摘要:
Disclosed is a semiconductor device that comprises a plurality of through-silicon vias (TSVs), a signal line and a selective connector (1634-1, 1634-2, 1634-3, 1634-4) for causing the signal line to be either electrically connected to one of the TSVs or electrically isolated from all of the TSVs, based on a control signal (1654). Also disclosed is a semiconductor device with through-silicon vias (TSVs) that comprises a primary TSV group (1604), a plurality of signal lines connected to the primary TSV group, a redundant TSV group (1608) and connection circuitry (1620B) responsive to a control signal having a predetermined value to electrically connect the signal lines to the redundant TSV group (1608).
摘要:
A composite memory device including discrete memory devices and a bridge device for controlling the discrete memory devices in response to global memory control signals having a format or protocol that is incompatible with the memory devices. The discrete memory devices can be commercial off-the-shelf memory devices or custom memory devices which respond to native, or local memory control signals. The global and local memory control signals include commands and command signals each having different formats. The composite memory device includes a system in package including the semiconductor dies of the discrete memory devices and the bridge device, or can include a printed circuit board having packaged discrete memory devices and a packaged bridge device mounted thereto.
摘要:
A Flash memory system architecture having serially connected Flash memory devices to achieve high speed programming of data. High speed programming of data is achieved by interleaving pages of the data to be programmed amongst the memory devices in the system, such that different pages of data are stored in different memory devices. A memory controller issues program commands for each memory device. As each memory device receives a program command, it either begins a programming operation or passes the command to the next memory device. Therefore, the memory devices in the Flash system sequentially program pages of data one after the other, thereby minimizing delay in programming each page of data into the Flash memory system. The memory controller can execute a wear leveling algorithm to maximize the endurance of each memory device, or to optimize programming performance and endurance for data of any size.
摘要:
Each memory cell string in a generic NAND flash cell block connects to a Common Source Line (CLS). A value for applying to the CSL is centrally generated and distributed to a local switch logic unit corresponding to each NAND flash cell block. For source-line page programming, the distribution line may be called a Global Common Source Line (GCSL). In an array of NAND flash cell blocks, only one NAND flash cell block is selected at a time for programming. To reduce power consumption, only the selected NAND flash cell block receives a value on the CSL that is indicative of the value on the GCSL. Additionally, the CSLs of non-selected NAND flash cell blocks may be disabled through an active connection to ground.
摘要:
A plurality of memory devices (e.g., DRAMs, SRAMs, NAND Flash, NOR Flash) is serially interconnected. Each of the interconnected devices receives a device identifier (ID) and latches it as its ID. Each device includes a circuit for calculating another ID or an incremented ID to generate it. The generated ID is transferred to another device and the ID is incremented in each of the devices in the serial interconnection. The last device in the interconnection provides a last generated ID that is provided to a memory controller having a recognition circuit that recognizes the total number of the serially interconnected devices, from the provided last generated ID. The recognition circuit recognizes the total output latency of the devices in the serial interconnection.
摘要:
A memory system architecture is provided in which a memory controller controls memory devices in a serial interconnection configuration. The memory controller has an output port for sending memory commands and an input port for receiving memory responses for those memory commands requisitioning such responses. Each memory device includes a memory, such as, for example, NAND-type flash memory, NOR-type flash memory, random access memory and static random access memory. Each memory command is specific to the memory type of a target memory device. A data path for the memory commands and the memory responses is provided by the interconnection. A given memory command traverses memory devices in order to reach its intended memory device of the serial interconnection configuration. Upon its receipt, the intended memory device executes the given memory command and, if appropriate, sends a memory response to a next memory device. The memory response is transferred to the memory controller.
摘要:
A hybrid solid-state memory system is provided for storing data. The solid-state memory system comprises a volatile solid-state memory, a non-volatile solid-state memory, and a memory controller. Further, a method is provided for storing data in the solid-state memory system. The method comprises the following steps. A write command is received by the memory controller. Write data is stored in the volatile memory in response to the write command. Data is transferred from the volatile memory to the non-volatile memory in response to a data transfer request.
摘要:
A system including a memory system and a memory controller is connected to a host system. The memory system has at least one memory device storing data. The controller translates the requests from the host system to one or more separatable commands interpretable by the at least one memory device. Each command has a modular structure including an address identifier for one of the at least one memory devices and a command identifier representing an operation to be performed by the one of the at least one memory devices. The at least one memory device and the controller are in a series-connection configuration for communication such that only one memory device is in communication with the controller for input into the memory system. The memory system can include a plurality of memory devices connected to a common bus.
摘要:
An apparatus, system, and method for controlling data transfer to an output port of a serial data link interface in a semiconductor memory is disclosed. In one example, a flash memory device may have multiple serial data links, multiple memory banks and control input ports that enable the memory device to transfer the serial data to a serial data output port of the memory device. In another example, a flash memory device may have a single serial data link, a single memory bank, a serial data input port, an control input port for receiving output enable signals. The flash memory devices may be cascaded in a daisy-chain configuration using echo signal lines to serially communicate between memory devices.
摘要:
A low power CAM architecture is disclosed. Matchlines of the CAM array are segmented into a pre search portion and a main search portion. After issuing a search command, a pre search operation is conducted on the pre search portion of the matchline. If the result of the pre search is a match, then the main search is subsequently conducted on the main search portion of the matchline. If the result of pre search is a mismatch, then the main-search is disabled, and consequently there is no power dissipation on the main search portion of the matchlines. Pre search and main search operations can be pipelined to maintain high throughput with minimum latency. Power consumption is further reduced by using a matchline sense circuit for detecting a current on the pre search and main search portions of the matchline. Matchlines are decoupled from the sense circuit sense node in order to achieve higher sensing speed and improved sense margins, and dummy matchlines are used to generate timed control signals for latching the output of the matchline sense circuits. The matchlines are initially precharged to a miss condition represented by ground potential and are then undergo accelerated precharge to a preset voltage potential level below VDD to overcome tail-out parasitic current and to minimize the voltage swing of the matchlines to conserve power.