摘要:
Provided is a rubber composition, which has excellent heat resistance, acid resistance, gas permeability resistance, and high-speed moldability, has low hardness and low counterforce, has excellent high-temperature compression set, and does not adhere to the metal of molds, etc. but is self-adhering with respect to organic resins. The rubber composition comprises: a predetermined ethylene/α-olefin/non-conjugated polyene copolymer [A]; a predetermined SiH group-containing compound [B-1] having two SiH groups per molecule and/or a predetermined SiH group-containing compound [B-2] having three SiH groups per molecule; and a predetermined methacrylic acid ester compound [C].
摘要:
Disclosed is a silicone rubber composition for fabric coating, which is characterized by containing a methacrylic group- or acrylic group-containing alkoxysilane and a zirconium chelate compound, but not containing an organic titanium compound, while having a viscosity at 25˚C of 100-500 Pa⋅s. This silicone rubber composition for fabric coating is also characterized in that it contains no solvent and is curable by hydrosilylation. Also disclosed is a coated fabric which is composed of a fabric coated with such a silicone rubber composition for fabric coating.
摘要:
The present invention relates to a composition for a silicone resin, including: (1) an organopolysiloxane having a silanol group at an end thereof; (2) an organopolysiloxane having at least one alkenylsilyl group and at least two hydrosilyl groups in one molecule thereof; (3) a condensation catalyst; and (4) a hydrosilylation catalyst.
摘要:
A silicone rubber sponge-forming emulsion composition is provided that, even when the quantity of reinforcing silica filler is increased, does not exhibit a decline in the emulsion stability, avoids defects in the cell morphology of the sponge, and avoids a substantial increase in the hardness of the sponge. A method of producing a silicone rubber sponge from this composition is also provided. A silicone rubber sponge-forming emulsion composition comprising (A) 100 weight parts of a liquid diorganopolysiloxane that has at least two silicon-bonded alkenyl groups in each molecule, (B) 1 to 50 weight parts of a reinforcing silica filler comprising (b1) a fumed silica and (b2) a precipitated silica in a (b1)/(b2) weight ratio of 0.01/1 to 30/1, (C) 50 to 250 weight parts of water that contains (c) a smectite clay, (D) 0.1 to 7 weight parts of a sorbitan fatty acid ester, (E) 0 to 10 weight parts of an isononanoic acid ester, (F) 0 to 10 weight parts of a Guerbet alcohol, and (G) a curing agent in a quantity sufficient to crosslink and cure component (A). Also, a method of producing a silicone rubber sponge by heating this composition and curing it while removing the water, or by heating this composition and curing it and then removing the water from the resulting wet silicone rubber-like cured material.
摘要:
It is an object of the present invention to provide: a curable composition that has photocurability and provides a cured product excellent in insulating properties; and the cured product. This can be achieved by a photocurable composition that contains, as essential components, (A) a modified polyorganosiloxane compound having a photopolymerizable functional group and an SiH group, (B) a compound having a carbon-carbon double bond, and (C) a photopolymerization initiator. A thin film produced from the curable composition of the present invention has excellent insulating properties. Since the curable composition of the present invention can form a film by solution coating, it is applicable to provide thin-film insulating materials that can be formed by solution coating.
摘要:
The thermally conductive resin composition of the present invention contains (a) a matrix component, (b) a larger-diameter thermally conductive inorganic powder, (c) a smaller-diameter thermally conductive inorganic powder, and (d) a vulcanizing agent and/or curing agent. The surface of the smaller-diameter thermally conductive inorganic powder is selectively treated with a silane compound represented by R(CH 3 ) a Si(OR') 3-a (wherein R is an unsubstituted or substituted organic group having 6 to 20 carbon atoms, R' is an alkyl group having 1 to 4 carbon atoms, and a is 0 or 1) or a partially hydrolyzed product thereof, and the amount thereof is smaller than the amount necessary to coat the entire surface area of the smaller-diameter thermally conductive inorganic powder. Accordingly, a thermally conductive resin composition that has a low hardness and a high thermal conductivity and that undergoes little outgassing and has storage stability is provided even when large amounts of thermally conductive inorganic powder is loaded into the resin component.
摘要:
A liquid curable fluorosilicone composition having improved defoamability is provided. The composition comprises (A) an organopolysiloxane having a viscosity at 25°C of 100 to 500,000 mPa·s and represented by the following formula:
(CF 3 CH 2 CH 2 ) a R b SiO (4-a-b)/2
wherein R is a monovalent hydrocarbon group with the proviso that at least 0.001% by mole of the hydrocarbon group is an alkenyl group, a is 0.1 to 1.0, b is 2.5 to 1.0, and a+b is 1.8 to 3.0, (B) an organohydrogenpolysiloxane containing at least two hydrogen atoms bonded to the silicon atom in a molecule, (C) an addition catalyst, and (D) a diorganopolysiloxane having a viscosity at 25°C of 1 to 10,000 mpa·s which does not comprise trifluoropropyl group but comprises dimethylsiloxane unit.
摘要翻译:提供了具有改善的消泡性的液体可固化氟硅酮组合物。 该组合物包含(A)在25℃下粘度为100至500,000mPa·s的有机聚硅氧烷,由下式表示:€ƒ€ƒ€ƒ€ƒ€ƒ€ƒ(CF 3 CH 2 CH 2)a R b SiO(4-ab)/ 2其中R为一价烃基,条件是至少0.001%(摩尔)烃基为烯基,a为0.1至1.0,b为2.5至 1.0,a + b为1.8〜3.0,(B)分子内含有与硅原子键合的氢原子中至少2个以下的有机氢聚硅氧烷,(C)加成催化剂,(D)25℃时的粘度的二有机聚硅氧烷 C为1〜10,000mpa·s,不包含三氟丙基,但包含二甲基硅氧烷单元。