公开(公告)号：EP2913135A3

公开(公告)日：2015-11-04

申请号：EP14193214.5

申请日：2014-11-14

Applicant: Endress + Hauser GmbH + Co. KG

Inventor： Birgel, Dietmar ,  Oschwald, Joachim ,  Glatz, Franz ,  Feucht, Michael

IPC: B23K3/08 ,  B23K31/12 ,  B23K1/20 ,  B23K3/047 ,  B23K3/03 ,  B23K1/005

CPC classification number: B23K3/08 ,  B23K1/0056 ,  B23K1/20 ,  B23K3/033 ,  B23K3/0478 ,  B23K31/12 ,  B23K31/125 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/3033 ,  B23K35/304 ,  B23K2201/42

Abstract: Es ist eine Fertigungseinrichtung und ein damit ausführbares Verfahren beschrieben, mit der bzw. mit dem Informationen über Prozessparameter von mit einem Lötroboter (7) der Fertigungseinrichtung ausgeführten Lötungen ableitbar sind. Hierzu umfasst die Fertigungseinrichtung eine auf einer Arbeitsebene (1) anzuordnende Temperaturmesseinrichtung (15), auf der mit dem Lötroboter (7) Testlötungen ausführbar sind, und eine an die Temperaturmesseinrichtung (15) angeschlossene Auswertungseinheit (31), die anhand der im Rahmen einer Testlötungen gemessenen Temperaturen (T) ein Temperaturprofil (T(t)) als Funktion der Zeit (t) ableitet und auswertet.

公开(公告)号：EP2589459A4

公开(公告)日：2015-08-05

申请号：EP11800638

申请日：2011-06-17

Applicant: SENJU METAL INDUSTRY CO

Inventor： UESHIMA MINORU ,  INAGAWA YOSHIMI ,  TOYODA MINORU

IPC: B23K35/26 ,  B23K1/00 ,  B23K101/40 ,  C22C12/00 ,  H05K3/34

CPC classification number: B23K35/264 ,  B23K1/0016 ,  B23K35/26 ,  B23K2201/42 ,  C22C12/00 ,  H05K3/3463 ,  H05K3/3494

公开(公告)号：EP2302083B1

公开(公告)日：2015-08-05

申请号：EP08810074.8

申请日：2008-08-29

Applicant: Tanigurogumi Corporation

Inventor： ISHIKAWA, Hisao ,  YOKOYAMA, Masanori

IPC: C22B25/08 ,  B23K1/08 ,  H05K3/34 ,  B23K1/00 ,  B23K3/06

CPC classification number: B23K1/085 ,  B23K1/0016 ,  B23K3/0653 ,  B23K2201/42 ,  B23K2203/12 ,  C22B25/08 ,  H05K3/3468

公开(公告)号：EP1817136B1

公开(公告)日：2015-04-08

申请号：EP05705554.3

申请日：2005-01-12

Applicant: DTG International GmbH

Inventor： MONCAVAGE, Charles

IPC: B23K31/02

CPC classification number: B23K37/0408 ,  B23K1/0016 ,  B23K3/087 ,  B23K2201/42 ,  H05K13/0069

公开(公告)号：EP2834579A1

公开(公告)日：2015-02-11

申请号：EP13716632.8

申请日：2013-03-28

Applicant: Illinois Tool Works Inc.

Inventor： NGAI, Douglas ,  TAY, Joo Yong ,  LIU, Wen-Feng ,  LOERA, Roberto P. ,  COOK, Steven Dwade

IPC: F27B9/30 ,  B23K1/008 ,  F27B9/32 ,  F27B9/34 ,  F27D1/16 ,  F27D17/00 ,  H05K3/34

CPC classification number: F27B9/3077 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/012 ,  B23K1/203 ,  B23K2201/42 ,  F27B9/32 ,  F27B9/34 ,  F27D1/1678 ,  F27D17/008 ,  H05K3/3494 ,  Y10T156/10

Abstract: A reflow oven used to join electronic components to a substrate includes a chamber housing having surfaces that are in contact with heated air mixed with contaminants, including flux, and an intermediate layer selectively applied to the surfaces of the chamber housing. The reflow oven may include fabricating the intermediate layer with a foam material, including foaming polymers, e.g., epoxy, polyurethane, polyester, and silicone, or a non-foam material, including non-foaming polymers, e.g., polytetrafluoroethylene and polyimide. A method of treating surfaces of a reflow oven exposed to contaminants, including flux, is further disclosed.

Abstract translation: 用于连接电子部件的衬底A回流焊炉包括室壳体具有表面的确是与与污染物混合加热的空气，包括焊剂接触，并且在中间层选择性地施加到所述腔室壳体的表面上。 回流炉可以包括有泡沫材料制造中间层，包含发泡聚合物，E. G.，环氧树脂，聚氨酯，聚酯，和聚硅氧烷，或具有非发泡材料，包括非发泡聚合物，E. G.，聚四氟乙烯和聚酰亚胺。 治疗回流的表面的方法烘箱暴露于污染物，包括助焊剂，是Furtherwirt游离缺失盘。

公开(公告)号：EP2834037A1

公开(公告)日：2015-02-11

申请号：EP13764662.6

申请日：2013-03-15

Applicant: Alpha Metals, Inc.

