

申请日：2011-06-07

申请人： SEKISUI CHEMICAL CO LTD

发明人： NISHIMURA TAKASHI ,  WATANABE TAKASHI

IPC分类号： H01L33/48 ,  C08K3/26 ,  C08L83/05 ,  C08L83/07 ,  C09J183/04 ,  H01L21/52

CPC分类号： H01L33/641 ,  C08G77/12 ,  C08G77/20 ,  C08K3/26 ,  C08K3/38 ,  C08K2003/267 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/00

摘要： The present invention provides a die bonding material for an optical semiconductor device which has high thermal conductivity and can prevent cracking in an optical semiconductor device including the die bonding material. The die bonding material for an optical semiconductor device includes: a first silicone resin containing a hydrogen atom bonded to a silicon atom, a second silicone resin not containing a hydrogen atom bonded to a silicon atom, but containing an alkenyl group, a catalyst for hydrosilylation reaction, and at least one substance selected from the group consisting of anhydrous magnesium carbonate represented by chemical formula MgCO 3 not containing crystal water and coated bodies including the anhydrous magnesium carbonate and an organic resin, a silicone resin, or silica coated on the surface thereof.

公开(公告)号：EP2733178A1

公开(公告)日：2014-05-21

申请号：EP12810683.8

申请日：2012-07-11

申请人： Sekisui Chemical Co., Ltd.

发明人： YAMAZAKI, Ryosuke ,  TANIKAWA, Mitsuru ,  WATANABE, Takashi ,  INUI, Osamu ,  KUNIHIRO, Yoshitaka ,  KIMU, Chizuru ,  KOBAYASHI, Yusuke ,  YASUI, Hidefumi ,  SUEZAKI, Minoru ,  KUSAKA, Yasunari ,  YAMADA, Tasuku

IPC分类号： C08L83/07 ,  C08G77/12 ,  C08G77/20 ,  C08L83/05 ,  H01L33/56

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/04 ,  C08L83/00

摘要： The present invention provides an encapsulant for optical semiconductor devices, which is capable of suppressing surface tackiness of a cured product and is also capable of enhancing the heat resistance and thermal cycle characteristics of the cured product. An encapsulant for optical semiconductor devices according to the present invention which includes: a first organopolysiloxane which is represented by formula (1A) or formula (1B) and has an alkenyl group and a methyl group bonded to a silicon atom; a second organopolysiloxane which is represented by formula (51A) or formula (51B) and has a hydrogen atom bonded to a silicon atom and a methyl group bonded to a silicon atom; and a catalyst for hydrosilylation reaction, and the content ratios of methyl groups bonded to silicon atoms in the first and second organopolysiloxanes each are 80 mol% or more.

         (R1R2R3SiO 1/2 ) a (R4R5SiO 2/2 ) b (R6SiO 3/2 ) c       Formula (1A)

         (R1R2R3SiO 1/2 ) a (R4R5SiO 1/2 ) b (R6SiO 3/2 ) c       Formula (1B)

         (R51R52R53SiO 1/2 ) p (R54R55SiO 2/2 ) q (R56SiO 3/2 ) r       Formula (51A)

         (R51R52R53SiO 1/2 ) p (R54R55SiO 2/2 ) q (R56SiO 3/2 ) r       Formula (51B)

摘要翻译： 本发明提供一种能够抑制固化物的表面粘性的光半导体装置用密封剂，能够提高固化物的耐热性和热循环特性。 根据本发明的光学半导体器件的密封剂，其包括：由式（1A）或式（1B）表示并具有与硅原子键合的烯基和甲基的第一有机聚硅氧烷; 由式（51A）或式（51B）表示的具有与硅原子键合的氢原子和与硅原子键合的甲基的第二有机聚硅氧烷; 和氢化硅烷化反应的催化剂，第一和第二有机聚硅氧烷中与硅原子键合的甲基的含量比分别为80摩尔％以上。 €ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R1R2R3SiO 1/2）a（R4R5SiO 2/2）b（R6SiO 3/2）c€ƒ€ƒ€ƒ€ƒ方程式（1A ）€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R1R2R3SiO 1/2）a（R4R5SiO 1/2）b（R6SiO 3/2）c€ƒ€ƒ€ƒ€ƒFormula 1B）€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R51R52R53SiO 1/2）p（R54R55SiO 2/2）q（R56SiO 3/2）r€ƒ€ƒ€ƒ€ƒ （51A）€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R51R52R53SiO 1/2）p（R54R55SiO 2/2）q（R56SiO 3/2）r€ƒ€ƒ€ƒ€ 式（51B）

公开(公告)号：EP2730620A1

公开(公告)日：2014-05-14

申请号：EP12806920.0

申请日：2012-07-04

申请人： Dow Corning Toray Co., Ltd.

