Abstract:
O The disclosure relates to a system for implanting ions into a target element including a source arrangement (130) for producing an ion beam (131); a beam analyzing arrangement (140) for receiving the ion beam and selectively separating various ion species in the beam on the basis of mass to produce an analyzed beam; and a beam resolving arrangement (150) disposed in the path of the analyzed beam for permitting a preselected ion species to pass to the target element (171). The analyzing arrangement has an ion dispersion plane associated therewith. The source arrangement (130) has an associated ion emitting envelope (131A; 131B) including an area of substantial extension in a plane parallel to the ion dispersion plane and producing ions entering said analyzing arrangement which are travelling substantially either toward or from a common apparent line object lying in a plane perpendicular to the ion dispersion plane.
Abstract:
It has been found that the proportions of the various ions produced by a plasma discharge source depends on the temperature of the plasma. In this invention means are provided increasing the temperature of the plasma. This is achieved by an arrangement (18, 34) which provides a containing field 32 which restrains the passage of electrons from the plasma to the anode (12), both radially outwards and axially to the end walls (30).
Abstract:
In certain example embodiments of this invention, there is provide an ion source including an anode (25) and a cathode (5). In certain example embodiments, the cathode does not overhang over the anode, or vice versa. Since no, or fewer, areas of overhang are provided between the anode and cathode, there is less undesirable build-up on the anode and/or cathode during operation of the ion source so that the source can run more efficiently. Moreover, in certain example embodiments, an insulator (35) such as a ceramic or the like is provided between the anode and cathode.