公开(公告)号：EP1500743A4

公开(公告)日：2007-08-22

申请号：EP03719225

申请日：2003-04-25

Applicant: TEIJIN TECHNO PRODUCTS LTD

Inventor： FUJIMORI TATSUSHI ,  MURAYAMA SADAMITSU

IPC: B29C70/10 ,  B29C70/12 ,  B29C70/20 ,  B32B15/14 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/03 ,  B29C70/88 ,  H05K3/46

CPC classification number: B32B15/14 ,  B29C70/10 ,  B29C70/12 ,  B29C70/202 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/306 ,  B32B2457/08 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0594 ,  Y10T428/24116 ,  Y10T428/24124 ,  Y10T428/2419 ,  Y10T428/24264 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T442/2008 ,  Y10T442/696

Abstract: A heat-resistant synthetic fiber sheet which comprises 40 to 97 mass % of heat-resistant organic synthetic polymer short fibers and 3 to 60 mass % of a heat-resistant organic synthetic polymer fibrid and/or an organic resin binder for binding them, wherein at least a part of the short fibers has both end surfaces having an angle of inclination of 10 degree or more to the plane intersecting orthogonally to the fiber axis thereof. The heat-resistant synthetic fiber sheet is useful as a substrate for a laminate for an electric circuit board.

公开(公告)号：EP1392495A4

公开(公告)日：2005-10-12

申请号：EP02734652

申请日：2002-06-04

Applicant: POLYMER GROUP INC

Inventor： ZUCKER JERRY ,  CARTER NICK MARK

IPC: C08J5/04 ,  B29B15/12 ,  B29C70/12 ,  B29C70/16 ,  B29C70/36 ,  B29C70/50 ,  B32B5/24 ,  D04H1/46 ,  D04H1/48 ,  D04H3/10 ,  D04H5/02 ,  D04H13/00 ,  H05K1/00 ,  H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/10 ,  B32B3/24

CPC classification number: H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

Abstract: The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (printed Circuit Board) and similar application. The nonwoven substrate is formed from a precursor web (P) which undergoes entangling treatment by entangling manifolds (16, 20, 24'). By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

公开(公告)号：EP1500743A1

公开(公告)日：2005-01-26

申请号：EP03719225.9

申请日：2003-04-25

Applicant: Teijin Techno Products Limited

Inventor： FUJIMORI, Tatsushi C/O Teijin Techno Products ,  MURAYAMA, Sadamitsu C/O Teijin Techno Products

IPC: D21H13/26 ,  D21H13/24 ,  B29C70/88 ,  H05K3/46

CPC classification number: B32B15/14 ,  B29C70/10 ,  B29C70/12 ,  B29C70/202 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2305/076 ,  B32B2307/306 ,  B32B2457/08 ,  D21H13/24 ,  D21H13/26 ,  D21H21/18 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/0594 ,  Y10T428/24116 ,  Y10T428/24124 ,  Y10T428/2419 ,  Y10T428/24264 ,  Y10T428/24994 ,  Y10T428/25 ,  Y10T428/254 ,  Y10T428/26 ,  Y10T442/2008 ,  Y10T442/696

Abstract: A heat-resistant fiber paper-like sheet comprises 40 to 97% by mass of heat-resistant organic synthetic polymers staple fibers, 3 to 60% by mass of heat resistant organic synthetic polymer fibrid and or an organic resin binder, in a portion of the staple fibers, each staple fiber having two flat end faces having an inclining angle of 10 degrees or more from a plane crossing the fiber axis at a right angles, and is useful as a base material for laminate materials for electrical circuit boards.

Abstract translation: 一种耐热纤维纸状片材包含40至97质量％的耐热有机合成聚合物短纤维，3至60质量％的耐热有机合成聚合物纤维原纤维或有机树脂粘合剂，部分 短纤维，每个短纤维具有从垂直于纤维轴的平面倾斜角度为10度以上的两个平坦端面，并且可用作电路板层压材料的基材。

公开(公告)号：EP0915125B1

公开(公告)日：2004-07-14

申请号：EP98120989.3

申请日：1998-11-05

Applicant: OJI PAPER CO., LTD.

Inventor： Kato, Yoshihisa ,  Adachi, Takekazu ,  Murata, Mamoru

IPC: C08J5/24 ,  C08J5/04 ,  B32B27/02 ,  D21H13/22 ,  D21H13/26

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B5/28 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/048 ,  C08J5/24 ,  C08J2361/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/12569 ,  Y10T428/31594 ,  Y10T428/31725

公开(公告)号：EP1392495A1

公开(公告)日：2004-03-03

申请号：EP02734652.7

申请日：2002-06-04

Applicant: Polymer Group, Inc.