发明人： AMAKO, Masaaki ,  OKAWA, Tadashi ,  IIMURA, Tomohiro ,  NISHIJIMA, Kazuhiro ,  ITOH, Maki ,  MORITA, Yoshitsugu

IPC分类号： C08L83/07 ,  C08G77/12 ,  C08G77/20 ,  C08L83/05 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

CPC分类号： C08G77/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/00 ,  C08L83/04 ,  C09J183/04 ,  C09K11/08 ,  H01L23/24 ,  H01L23/296 ,  H01L33/502 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00012

摘要： A hydrosilylation curable silicone composition that forms a cured product with a high refractive index, high transparency, excellent heat resistance, and excellent flexibility, the hydrosilylation curable silicone composition comprising, as a main component, an organopolysiloxane represented by the following average unit formula:

        (R 1 3 SiO 1/2 ) a (R 1 2 SiO 2/2 ) b (R 2 SiO 3/2 ) c (SiO 4/2 ) d

wherein, R 1 are alkyl groups, alkenyl groups, phenyl groups, or hydrogen atoms; R 2 is a group recited for R 1 , a condensed polycyclic aromatic group, or a group containing a condensed polycyclic aromatic group, provided that at least one of R 1 or R 2 in a molecule is an alkenyl group or hydrogen atom, and at least one R 2 in a molecule is a condensed polycyclic aromatic group or a group containing a condensed polycyclic aromatic group; and a, b, c, and d are numbers satisfying: 0.01 ≤ a ≤ 0.8, 0 ≤ b ≤ 0.5, 0.2 ≤ c ≤ 0.9, 0 ≤ d a + b + c + d = 1.

摘要翻译： 一种形成具有高折射率，高透明度，优异的耐热性和优异柔韧性的固化产物的氢化硅烷化固化性硅氧烷组合物，所述氢化硅烷化可固化的有机硅组合物包含以下平均单元式代表的有机聚硅氧烷作为主要成分： ƒ€ƒ€ƒ€ƒ€ƒ€ƒ（R 1 3 SiO 1/2）a（R 1 2 SiO 2/2）b（R 2 SiO 3/2）c（SiO 4/2） d其中R 1为烷基，烯基，苯基或氢原子; R 2为R 1所示的基团，缩合多环芳香族基团或含有缩合多环芳香族基团，只要分子中的R 1或R 2中的至少一个为烯基或氢原子， 分子中至少一个R 2是稠合多环芳基或含缩合多环芳基的基团; a，b，c和d是满足：0.01‰¤a‰¤0.8，‰¤b‰0.5，0.2‰¤c‰0.9，0‰¤d <0.2，a + b + c + d = 1。

公开(公告)号：EP2730603A1

公开(公告)日：2014-05-14

申请号：EP12807435.8

申请日：2012-06-28

申请人： JNC Corporation

发明人： KAWABATA Kiichi ,  TAJIMA Akio ,  MATSUO Takashi ,  WATANABE Yoshiko ,  AYAMA Koichi

IPC分类号： C08G77/388 ,  C08G77/54 ,  C08G59/02 ,  C07F7/21 ,  C08L83/05 ,  C08L83/07 ,  C09D183/05 ,  C09D183/07 ,  H01L33/56

CPC分类号： H01L33/56 ,  C07F7/21 ,  C08G59/306 ,  C08G77/045 ,  C08G77/12 ,  C08G77/388 ,  C08G77/54 ,  C08K5/1515 ,  C08K5/34924 ,  C09D163/00 ,  H01L2924/0002 ,  H01L2924/00 ,  C08L83/04

摘要： The invention provides an adhesion-imparting agent having heat-resistant transparency and a high refractive index best suited for an addition hardening type composition including a reaction product of silsesquioxane and organopolysiloxane. The invention relates to a compound obtained by allowing a hydrosilylation addition reaction of (A), (B), and when necessary, (C) as described below, and a compound including an organopolysiloxane or silsesquioxane skeleton including as an essential component an isocyanuric ring skeleton and an epoxy group, and having an SiH group residue: (A) a compound including an organopolysiloxane or silsesquioxane skeleton and having three or more SiH groups in one molecule; (B) an epoxy derivative having one aliphatic unsaturation-containing group in one molecule; and (C) polyorganosiloxane having two alkenyl groups in one molecule, and having a number average molecular weight of 100 to 500,000, or an isocyanurate compound having two alkenyl groups in one molecule.

