公开(公告)号：EP2396140B1

公开(公告)日：2013-01-16

申请号：EP10754423.1

申请日：2010-09-03

Applicant: Heraeus Materials Technology GmbH & Co. KG

Inventor： SCHÄFER, Michael ,  SCHMITT, Wolfgang ,  ZENG, Jian

IPC: B23K35/02 ,  B23K35/34 ,  B23K35/36 ,  B23K35/365 ,  B22F1/00 ,  B22F7/04

CPC classification number: B23K35/34 ,  B22F1/0062 ,  B22F3/1003 ,  B22F7/04 ,  B23K1/0016 ,  B23K1/20 ,  B23K35/025 ,  B23K35/3602 ,  B23K35/3618 ,  B23K35/362 ,  B23K35/365 ,  B23K2201/36 ,  H01L24/83 ,  H01L2224/29324 ,  H01L2224/29339 ,  H01L2224/29344 ,  H01L2224/29347 ,  H01L2224/29355 ,  H01L2224/29364 ,  H01L2224/29369 ,  H01L2224/8384 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01047 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01061 ,  H01L2924/01073 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/00 ,  H01L2924/00014

公开(公告)号：EP2223771A4

公开(公告)日：2012-09-26

申请号：EP08855551

申请日：2008-11-25

Applicant: HARIMA CHEMICALS INC

Inventor： ISHIKAWA SHUNSUKE ,  SHINOZUKA AKIRA ,  AIHARA MASAMI

IPC: B23K35/363 ,  B23K35/02 ,  B23K35/362 ,  H05K3/34

CPC classification number: B23K35/3613 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/362 ,  B23K2201/36 ,  H05K3/3489

公开(公告)号：EP2300195A4

公开(公告)日：2012-07-18

申请号：EP09798430

申请日：2009-06-18

Applicant: MATERION ADVANCED MATERIALS TECHNOLOGIES AND SERVICES INC

Inventor： LICHTENBERGER HEINER

IPC: B23K35/30 ,  B23K35/22 ,  B23K35/26 ,  C22C5/02 ,  H01L21/60 ,  H01L23/04 ,  H01L23/10 ,  H01L23/28

CPC classification number: C22C5/02 ,  B23K35/3013 ,  B23K2201/36 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/166 ,  H01L2924/00

Abstract: Disclosed in this specification is a lead-free soldering alloy made of gold, tin and indium. The tin is present in a concentration of 17.5% to 20.5%, the indium is present in a concentration of 2.0% to 6.0% and the balance is gold and the alloy has a melting point between 290° C. and 340° C. and preferably between 300° C. and 340° C. The soldering alloy is particularly useful for hermetically sealing semiconductor devices since the melting temperature is sufficiently high to permit post-seal heating and sufficiently low to allow sealing of the semiconductor without causing damage.

公开(公告)号：EP2042260A3

公开(公告)日：2012-01-18

申请号：EP08016620.0

申请日：2008-09-22

Applicant: Heraeus Materials Technology GmbH & Co. KG

Inventor： Schmitt, Wolfgang ,  Dickel, Tanja ,  Stenger, Katja

IPC: B23K35/02 ,  B23K35/30

CPC classification number: B23K35/025 ,  B22F1/0059 ,  B23K35/3006 ,  B23K2201/36 ,  H01L24/32 ,  H01L2224/16225 ,  H01L2224/29339 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/8384 ,  H01L2924/00011 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/07811 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15747 ,  H01L2933/0033 ,  H01L2933/0075 ,  H01L2924/01031 ,  H01L2924/00

Abstract: Zur Herstellung einer elektrisch leitfähigen oder wärmeleitfähigen Verbindung zur Kontaktierung zweier Elemente wird erfindungsgemäß aus einer Metall-, insbesondere Silberverbindung, elementares Metall, insbesondere Silber, zwischen den Kontaktflächen gebildet. Erfindungsgemäß lässt sich die Verfahrenstemperatur bei der Anwendung eines Silberlots unter 240°C erniedrigen und der Verfahrensdruck auf Normaldruck senken. Eine erfindungsgemäße Kontaktierungspaste weist eine Metall-, insbesondere Silberverbindung auf, die sich unterhalb von 400°C unter Bildung von elementarem Silber zersetzt. Erfindungsgemäß erfolgt eine in situ Metallerzeugung aus einer chemischen Verbindung zur Herstellung eines Kontakts, der oberhalb der zu seiner Herstellung erforderlichen Temperatur verwendbar ist.