Inventor： ZUCKER, Jerry ,  CARTER, Nick, Mark

IPC: B29C70/36 ,  B32B3/24

CPC classification number: H05K1/0366 ,  B29C70/12 ,  B29C70/16 ,  B29C70/50 ,  B29L2031/3425 ,  D04H1/48 ,  D04H1/49 ,  D04H1/495 ,  D04H3/11 ,  D04H5/02 ,  D04H5/03 ,  H05K1/0254 ,  H05K1/0271 ,  H05K1/0272 ,  H05K1/0393 ,  H05K3/0052 ,  H05K3/107 ,  H05K2201/0129 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/09045 ,  H05K2201/09127 ,  H05K2201/2009 ,  H05K2201/2036 ,  H05K2203/065 ,  Y10T442/259 ,  Y10T442/689

Abstract: The present invention relates to a nonwoven substrate, and specifically to a nonwoven substrate imparted with a three-dimensional image, wherein the three-dimensional nonwoven substrate is particularly suited as a support substrate for a PCB (printed Circuit Board) and similar application. The nonwoven substrate is formed from a precursor web (P) which undergoes entangling treatment by entangling manifolds (16, 20, 24'). By the utilization of a hydroentangled, three-dimensionally imaged support substrate impregnated with a durable resinous matrix, PCB's, and similar applications, can be imparted with unique and useful performance properties, to improve structural performance.

公开(公告)号：EP1310593A1

公开(公告)日：2003-05-14

申请号：EP00950005.9

申请日：2000-08-04

Applicant: TEIJIN LIMITED

Inventor： MURAYAMA, Sadamitsu, Teijin Ltd, Osaka Res. Ctr. ,  MATSUI, Michikage, Teijin Ltd, Osaka Research Ctr. ,  WADA, Masanori, Teijin Ltd, Osaka Research Center ,  ISHIHARA, Shigeru, Teijin Ltd, Matsuyama Factory

IPC: D21H13/26 ,  D04H1/42 ,  H05K1/03

CPC classification number: D04H1/4334 ,  D04H1/4342 ,  D04H1/549 ,  D04H1/64 ,  D21H13/24 ,  D21H13/26 ,  H05K1/0366 ,  H05K2201/0251 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/249921 ,  Y10T428/249924 ,  Y10T428/2904 ,  Y10T428/2969 ,  Y10T442/609 ,  Y10T442/61 ,  Y10T442/611 ,  Y10T442/69

Abstract: A heat-resistant fiber paper sheet which is formed from staple fibers made from a heat-resistant organic polymer, undrawn or low ratio drawn para-aromatic polyamide staple fibers, and an organic resin binder and/or fibrids comprising a heat-resistant organic polymer as main components, wherein the amount of said staple fibers is 45 to 97 percent by weight based on the total amount of said heat-resistant fiber paper sheet; the total amount of said organic resin binder and/or said fibrids is 3 to 55 percent by weight based on the total amount of said heat-resistant fiber paper sheet; and said organic resin binder is cured, and/or said undrawn or low ratio drawn para-aromatic polyamide staple fibers and said fibrids are partially sòftened, deformed and/or melted to exhibit the actions of binders. The obtained heat-resistant fiber paper sheet has excellent heat resistance, excellent heat dimensional stability, excellent plybond strength, an excellent electric insulating property in a high humidity, and the like, has good resin impregnability in spite of having a high bulk density, and is especially suitable for use as a substrate for electric insulating materials or as a substrate for laminates used for electric circuits.

Abstract translation: 由耐热有机聚合物，未拉伸或低比例拉伸的对位芳族聚酰胺短纤维制成的短纤维形成的耐热纤维纸片和包含耐热有机聚合物的有机树脂粘合剂和/或纤条体 作为主要成分，其中所述短纤维的量相对于所述耐热性纤维纸的总量为45〜97重量％ 所述有机树脂粘合剂和/或所述纤条体的总量相对于所述耐热纤维纸的总量为3〜55重量％ 并且所述有机树脂粘合剂固化，和/或所述未拉伸或低比例拉伸的对位芳族聚酰胺短纤维和所述纤条体部分地发生变形和/或熔融以显示粘合剂的作用。 得到的耐热纤维纸片具有优异的耐热性，优异的热尺寸稳定性，优异的聚苯乙烯强度，高湿度下的优异的电绝缘性等，尽管具有高的堆积密度，但具有良好的树脂浸渍性，以及 特别适合用作电绝缘材料的基材或用作电路用层压体的基材。