摘要翻译： 本发明提供了在具有耐热透明且包括倍半硅氧烷和有机聚硅氧烷的反应产物的高折射率除了固化型组合物最适合于粘合赋予剂。 本发明涉及一种通过使（A）的氢化硅烷化加成反应，（B）而获得的化合物，和必要的如下所述的情况下，（C），和化合物在有机聚硅氧烷或倍半硅氧烷骨架包含为异氰脲环的必要成分包括 骨架和环氧基团，和具有SiH基残基：（A）的化合物包括有机聚硅氧烷在倍半硅氧烷或骨架，并且在一个分子中具有三个或更多个SiH基团; （B）与环氧衍生物具有一个脂族基团在一个分子中含有不饱和现象-; 和具有（C）的聚有机硅氧烷在一个分子中两个链烯基，和具有100的数均分子量为500,000，或在一个分子中具有两个烯基，以异氰脲酸酯化合物。

公开(公告)号：EP2588539B1

公开(公告)日：2014-05-14

申请号：EP11738059.2

申请日：2011-06-28

申请人： Dow Corning Toray Co., Ltd.

发明人： YOSHITAKE, Makoto ,  YAMAKAWA, Mieko

IPC分类号： C08L83/04 ,  H01L23/29 ,  C08L83/07 ,  C08L83/05

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/14 ,  C08G77/16 ,  C08G77/20 ,  C08G77/70 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  H01L23/296 ,  H01L24/29 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/09701 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

摘要： A curable organopolysiloxane composition that can be used as a sealant or a bonding agent for optical semiconductor elements and comprises at least the following components: (A) an alkenyl-containing organopolysiloxane that comprises constituent (A-1) of an average compositional formula and constituent (A-2) of an average compositional formula; (B) an organopolysiloxane that contains silicon-bonded hydrogen atoms and comprises constituent (B-1) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average molecular formula, constituent (B-2) containing at least 0.5 wt. % of silicon-bonded hydrogen atoms and represented by an average compositional formula, and, if necessary, constituent (B-3) of an average molecular formula; and (C) a hydrosilylation-reaction catalyst. The composition can form a cured body that possesses long-lasting properties of light transmittance and bondability, and relatively low hardness.

公开(公告)号：EP2151443B1

公开(公告)日：2014-03-26

申请号：EP08740494.3

申请日：2008-04-16

申请人： KANEKA CORPORATION

发明人： MANABE, Takao ,  SEINO, Makoto ,  MIZUTA, Shinya

IPC分类号： C07F7/21 ,  C08G77/38 ,  C08L83/05 ,  C08L83/07 ,  C09J11/02 ,  C09J183/04

CPC分类号： C08G77/38 ,  C07F7/21 ,  C08F230/08 ,  C08G77/04 ,  C08G77/045 ,  C08G77/12 ,  C08G77/14 ,  C08G77/20 ,  C08G77/50 ,  C08K3/36 ,  C08K5/56 ,  C09D183/04 ,  G02B1/04 ,  G02B1/10 ,  C08L83/00