Abstract translation: 用于制造用于在两个元件之间产生金属接触的导电或导热部件（3a）的方法，例如 冷却体或太阳能电池（8）包括在彼此连接的接触区域之间从银化合物形成元素银。 银化合物是有机银化合物或碳酸银。 接触区域包括表面的贱金属。 该方法在400℃下进行。将含有银化合物的糊剂涂覆在接触区域上。 包括以下的独立权利要求：（1）在电子部件的金属连接面与其他部件的金属连接面之间制造完全平坦的金属接触的方法; 和（2）接触糊。

公开(公告)号：EP2296161A3

公开(公告)日：2011-12-14

申请号：EP10175763.1

申请日：2010-09-08

Applicant: Canon Kabushiki Kaisha

Inventor： Hasegawa, Mitsutoshi ,  Matsumoto, Mamo ,  Saito, Tomohiro

IPC: H01J9/26 ,  H01J31/12 ,  B23K26/32 ,  H01J29/86

CPC classification number: H01J9/261 ,  B23K26/08 ,  B23K26/206 ,  B23K26/32 ,  B23K35/286 ,  B23K35/3033 ,  B23K35/327 ,  B23K2201/36 ,  B23K2203/16 ,  C03C27/06 ,  C09J5/06 ,  C09J2203/318 ,  C09J2205/31 ,  H01J29/86 ,  H01J31/127 ,  H01J2329/8675

Abstract: A bonding step of an image display apparatus manufacturing method includes, after bringing a first or second substrate opposite to a face of a frame member having a bonding material thereon into contact with the bonding material, bonding the first or second substrate opposite to the face of the frame member having the bonding material thereon and the frame member to each other, by irradiating a laser beam to the bonding material through at least a underlying layer. Here, the underlying layer includes a material which absorbs the laser beam easily, and the laser beam is irradiated to a predetermined range. Thus, in bonding of base materials by irradiation of the laser beam, it is possible to reduce damages such as occurrence of disconnection and short circuit in wirings, and achieve reliability and excellent airtightness of the image display apparatus.

公开(公告)号：EP1927880A4

公开(公告)日：2010-10-20

申请号：EP06810411

申请日：2006-09-21

Applicant: SUMITOMO ELECTRIC INDUSTRIES ,  SUMITOMO ELEC HARDMETAL CORP

Inventor： FUSE KEIJI

IPC: G02B27/09 ,  B23K26/06 ,  B23K26/073 ,  G02B13/00

CPC classification number: G02B27/0955 ,  B23K26/066 ,  B23K26/0732 ,  B23K26/21 ,  B23K26/38 ,  B23K26/382 ,  B23K26/40 ,  B23K2201/006 ,  B23K2201/18 ,  B23K2201/36 ,  B23K2203/04 ,  B23K2203/50 ,  G02B19/0014 ,  G02B19/0052 ,  G02B27/0927 ,  G02B27/0944

公开(公告)号：EP1618605A4

公开(公告)日：2010-09-08

申请号：EP03790123

申请日：2003-11-25

Applicant: IBM

Inventor： FAROOQ MUKTA G ,  INTERRANTE MARIO J

IPC: H01L23/48 ,  B23K35/26 ,  H01L23/485 ,  H01L23/498 ,  H01L23/52 ,  H01L29/40 ,  H05K3/34

CPC classification number: H01L24/10 ,  B23K35/262 ,  B23K2201/36 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49827 ,  H01L24/13 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/15312 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H05K3/3436 ,  H05K3/3463 ,  H05K2201/10378 ,  H05K2201/10636 ,  H05K2201/10674 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/047 ,  Y02P70/611 ,  Y02P70/613 ,  H01L2224/29099 ,  H01L2924/01083 ,  H01L2924/01049 ,  H01L2924/00 ,  H01L2224/0401

公开(公告)号：EP2223771A1

公开(公告)日：2010-09-01

申请号：EP08855551.1

申请日：2008-11-25

Applicant: Harima Chemicals, Inc.

