摘要:
A clamping mechanism for an adjustable steering column (1) has an actuator, which may be electrically operated, coupled to a clamping device for clamping the steering column in a desired position. The actuator includes a cam mechanism to create clamped and unclamped conditions and includes a drive cam (15) with a camming face which carries a peripheral toothed profile (13) engaging a reciprocal toothed rack (11), which together form a rack and pinion mechanism (11, 14). The clamping device may be mounted within a casing (3) which can house the motor (5), the casing (3) being pivotal about an axis (24) so as to allow the clamping device to move in sympathy with rake adjustable of the steering column.
摘要:
Robot arm (16) end effectors (10, 110, 210) of this invention rapidly and cleanly transfer semiconductor wafers (12) between a wafer cassette (14) and a processing station. The end effectors include proximal and distal rest pads (24, 26, 124, 126) having pad and backstop portions (32, 34, 132, 134) that support and grip the wafer either by wafer peripheral edge contact or within an annular exclusion zone (30) that extends inward from a peripheral edge of the wafer. An active contact point (50, 150, 222) is movable by a vacuum actuated piston (52, 152) between a retracted wafer-loading position and an extended position that urges the wafer against the distal rest pads to grip the wafer at its edge or within the exclusion zone. The end effector further includes fiber optic light transmission sensors (90, 102, 202, 214) for determining various wafer surface, edge, thickness, tilt, and location parameters. The sensors provide robot arm extension and elevation positioning data supporting methods of rapidly and accurately placing and retrieving a wafer from among a stack of closely spaced wafers stored in the wafer cassette. The methods effectively prevent accidental contact between the end effector and the wafers while effecting clean, secure gripping of the wafer at its edge or within its exclusion zone.
摘要:
A box load interface implemented in a FIMS system includes a translation mechanism that actuates a port door attachable to the box door of a transport box to move the box door toward or away from the transport box to open or close it. A clamping mechanism clamps the transport box on a slidable tray controlled to move the transport box against and away from a port plate. An elevator assembly cooperates with the translation mechanism to move the port door after the box door has moved away from the transport box. The translation mechanism and elevator assembly may be integral. A differential optical scanning assembly detects positions of wafer specimens located in the transport box. A robot assembly removes and inserts wafer specimens from the transport box. A linear traveling assembly supports the robot assembly and travels along a lead screw driven by a lead nut mechanism.
摘要:
A high frequency electrical connector (1) comprises a socket (2) and a plug (3). The plug is insertable into the socket in a first direction (1D), the socket and plug each having multiple electrical contacts (25, 26, 35) which are arranged to electrically interconnect the plug and socket. The socket has a base (4) for fixedly mounting a fixed end (42, 45, 46) of the contacts. The contacts have contact areas (55) arranged for electrically interconnecting to corresponding plug contacts, the contact areas being aligned so as to be parallel in a first dimension (1M) with the first direction (1D), and having a resiling portion (66) in-between the contact areas and the fixed ends (46), the socket contacts are formed in several different shapes (IS, 2S, 3S, 4S), wherein each shape has an at least partly arcuate contact area (81 to 88) and wherein a free end (76) of each contact is enclosed by the base (4).
摘要:
A composite wiring board includes a ceramic substrate (1), a resin layer (2, 3) in contact with at least one surface of the ceramic substrate and a sintered metal conductor (6) piercing through the resin layer. The composite wiring board is manufactured by a method including the steps of forming a through hole in a sheet (17) having a shrinkage-suppressing effect and filling the through hole with conductive paste (18) to obtain a sheet (15, 16, 61, 71, 81, 82) for formation of a conductor, firing the conductor formation sheet and a green sheet (11) for a substrate in their laminated state to obtain a ceramic substrate having a surface provided with a sintered metal conductor (6), removing from the surface of the ceramic substrate a fired product of the sheet having the shrinkage-suppressing effect and forming a resin layer (2, 3) on the surface of the ceramic substrate.
摘要:
A packaging machine utilising side connected chains of open bags is disclosed. The machine has loading and closure sections (14, 15)which are moveable between operating and cleaning/service positions. A resistance heater subassembly (44) is removeable to enable washdown.