公开(公告)号：EP2657300A1

公开(公告)日：2013-10-30

申请号：EP11851378.7

申请日：2011-12-06

申请人： Momentive Performance Materials Japan LLC

发明人： OKAWA, Koji ,  ONO, Kazuhisa

IPC分类号： C08L83/07 ,  C08L83/05 ,  C09J11/02 ,  C09J183/05 ,  C09J183/06 ,  C09J183/07

CPC分类号： C09J183/04 ,  C08G77/12 ,  C08G77/20 ,  C08K5/5419 ,  C08K5/56 ,  C08L83/00 ,  Y10T428/31663

摘要： This is to provide a heat-curable polyorganosiloxane composition.
The heat-curable polyorganosiloxane composition comprises (A) an alkenyl group-containing linear polyorganosiloxane represented by the formula (I); (B1) a linear polyorganohydrogensiloxane represented by the formula (II); (B2) a cyclic polyorganohydrogensiloxane comprising an R e 2 HSiO 1/2 unit (wherein R e represents a hydrogen atom or C 1 -C 6 alkyl group) and an SiO 4/2 unit, and having three or more hydrogen atoms bonded to a silicon atom in one molecule; (C) a platinum series catalyst; and (D) an adhesion promoter, a ratio of a sum (H B1 +H B2 ) of a number H B1 of the hydrogen atom(s) of (B1) and a number H B2 of the hydrogen atom(s) of (B2) based on a number Vi A of the alkenyl group(s) of (A) is 0.2 to 1.0, and H B1 is 0.5 to 0.8 based on H B1 +H B2 .

公开(公告)号：EP2610314A1

公开(公告)日：2013-07-03

申请号：EP12800149.2

申请日：2012-05-14

申请人： Toray Industries, Inc.

发明人： MATSUMURA, Nobuo ,  INOUE, Takejiro ,  SADAKUNI, Hironobu ,  ISHIDA, Yutaka ,  KAWAMOTO, Kazunari ,  YOSHIOKA, Masahiro ,  GOTO, Tetsuya

IPC分类号： C08L83/07 ,  C08L83/05 ,  H01L33/50 ,  C08J5/18

CPC分类号： F21K9/56 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08J5/18 ,  C08J2383/07 ,  C08K3/01 ,  C08K3/22 ,  C08K5/5419 ,  C08K5/56 ,  C08K2003/026 ,  C08L83/00 ,  C08L83/04 ,  F21K9/64 ,  F21K9/90 ,  H01L24/83 ,  H01L33/502 ,  H01L2224/83192 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2933/0041 ,  H01L2924/00

摘要： A phosphor-containing sheet having a storage modulus of 0.1 MPa or more at 25°C and a storage modulus of less than 0.1 MPa at 100°C, wherein a resin main component of the phosphor-containing sheet is a crosslinked product formed by subjecting a crosslinkable silicone composition containing a specific composition to a hydrosilylation reaction. This phosphor-containing sheet provides a phosphor sheet having good shapability and high adhesive power as a phosphor sheet bonded to an LED chip as a wavelength conversion layer.

摘要翻译： 在100℃下，在25℃下的储能模量为0.1MPa以上且在100℃下的储能模量小于0.1MPa的含磷光体片材，其中，含磷光体片材的树脂主成分是通过 含有特定组成的氢化硅烷化反应的可交联硅氧烷组合物。 该含磷光体片材作为波长转换层与作为LED芯片接合的荧光体片材提供具有良好成形性和高粘合力的荧光体片材。

公开(公告)号：EP2586832A1

公开(公告)日：2013-05-01

申请号：EP11798176.1

申请日：2011-06-22

申请人： Sekisui Chemical Co., Ltd.

发明人： TANIKAWA, Mitsuru ,  WATANABE, Takashi ,  MORIGUCHI, Shintaro ,  INUI, Osamu ,  KUNIHIRO, Yoshitaka ,  YAMAZAKI, Ryosuke ,  OKI, Ayuko

IPC分类号： C08L83/05 ,  C08L83/07 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

CPC分类号： H01L33/56 ,  C08G77/12 ,  C08G77/20 ,  C08G77/80 ,  C08L83/04 ,  C09K3/1018 ,  C08L83/00

摘要： The present invention provides a sealant for an optical semiconductor device which is less likely to reduce its luminance and is also less likely to change its color even used in an energized state in harsh environments of high temperature and high humidity.
The sealant for an optical semiconductor device includes: a first organopolysiloxane not containing a hydrogen atom bound to a silicon atom, but containing an alkenyl group bound to a silicon atom and an aryl group bound to a silicon atom, a second organopolysiloxane containing a hydrogen atom bound to a silicon atom and an aryl group bound to a silicon atom, and a platinum-alkenyl complex. The platinum-alkenyl complex is a reaction product obtained by reacting chloroplatinic acid hexahydrate with not less than 6 equivalent of a bi- or more-functional alkenyl compound. The ratio of the number of the alkenyl group bound to a silicon atom in the organopolysiloxane to the number of the hydrogen atom bound to a silicon atom in the organopolysiloxane in the sealant is not less than 1.0 and not more than 2.5.