公开(公告)号：EP0792737B1

公开(公告)日：2002-06-26

申请号：EP97102705.7

申请日：1997-02-19

Applicant: SUMITOMO BAKELITE COMPANY LIMITED

Inventor： Nakata, Takahiro ,  Iida, Takahisa ,  Yamaguchi, Takashi ,  Kanazawa, Toshihide

IPC: B29C70/02 ,  B32B17/04 ,  B32B31/12

CPC classification number: B32B5/26 ,  B29C70/025 ,  B29C70/50 ,  B32B5/022 ,  B32B5/024 ,  B32B5/28 ,  B32B37/0038 ,  B32B38/08 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/20 ,  B32B2305/30 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293

公开(公告)号：EP1208267A1

公开(公告)日：2002-05-29

申请号：EP00944985.1

申请日：2000-06-29

Applicant: E. I. du Pont de Nemours and Company

Inventor： SUZUKI, Hiroyuki ,  HESSLER, Lee, James ,  WHITFIELD, Christopher, Roger

IPC: D21H13/26

CPC classification number: H05K1/0366 ,  D21H13/26 ,  H05K2201/0278 ,  H05K2201/0293

Abstract: A type of fiber paper is provided that is made of completely aromatic polyamide fiber formed by means of liquid crystal spinning. The fiber paper can be used as the base material of a substrate for electric circuit, and it can display high reliability in electric insulation under a high humidity, excellent post-heating dimensional stability, and high heat resistance.

公开(公告)号：EP1039004A1

公开(公告)日：2000-09-27

申请号：EP98956011.5

申请日：1998-12-01

Applicant: NITTO BOSEKI CO., LTD.

Inventor： KONNO, Michio ,  MIURA, Yasushi ,  SAITO, Shoichi ,  KASAI, Shin

IPC: D04H1/42 ,  D01D5/253 ,  C03B37/075 ,  C03B37/08

CPC classification number: H05K1/0366 ,  C03B37/083 ,  D04H1/4218 ,  D04H1/4226 ,  D04H1/4382 ,  D04H1/4391 ,  D04H3/00 ,  H05K2201/0293 ,  H05K2201/0296 ,  Y02P40/57

Abstract: A nonwoven fabric is constructed of a highly flat glass fiber which is a glass fiber whose section is flat and has a flatness ratio of 2.0 to 10 and which has such a section that the packing fraction is at least 85%, preferably at least 90%. In this nonwoven fabric, the glass fiber section has a shape near rectangle, and hence, the glass fibers can be arranged very densely to form a thin nonwoven fabric having a high bulk density, and when it is used as a laminate material, the glass fiber content can be increased and the surface smoothness can simultaneously be enhanced and can be used appropriately as a reinforcing material for a printed wiring board. Moreover, the above flat glass fiber can be produced by use of, for example, a nozzle having such a shape that one side of the major axis walls of a nozzle chip having a flat nozzle hole is partly notched.

Abstract translation: 的非织造织物被构造一个非常扁平的玻璃纤维的所有这是一种玻璃纤维，其截面是平的，并且具有2.0至10，其中A扁平比的已检查的部分做敛集率至少为85％，优选至少90％的 ， 在该非织造织物，玻璃纤维部分具有接近矩形的形状，并且因此，玻璃纤维可以被非常密集地布置，以形成具有高堆积密度的薄的无纺织物，并且当它被用作层压材料，玻璃 纤维含量可以增加和表面光滑度可以同时得到提升，可适当地使用作为强化材料的印刷电路板。 更完了，上述扁平玻璃纤维可通过使用来生产，例如，具有形状搜索的喷嘴那样具有平坦喷嘴孔的喷嘴片的长轴壁中的一个侧面部分地切口。

公开(公告)号：EP0908559A3

公开(公告)日：2000-03-29

申请号：EP98118922.8

申请日：1998-10-07

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC. ,  Kuraray Co., Ltd.

Inventor： Gaku, Morio c/o Mitsubishi Gas Chemical Co., Inc. ,  Nozaki, Mitsuru c/o Mitsubishi Gas Chem. Co., Inc. ,  Saimen, Kenji c/o Kuraray Co., Ltd. ,  Esaki, Tamemaru c/o Kuraray Co., Ltd.

IPC: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/00

CPC classification number: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

Abstract: There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement comprises a wet-system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290°C or higher( component A ) and a thermotropic cystalline polyester binder which has a melting point of 290°C or higher and is in the form of a film having holes including at least 5 holes /mm 2 each with an area of opening of 400 to 10000 µm 2 ( component B ), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring ( base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.