公开(公告)号：EP2259380A1

公开(公告)日：2010-12-08

申请号：EP10160447.8

申请日：2010-04-20

Applicant: Robert Bosch GmbH

Inventor： Guenter, Friedhelm ,  Mannal, Helmut ,  Fix, Andreas

IPC: H01R4/01 ,  H05K3/30 ,  F16B1/00

CPC classification number: H01R4/01 ,  F16B1/0014 ,  H01R4/24 ,  H01R4/2495 ,  H01R4/48 ,  H05K3/325 ,  H05K2201/0308 ,  H05K2201/10386 ,  H05K2201/10393

Abstract: Eine Verbindungsanordnung (10; 30; 40), besteht aus einem ersten Bauelement (11; 31; 41) und einem zweiten Bauelement (12; 36; 46), wobei wenigstens eines der Bauelemente (11, 12; 31, 36; 41, 46) zumindest teilweise aus einer Formgedächtnis-Legierung besteht und wobei zwischen den beiden Bauelementen (11, 12; 31, 36; 41, 46) eine kraft- bzw. formschlüssige Verbindung ausgebildet ist. Erfindungsgemäß ist vorgesehen, dass eines der Bauelemente (11, 12; 31, 36; 41, 46) der elektrischen Kontaktierung des anderen Bauelements (11, 12; 31, 36; 41, 46) dient.

Abstract translation: 该装置（30）具有一部件（31），即电连接线，包括具有半圆形模制侧面（32,33）的狭槽，其中侧面在热影响下移动并彼此对称地布置。 另一部件（36），即电子部件，具有直径大于前一部件的外径的保持开口。 前一部件由形状记忆合金制成，并且侧面部件以接合方式和/或形式配合方式在连接区域（35）处接触后者部件。 还包括用于制造连接装置的方法的独立权利要求。

公开(公告)号：EP1864557A1

公开(公告)日：2007-12-12

申请号：EP06723436.9

申请日：2006-03-15

Applicant: Sew-Eurodrive GmbH & Co. KG

Inventor： PRAUTZSCH, Harald

IPC: H05K1/02 ,  H05K7/20 ,  H01L23/367 ,  H01L23/40

CPC classification number: H05K1/0203 ,  H01L21/6835 ,  H01L2023/4031 ,  H01L2924/0002 ,  H05K3/0061 ,  H05K7/209 ,  H05K2201/09127 ,  H05K2201/10166 ,  H05K2201/10393 ,  H05K2201/10409 ,  H05K2201/10446 ,  H01L2924/00

Abstract: The invention relates to an electronic appliance and a method for producing an electronic appliance comprising semiconductors (l) and a cooling body (31) for heat dissipation to the surrounding environment or another medium. A highly heat-conductive part (24) is arranged on the cooling body (31), especially for conducting the heat of the semiconductor to the cooling body. According to the invention, a printed circuit board (23) is provided with semiconductors, cooling surfaces (2) of the semiconductors being applied to a partial region (21) of the printed circuit board, especially for adjustment purposes; the partial region (21) of the printed circuit board is broken off and/or removed; and the printed circuit board is connected, especially detachably connected, to the cooling body in such a way that the cooling surfaces (2) are applied to the highly conductive part (24) in an especially plane manner.

公开(公告)号：EP1860740A1

公开(公告)日：2007-11-28

申请号：EP06010699.4

申请日：2006-05-23

Applicant: Delphi Technologies, Inc.

Inventor： Hombach, Frank ,  Hupertz, Stefan ,  Noll, Diethelm

IPC: H01R13/24 ,  H05K3/34 ,  H01L33/00

CPC classification number: H05K3/301 ,  H05K3/3426 ,  H05K2201/0311 ,  H05K2201/10106 ,  H05K2201/10393 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2203/306 ,  Y02P70/613

Abstract: Die vorliegende Erfindung betrifft ein elektronisches Bauteil mit Kontaktelementen, insbesondere zur Kontaktierung des Bauteils mit einer Leiterplatte. Das erfindungsgemäße elektronische Bauteil umfasst Kontaktelemente, die zumindest abschnittsweise in ihrem Verlauf mehrere Abwinklungen aufweisen. Die Abwinklungen sind derart ausgebildet, dass die Kontaktelemente zumindest abschnittsweise faltbar sind. Die Kontaktelemente sind aus einem gefalteten Zustand in einer Hauptentfaltungsrichtung entfaltbar. Die Hauptentfaltungsrichtung erstreckt sich im Wesentlichen senkrecht zu einer Montagefläche der Leiterplatte.