Inventor： ISHIKAWA, Shunsuke ,  SHINOZUKA, Akira ,  AIHARA, Masami

IPC: B23K35/363 ,  H05K3/34

CPC classification number: B23K35/3613 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/362 ,  B23K2201/36 ,  H05K3/3489

Abstract: There is provided a soldering flux in which the volatilized amount in reflow is reduced to enable soldering with a smaller environmental load while suppressing the stickiness of the flux residue and ensuring a high reliability. A solder paste composition using the same is also provided. The soldering flux comprises a base resin, an activating agent, and a solvent, wherein the solvent comprises an oil component having an iodine value of 120 to 170. Preferably, the content of the oil component is 22 to 80 % by weight relative to the whole flux. Also, the oil component preferably contains at least one of drying oil and semidrying oil, and more preferably contains one or more kinds selected from tung oil, poppy-seed oil, walnut oil, safflower oil, sunflower oil, and soy bean oil. The solder paste composition comprises the soldering flux described above and a solder alloy powder.

Abstract translation: 提供了一种助焊剂，其中回流中的挥发量降低，能够以更小的环境负荷进行焊接，同时抑制助焊剂残留物的粘性并确保高可靠性。 还提供了使用其的焊膏组合物。 助焊剂包括基础树脂，活化剂和溶剂，其中溶剂包含碘值为120至170的油组分。优选地，油组分的含量相对于所述油组分为22〜80重量％ 整体通量。 此外，油成分优选含有干油和半干油中的至少一种，更优选含有选自桐油，罂粟籽油，胡桃油，红花油，向日葵油，大豆油中的一种或多种。 焊膏组合物包含上述助焊剂和焊料合金粉末。

公开(公告)号：EP2209585A1

公开(公告)日：2010-07-28

申请号：EP08842505.3

申请日：2008-10-14

Applicant: BSH Bosch und Siemens Hausgeräte GmbH

Inventor： GARCIA JIMÉNEZ, Jose Ramon ,  BUÑUEL MAGDALENA, Miguel Angel ,  CEAMANOS GAYA, Jesús ,  DELGADO ALGUACIL, José David ,  GÓMEZ ORTIZ, Sergio ,  PEÑA TORRE, José Ignacio ,  ROMAN BASOLS, Carlos ,  SCHMALENSTROT, Rene ,  SOLA MARTINEZ, Daniel

IPC: B23K26/38 ,  B23K26/40 ,  F24C15/10 ,  H05B3/74

CPC classification number: F24C15/108 ,  B23K26/389 ,  B23K26/40 ,  B23K2201/36 ,  B23K2203/52 ,  F24C15/102

Abstract: The invention relates to a plate (10) made of glass or ceramic and a carrier component (12), wherein the plate (10) has an upper side (16) and a lower side (18) opposite the upper side (16), wherein at least one recess (20) for mounting a carrier component (12) is machined into the lower side (18). In order to create a robust and particularly temperature-resistant bond between the carrier component (12) and the plate (10), the invention proposes that the recess (20) is machined into the material of the plate (10) at least partially by laser machining.

公开(公告)号：EP2209582A1

公开(公告)日：2010-07-28

申请号：EP08837055.6

申请日：2008-10-10

Applicant: Raytheon Company

Inventor： RAJENDRAN, Sankerlingam ,  ABLES, Billy, D.

IPC: B23K26/03 ,  B23K26/08 ,  B23K26/36 ,  B23K26/40 ,  G01B11/24 ,  H01Q1/42 ,  H01Q15/00

CPC classification number: H01Q15/0013 ,  B23K26/032 ,  B23K26/0823 ,  B23K26/0853 ,  B23K26/361 ,  B23K26/40 ,  B23K2201/36 ,  B23K2203/12 ,  B23K2203/30 ,  B23K2203/50 ,  H01Q1/425

Abstract: According to one embodiment, a pattern forming system (10) includes a patterning tool (14), a multi-axis robot (12), a profilometer (16) and a simulation tool (26) that are coupled to a pattern forming tool (24) that is executed on a suitable computing system. The pattern forming tool (24) receives a contour measurement from the profilometer (16) and transmits the measured contour to the simulation tool (26) to model the electrical characteristics of a conductive pattern or a dielectric pattern on the measured contour. Upon receipt of the modeled characteristics, the pattern forming system (10) may adjust one or more dimensions of the pattern according to the model, and subsequently create, using the patterning tool (14), the corrected pattern on the surface.

Abstract translation: 。根据一个实施方式，形成一个系统图案包括图案化工具，多轴机器人，和toolthat被耦合到形成toolthat是一个合适的计算系统上执行的图案的模拟。成形工具的图案接收来自一个轮廓测量 构图工具和发送所测量的轮廓的仿真工具的导电图案或所测量的轮廓的介电图案的电特性进行建模。 在接收到模拟特性，图案形成系统可以调节图案gemäß到模型的一个或多个维度，并随后创建，使用图案化工具，在表面上的校正图案。