公开(公告)号：EP0285714A1

公开(公告)日：1988-10-12

申请号：EP87303056.3

申请日：1987-04-08

Applicant: Corning Glass Works

Inventor： Wu, Shy-Hsien

IPC: B32B19/02 ,  B32B15/14

CPC classification number: H05K1/0366 ,  B32B19/04 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/0293

Abstract: Laminated synthetic mica articles are disclosed that have particular applicability as substrates in electronic components. The articles comprise a core of stacked and consolidated, synthetic mica sheets that are impregnated with resin, and a copper foil sealed to a face on the article. Adherence of the copper foil is enhanced by use of a micaceous facing layer and bonding sheet, both being resin-impregnated and the resin cure being advanced beyond the normal B-stage level before assembly. Insulation resistance is enhanced by providing an advanced resin coating on the copper foil before assembly. Use of a bismaleimide triazine and epoxy mixed resin is also disclosed whereby a transformation temperature (Tg) of about 200°C. is obtained.

Abstract translation: 公开了具有作为电子部件中的基材的特殊适用性的复合合成云母制品。 这些制品包括用树脂浸渍的堆叠和固结的合成云母片的芯，以及密封在制品上的面上的铜箔。 通过使用云母面层和粘合片，在组装之前树脂浸渍和树脂固化超过正常的B阶段水平，提高了铜箔的粘附性。 通过在组装之前在铜箔上提供先进的树脂涂层来提高绝缘电阻。 还公开了双马来酰亚胺三嗪和环氧树脂混合树脂的使用，由此获得约200℃的转变温度（Tg）。

公开(公告)号：EP0229495A1

公开(公告)日：1987-07-22

申请号：EP86309669.9

申请日：1986-12-11

Applicant: TOSOH CORPORATION ,  HODOGAYA CHEMICAL CO., LTD.

Inventor： Sato, Masatoshi ,  Ogawara, Kensuke ,  Emura, Noriaki

IPC: C08L81/02 ,  C08J5/04

CPC classification number: H05K1/0373 ,  C08K7/08 ,  C08K7/14 ,  C08K2201/016 ,  H05K1/0228 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251 ,  Y10T428/24355 ,  Y10T428/31533 ,  C08L81/02

Abstract: A polyphenylene sulphide composition useful for plating is disclosed, comprising a polyphenylene sulphide resin, glass fibres, and potassium titanate fibres. Moulded articles of this composition, when plated after etching, provide a plated article which has a good appearance and good peel strength. Thus these plated articles can be used in outer applications, such as for electrical parts and automobile parts.

公开(公告)号：EP2042655A4

公开(公告)日：2012-05-30

申请号：EP07790761

申请日：2007-07-13

Applicant: PIONEER CORP ,  MITSUBISHI CHEM CORP ,  ROHM CO LTD

Inventor： YANO HIROYUKI ,  NOGI MASAYA ,  IFUKU SHINSUKE ,  ABE KENTAROU ,  HANDA KEISHIN

IPC: D21H11/08 ,  C08J5/04

CPC classification number: H05K1/0366 ,  D21H11/08 ,  H05K2201/0251 ,  H05K2201/0284 ,  Y10T442/2869

公开(公告)号：EP1950236A4

公开(公告)日：2010-10-27

申请号：EP06832729

申请日：2006-11-16

Applicant: RIMTEC CORP

Inventor： TAKIMOTO TOMOHIKO ,  MIURA TAKAHIRO

IPC: C08G61/00 ,  B29C45/00 ,  B29C45/14 ,  B29K45/00 ,  B29K105/12 ,  C08K3/26 ,  C08K7/10 ,  C08L65/00

CPC classification number: C08L65/00 ,  B29C67/246 ,  B29K2023/083 ,  B29K2023/38 ,  B29K2105/16 ,  C08F287/00 ,  C08K3/26 ,  C08K7/10 ,  C08K2201/016 ,  C08L51/006 ,  C08L53/02 ,  H05K1/0373 ,  H05K2201/0158 ,  H05K2201/0209 ,  H05K2201/0251 ,  Y10T428/31692 ,  C08L2666/02 ,  C08L2666/04

公开(公告)号：EP1420928A1

公开(公告)日：2004-05-26

申请号：EP02763567.1

申请日：2002-08-29

Applicant: E.I. DU PONT DE NEMOURS AND COMPANY

Inventor： SAMUELS, Michael, R.

IPC: B29B13/10 ,  B02C19/12

CPC classification number: B32B27/12 ,  B29B13/10 ,  B32B15/04 ,  H05K1/036 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/015 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: Thermotropic liquid crystalline polymers are readily ground to smaller particle sizes by using a two or more stage grinding process. The particles produced usually are relatively short, but still, fibers. The ground LCP is useful for rotational molding, powder coating, and forming nonwoven structures.