Abstract translation: 组件（10）具有接触单元（12），该接触单元（12）与组件与印刷电路板（22）接触，其中接触单元具有一组弯曲部分。 接触单元可以以这样的方式可折叠，使得接触单元在主展开方向上从折叠状态展开。 该部件与印刷电路板的组装表面间隔开。 展开方向垂直于印刷电路板的组装表面延伸。 还包括用于使电子部件与印刷电路板接触的方法的独立权利要求。

公开(公告)号：EP1830621A1

公开(公告)日：2007-09-05

申请号：EP07405060.0

申请日：2007-02-27

Applicant: Landis+Gyr AG

Inventor： Amstad, Reto

IPC: H05K7/12

CPC classification number: H05K7/12 ,  H05K1/141 ,  H05K3/301 ,  H05K2201/10189 ,  H05K2201/10295 ,  H05K2201/10393 ,  H05K2201/10598

Abstract: Bei einer Vorrichtung zum Befestigen und Kontaktieren einer elektronischen Baugruppe (1) auf einer Leiterplatte (2) mit einer Oberseite (5) und einer Unterseite (11), weist die elektronische Baugruppe (1) mindestens einen ersten elektrischen Kontakt (21) auf, der mit einem entsprechenden ersten elektrischen Gegenkontakt (22) auf der Oberseite (5) der Leiterplatte (2) eine Wirkverbindung eingeht. Erfindungsgemäss ist eine Haltevorrichtung (6) vorgesehen ist, mit der die elektronische Baugruppe (1) an der Leiterplatte (2) gehalten ist, wobei mit der Haltevorrichtung (6) eine elektrische Verbindung zwischen der Leiterplatte (2) und der elektronischen Baugruppe (1) bereitgestellt ist.

Abstract translation: 该装置具有在电子组件（1）与销接触（21）与相应的弹簧销接触部（22）上的上侧有效连接的确褶皱的印刷电路板（5）（2）。 的保持装置（6）保持在电路板上的装配。 电路板和所述电子组件之间的电连接是由装置（6）提供。 该组件电性保持装置在其下侧相接触。

公开(公告)号：EP0892592B1

公开(公告)日：2006-01-18

申请号：EP98305617.7

申请日：1998-07-15

Applicant: Teikoku Tsushin Kogyo Co. Ltd.

Inventor： Yagi, Nobuyuki, Teikoku Tsushin Kogyo Co., Ltd., ,  Kinoshita, S., Teikoku Tsushin Kogyo Co., Ltd., ,  Tohma, Noburo, Teikoku Tsushin Kogyo Co., Ltd., ,  Nomura, Osamu, Teikoku Tsushin Kogyo Co., Ltd., ,  Nagatomo, Ikuo, Teikoku Tsushin Kogyo Co., Ltd., ,  Hosokawa Mitsuru, Teikoku Tsushin Kogyo Co., Ltd.,

IPC: H05K3/32 ,  H05K7/12

CPC classification number: H05K3/326 ,  H05K1/189 ,  H05K7/12 ,  H05K2201/09081 ,  H05K2201/10393 ,  H05K2201/10636 ,  H05K2201/10651 ,  Y02P70/611

公开(公告)号：EP1040737B1

公开(公告)日：2004-07-14

申请号：EP98959923.8

申请日：1998-12-11

Applicant: Nokia Corporation

Inventor： TUOVINEN, Risto

IPC: H05K7/12 ,  H01F27/06

CPC classification number: H05K1/165 ,  H01F27/06 ,  H01F27/263 ,  H05K7/12 ,  H05K2201/086 ,  H05K2201/09063 ,  H05K2201/10393

Abstract: The invention relates to an arrangement for implementing a planar magnetic circuit on a circuit board. The arrangement includes (a) a printed circuit board (PCB), wherein a conductive wire pattern of an inductive circuit is formed as well as openings (H1-H3) through the circuit board close to the conductive pattern, (b) two ferrite pieces (F1, F2), at least one of which can be fitted into the openings so that the pieces may be pressed against one another from opposite sides of the circuit board, and (c) a mechanical clamp (CL2, CL3, CL4) which can be fitted around the ferrite pices to lock them to each other, whereby the clamp extends around the ferrite pieces located on both sides of the circuit board. To eliminate gluing of ferrite pieces and to eliminate any relative movement between the ferrite pieces and the circuit board, the clamp is formed with spring-like protrusions (14-16) which are fitted in relation to the openings (H1-H3) in the circuit board so that they are pressed against the inner edges of the openings when the clamp is in its position around the ferrite pieces.

公开(公告)号：EP0479852B1

公开(公告)日：1997-03-12

申请号：EP90909875.8

申请日：1990-06-11

Applicant: GENERAL DATACOMM INDUSTRIES, INC.

Inventor： REYMOND, Welles, K. ,  SORRENTINO, Gregory, L.

IPC: H01R23/70 ,  H01R23/68

CPC classification number: H01R12/58 ,  H05K2201/10393 ,  H05K2203/176 ,  Y10T29/49218

Abstract: A pluggable electrical connector (10) is provided having contact elements (20) with first ends (32) soldered to a daughter board (40), mid-sections (36) which are crimped and bent through ninety degrees, and second ends (34) which have a converging portion and which terminate in bifurcated conical contact portions (38) which make contact with the rims of contact-quality plated through holes (51) of a mother board (50). By causing contact between the rim and the cone surface, normal forces greater than the mating force are generated. The connector housing (30) includes self-centering funnel openings (66) adjacent the mother board for centering the converging portions (37) of the contact elements (20) therein in a nominal position and for acting as a preloading stop. The housing also includes side-wall locking tabs (72) which hold adjacent rows of contacts at identical fixing points relative to the ninety-degree bend to ensure identical spring parameters for all contact elements.