摘要翻译： 本发明提供了一种用于光学半导体器件的密封剂，其不太可能降低其亮度，并且即使在高温和高湿度的恶劣环境中的通电状态下使用也不太可能改变其颜色。 用于光学半导体器件的密封剂，包括：不包含第一有机聚硅氧烷结合到硅原子的氢原子，但含有与硅原子的链烯基和键合到硅原子上的芳基，含有一个氢原子的第二有机聚硅氧烷 结合到硅原子和与硅原子结合的芳基，以及铂 - 烯基复合物。 铂 - 烯基复合物是通过使氯铂酸六水合物与不少于6当量的双官能或更多官能的烯基化合物反应而获得的反应产物。 与有机聚硅氧烷中的硅原子结合的烯基的数量与密封剂中的有机聚硅氧烷中与硅原子结合的氢原子数的比例为1.0以上且2.5以下。

公开(公告)号：EP2573129A1

公开(公告)日：2013-03-27

申请号：EP11783572.8

申请日：2011-05-18

申请人： JNC Corporation

发明人： KAWABATA Kiichi ,  TAJIMA Akio ,  MATSUO Takashi ,  SAKAI Kiyoshi ,  AYAMA Koichi

IPC分类号： C08G77/50 ,  C08L83/05 ,  C08L83/07 ,  C08L83/14 ,  C08K3/36 ,  C09D183/05 ,  C09D183/07 ,  C09D183/14 ,  C09K3/10 ,  H01L23/29 ,  H01L23/31 ,  H01L33/56

CPC分类号： C08F30/08 ,  C07F7/21 ,  C08G77/045 ,  C08G77/12 ,  C08G77/20 ,  C08G77/50 ,  C08G77/80 ,  C08K5/56 ,  C08L83/00 ,  C08L83/04 ,  C09D183/04 ,  C09K3/1018 ,  H01L23/296 ,  H01L33/56 ,  H01L2924/0002 ,  H01L2924/00

摘要： To provide a silicone resin-based thermosetting resin composition that can obtain a hardened material having a high refractive index and a good heat resistance.
A solution is a liquid organosilicon compound represented by general formula (1) as described below:
(1)


wherein, X is each independently a group represented by formula (I), formula (II) or formula (III) as described below, and when the number of the group represented by formula (I) per one molecule of the liquid organosilicon compound represented by general formula (1) (or the number of groups per one mean molecule of the compound when the compound is a mixture having a different ratio for the group represented by formula (I), the group represented by formula (II) and the group represented by formula (III) ) is defined as a, the number of the group represented by formula (II) per one molecule thereof is defined as b, and the number of the group represented by formula (III) per one molecule thereof is defined as c, 0 ≤ a ≤ 3.5, 0 ≤ b ≤ 3.5, and 0 ≤ c ≤ 1 are obtained, and also a + b + 2c = 4 is obtained:


wherein, R 1 is each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl and cyclohexyl, R 2 and R 3 are each independently a group selected from alkyl having 1 to 4 carbons, cyclopentyl, cyclohexyl and phenyl, m and n are the number of repetitions of -OSi(R 3 ) 2 -, and a mean value satisfying 1 to 50.

摘要翻译： 提供一种有机硅树脂系热固化性树脂组合物做了可以得到具有高折射率和良好的耐热性的固化物。 一种解决方案是下文所描述的由通式（1）表示的液体有机硅化合物：（1）其中，X各自独立地是由式（I）表示的基团，式（II）或式（III）如下所述，与 当每液态有机硅化合物的一个分子中由通式（1）表示的由式（I）表示的基团的数目（或基团的数目和选择一个意味着该化合物的分子当化合物是具有不同比例的混合物 对于由式（I）表示的基团，由式（II）表示的基团和由式表示的基团（III））被定义为，由式表示的基团的数目（II），并选择其一个分子中的定义 为b，和由式（III）表示的基团的数量，并选择其一个分子被定义为c，0‰¤一个‰¤3.5，0‰¤b‰¤3.5，和0‰¤ç‰¤1获得 ，因而A + b + 2C = 4获得：其中，R 1为各自独立地从下列的基团 具有1至4个碳原子，环戊基和环己基，R 2和R 3 lkyl各自独立地选自具有1至4个碳，环戊基，环己基和苯基，m和n烷基中的基团是-OSi（R，3的重复数 ）2 - ，且满足1至第50个的平均值