公开(公告)号：EP1030543B1

公开(公告)日：2004-01-07

申请号：EP00103237.4

申请日：2000-02-17

Applicant: Matsushita Electric Industrial Co., Ltd.

Inventor： Echigo, Fumio ,  Kawakita, Yoshihiro

IPC: H05K1/03

CPC classification number: D21H13/20 ,  B29C70/12 ,  D04H1/587 ,  D04H1/60 ,  D04H1/64 ,  H05K1/0366 ,  H05K3/4069 ,  H05K2201/015 ,  H05K2201/0175 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/25 ,  Y10T428/252 ,  Y10T428/259 ,  Y10T428/27 ,  Y10T442/2861 ,  Y10T442/2902

公开(公告)号：EP1019246A4

公开(公告)日：2001-11-07

申请号：EP98949433

申请日：1998-09-23

Applicant: FIBERMARK INC

Inventor： KEMPF ULRICH

IPC: B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H21/54 ,  D21H25/06 ,  H05K1/03 ,  B32B5/00 ,  B32B5/08

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962 ,  Y10T428/31663

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

Abstract translation: 具有低介电常数且含有基本上均匀分布的中空玻璃 - 微球填料的预浸料基板及其制造方法。 用浸渍和层压技术处理预浸料底物以形成具有低介电常数和良好机械和电学性能的层压材料，适合作为用于高性能电路中的表面安装装置的基材。 改进了用于制造高性能电路板和制造表面贴装集成电路的预浸料。 改进的高性能电路板，用于制造表面贴装集成电路。

公开(公告)号：EP0604838B1

公开(公告)日：1999-06-30

申请号：EP93120249.3

申请日：1993-12-16

Applicant: HOECHST CELANESE CORPORATION

Inventor： Jester, Randy D.

IPC: C08L67/00 ,  C08L67/04 ,  B32B15/08 ,  C09K19/38

CPC classification number: B32B15/08 ,  B29C55/00 ,  B29D7/01 ,  B29K2105/0079 ,  B29K2105/0088 ,  B29K2105/26 ,  B32B15/09 ,  B32B15/20 ,  B32B2307/52 ,  C08J5/18 ,  C08J11/06 ,  C08J2367/00 ,  C08L67/00 ,  C08L67/04 ,  C09K19/3809 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0212 ,  H05K2201/0245 ,  H05K2201/0251 ,  H05K2201/0278 ,  Y02W30/701 ,  Y10S428/91 ,  Y10T428/1095 ,  Y10T428/24942 ,  Y10T428/31678 ,  Y10T428/31681 ,  Y10T428/31786 ,  C08L2666/18

公开(公告)号：EP0402028B1

公开(公告)日：1995-02-01

申请号：EP90305843.6

申请日：1990-05-30

Applicant: POLYPLASTICS CO. LTD.

Inventor： Suzuki, Yoshiharu ,  Akeda, Tomoyuki

IPC: H05K3/02 ,  H05K3/38 ,  H05K1/03

CPC classification number: H05K1/0366 ,  H05K1/0326 ,  H05K1/0373 ,  H05K3/14 ,  H05K3/388 ,  H05K3/4626 ,  H05K2201/0141 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/09118

公开(公告)号：EP0633295A1

公开(公告)日：1995-01-11

申请号：EP94905218.7

申请日：1994-01-27

Applicant: OTSUKA KAGAKU KABUSHIKI KAISHA

Inventor： TASAKA, Takio, 332-9, Aza Hachikitakaitaku ,  MONDE, Hiroyuki, Mezondofurora 505

IPC: C08L101/00 ,  C08K7/04

CPC classification number: C08K7/08 ,  C08K7/10 ,  H05K1/0373 ,  H05K2201/0129 ,  H05K2201/0209 ,  H05K2201/0248 ,  H05K2201/0251

Abstract: The invention aims at providing a resin composition for electronic parts which is in great demand as a circuit board material for electric and electronic equipments, and which has a low dielectric constant, low dielectric dissipation factor and a thermal resistance. This resin consists of a thermoplastic resin or a thermosetting resin, and wollastonite or zonotolite, fibrous material containing CaO.SiO₂ as a main component, mixed as reinforcing fiber with the resin at a mixing ratio of 5-60 % based on the total weight of the resin and fiber.

Abstract translation: 本发明的目的在于提供一种作为电气电子设备用电路基板材料的电子部件用树脂组合物，其介电常数低，介电损耗因数低，耐热性高。 该树脂由热塑性树脂或热固性树脂组成，硅灰石或云母石，以CaO.SiO 2为主要成分的纤维材料，以与树脂混合的增强纤维为基准，混合比例为5-60％ 树脂和纤维。