公开(公告)号：EP0649272A1

公开(公告)日：1995-04-19

申请号：EP94202880.4

申请日：1994-10-05

Applicant: PHILIPS ELECTRONICS N.V.

Inventor： Weekamp, Johannus Wilhelmus, Int. Octrooibureau ,  Brandsma, Johannes, Int. Octrooibureau

IPC: H05K1/18

CPC classification number: B65D73/0021 ,  B65D73/0028 ,  H05K1/141 ,  H05K1/147 ,  H05K1/189 ,  H05K3/326 ,  H05K3/363 ,  H05K2201/049 ,  H05K2201/09081 ,  H05K2201/10393 ,  H05K2201/10636 ,  H05K2201/10681 ,  H05K2201/10727 ,  Y02P70/611 ,  Y10T29/49169 ,  Y10T29/49218

Abstract: Method of manufacturing a flexible fastening member, flexible fastening member and object provided with such a fastening member, support provided with an object and with such a fastening member, and packaging provided with a number of such fastening members.
The invention relates to a method of manufacturing a flexible fastening member (19) comprising a foil (1) for fastening an object (15) thereto, characterized by making at least two generally U-shaped incisions (5) which are spaced apart, which define a central portion (23) between them, and which are directed oppositely to another, the open ends of the U-shapes facing away from another so as to create two mutually opposed tags (11), and by bending the foil (1) along two parallel bending lines (13), each line being situated at the open end of a U-shaped incision (5) so as to obtain a generally U-shaped member (19) whose base is said central portion (23), and to obtain the tags (11) as extensions of the legs (25) of said U-shaped member and situated at one side of the plane (20) defined by the central portion (23), the legs (25) being situated at the other side of said plane (20).
The invention also relates to a fastening member obtained by the method, an object provided with such a fastening member, a support provided with an object and such a fastening member, and a packaging provided with a number of such fastening members.

Abstract translation: 制造柔性紧固件的方法，具有这种紧固件的柔性紧固件和物体，设置有物体的支撑件和这种紧固件，以及设置有多个这种紧固件的包装件。 本发明涉及一种制造柔性紧固件（19）的方法，所述柔性紧固件（19）包括用于将物体（15）紧固到其上的箔（1），其特征在于制备至少两个间隔开的大致为U形的切口（5）， 在它们之间限定一个中心部分（23），并且它们相对于另一个定位，所述U形的开放端部背向另一个，从而形成两个相互相对的标签（11），并且通过弯曲所述箔片（1） 沿着两个平行弯曲线（13），每条线位于U形切口（5）的开口端，以便获得其基部是所述中心部分（23）的大致U形的构件（19），以及 为了获得作为所述U形构件的腿部（25）的延伸部的标签（11），并且位于由中心部分（23）限定的平面（20）的一侧，腿部（25）位于 所述平面（20）的另一侧。 本发明还涉及通过该方法获得的紧固构件，设置有这种紧固构件的物体，设置有物体的支撑件和这种紧固构件以及设置有多个这种紧固构件的包装。

公开(公告)号：EP0538007A3

公开(公告)日：1994-07-13

申请号：EP92309361.1

申请日：1992-10-14

Applicant: Hewlett-Packard Company

Inventor： Matta, Farid ,  Douglas, Kevin ,  Pendse, Rajendra D. ,  Afshari, Brahram ,  Scholz, Kenneth D.

IPC: H05K3/32 ,  H05K7/10 ,  H01R13/24

CPC classification number: H01L23/4006 ,  H01L23/32 ,  H01L23/4985 ,  H01L2023/4062 ,  H01L2023/4087 ,  H01L2924/15173 ,  H05K3/325 ,  H05K7/1023 ,  H05K7/1061 ,  H05K2201/10393 ,  H05K2201/10681

Abstract: The invention is embodied in a demountable TAB assembly. By using two springs (508,504) in series, the present invention is able to maintain reliable contact between the TAB frame (302) and the printed circuit board (308) even if the elastomeric spring relaxes. The present invention also incorporates a novel TAB frame using contacts formed in an area-array. This area-array concept eliminates the need for fine line printed circuit board technology to support the TAB assembly.

Abstract translation: 本发明体现在可拆卸的TAB组件中。 通过使用串联的两个弹簧（508,504），即使弹性弹簧松弛，本发明也能够保持TAB框架（302）和印刷电路板（308）之间的可靠接触。 本发明还结合了使用在区域阵列中形成的触点的新型TAB框架。 该区域阵列概念无需使用细线印刷电路板技术来支持TAB组件。

公开(公告)号：EP0284855B1

公开(公告)日：1993-12-22

申请号：EP88103811.1

申请日：1988-03-10

Applicant: Siemens Nixdorf Informationssysteme Aktiengesellschaft

Inventor： Dubois, Dieter, Dipl.-Ing. ,  Breite, Helge

IPC: H01R23/66

CPC classification number: H05K3/326 ,  H01R12/79 ,  H05K1/118 ,  H05K2201/10189 ,  H05K2201/10393 ,  Y10T29/4913 ,  Y10T29/49147