Inventor： KOEP, Paul, J. ,  TORMEY, Ellen, S. ,  SIDONE, Girard

IPC: B23K35/26

CPC classification number: H05K3/34 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/264 ,  B23K2201/42 ,  H05K3/3457 ,  H05K3/3484 ,  Y10T403/479

Abstract: A method of assembling components, such as electronic components, onto a substrate, such as an electronic substrate, includes applying solder paste to an electronic substrate to form a solder paste deposit, placing a low temperature preform in the solder paste deposit, processing the electronic substrate at a reflow temperature of the solder paste to create a low temperature solder joint, and processing the low temperature solder joint at a reflow temperature that is lower than the reflow temperature of the solder paste. Other methods of assembling components and solder joint compositions are further disclosed.

Abstract translation: 将诸如电子元件的元件组装到诸如电子基板的基板上的方法包括将焊膏施加到电子基板上以形成焊膏沉积物，将低温预制件放置在焊膏沉积物中，处理电子元件 在所述焊膏的回流温度下形成低温焊料接头，并且在低于所述焊膏的回流温度的回流温度下处理所述低温焊料接头。 还公开了其他组装组件和焊点组合物的方法。

公开(公告)号：EP2806995A2

公开(公告)日：2014-12-03

申请号：EP12803512.8

申请日：2012-12-04

Applicant: Robert Bosch GmbH

Inventor： DIEZ, Michael ,  GAUCH, Roland ,  LETSCH, Andreas

IPC: B23K26/00 ,  B23K26/36 ,  B23K26/40 ,  H01L27/142 ,  G03F7/20 ,  H01L21/027 ,  H01L31/18

CPC classification number: H01L31/188 ,  B23K26/0006 ,  B23K26/009 ,  B23K26/0622 ,  B23K26/364 ,  B23K2201/42 ,  B23K2203/30 ,  B23K2203/56 ,  H01L31/0463 ,  Y02E10/50

Abstract: The invention relates to a method for producing a structured multi-layered system (20) using a processing beam (L) of a wave length, capable of natural interference, for the at least one layer of the multi-layer system, which is at least partially permeable, said layer thickness (d; d1) of at least one first partially permeable layer (13, 25), the wavelength and intensity of the machining beam and their incidence angle are predetermined in such a way that in the first layer, in the active area of the treatment beam, an increased amount of energy is absorbed as a result of destructive interference, said quantity being equal to a modification of the energy threshold of the first layer or slightly above this.

公开(公告)号：EP2795392A1

公开(公告)日：2014-10-29

申请号：EP11878170.7

申请日：2011-12-22

Applicant: Intel Corporation

Inventor： LI, Yonggang ,  SALAMA, Islam ,  ZHANG, Chong

IPC: G02B26/10

CPC classification number: G02B26/10 ,  B23K2201/42 ,  G02F1/33 ,  G02F2001/291 ,  G02F2201/16

Abstract: A first acousto-optic deflector receives a laser beam. The first acousto-optic deflector diffracts the received laser beam along a first axis. A second acousto-optic deflector receives the diffracted laser beam. The second acousto-optic deflector diffracts the received diffracted laser beam along a second axis.

公开(公告)号：EP2259338B1

公开(公告)日：2014-09-17

申请号：EP10172652.9

申请日：2000-03-16

Applicant: Kaneka Corporation

Inventor： Okatsu, Toshihide c/o Kaneka Corporation ,  Kondo, Masataka ,  Hayashi, Akimine ,  Kuribe, Eiji

IPC: H01L31/18 ,  H01L21/60 ,  B23K3/06 ,  H01L31/00 ,  H01R4/02 ,  H05K13/06 ,  B23K1/06

CPC classification number: B23K3/0615 ,  B23K1/06 ,  B23K2201/42 ,  H01L21/67138 ,  H01L31/0201 ,  H01L31/046 ,  H01L31/188 ,  H01L2924/0002 ,  H01R43/02 ,  Y02E10/50 ,  H01L2924/00

公开(公告)号：EP2577694A4

公开(公告)日：2014-07-02

申请号：EP11787439

申请日：2011-05-26

Applicant: KEMET ELECTRONICS CORP

Inventor： MCCONNELL JOHN E ,  BULTITUDE JOHN ,  PHILLIPS REGGIE ,  HILL ALLEN ,  RENNER GARRY L ,  LESSNER PHILIP M ,  CHACKO ANTONY P ,  BELL JEFFREY ,  BROWN KEITH

IPC: H01G4/232 ,  H01G4/005 ,  H01G4/30

CPC classification number: H01G4/2325 ,  B23K1/0016 ,  B23K1/0053 ,  B23K1/008 ,  B23K1/203 ,  B23K35/0227 ,  B23K35/3613 ,  B23K2201/42 ,  H01G4/005 ,  H01G4/30 ,  H01L2224/83825 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/10253 ,  H01L2924/1461 ,  Y10T29/435 ,  H01L2924/00012 ,  H01L2924/00015 ,  H01L2924/00