公开(公告)号：EP2650074A4

公开(公告)日：2014-06-18

申请号：EP12826272

申请日：2012-08-08

Applicant: PANASONIC CORP

Inventor： MINAMIO MASANORI ,  SASAOKA TATSUO

IPC: B23K20/00 ,  B23K35/22 ,  H01L21/60 ,  H01L23/50

CPC classification number: H01L21/4842 ,  B23K20/023 ,  B23K20/16 ,  B23K20/227 ,  B23K20/233 ,  B23K35/002 ,  B23K35/004 ,  B23K35/007 ,  B23K2201/18 ,  B23K2201/42 ,  B23K2203/04 ,  B23K2203/10 ,  B23K2203/12 ,  H01L21/4825 ,  H01L21/4835 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

公开(公告)号：EP2650074A1

公开(公告)日：2013-10-16

申请号：EP12826272.2

申请日：2012-08-08

Applicant: Panasonic Corporation

Inventor： MINAMIO, Masanori ,  SASAOKA, Tatsuo

IPC: B23K20/00 ,  H01L23/50 ,  H01L21/60

CPC classification number: H01L21/4842 ,  B23K20/023 ,  B23K20/16 ,  B23K20/227 ,  B23K20/233 ,  B23K35/002 ,  B23K35/004 ,  B23K35/007 ,  B23K2201/18 ,  B23K2201/42 ,  B23K2203/04 ,  B23K2203/10 ,  B23K2203/12 ,  H01L21/4825 ,  H01L21/4835 ,  H01L23/4334 ,  H01L23/495 ,  H01L23/49537 ,  H01L23/49575 ,  H01L24/73 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/00

Abstract: First, an aqueous solution (103) containing an oxide film remover is disposed on a junction region of a first metal plate (101). Then, with the aqueous solution (103) remaining on the first metal plate (101), a second metal plate (102) is placed on the first metal plate (101). Thereafter, a load is applied to junction regions of the first metal plate (101) and the second metal plate (102) in the vertical direction, thereby joining the first metal plate (101) and the second metal plate (102) together to form a junction portion (110). In this manner, a joined body is manufactured.

Abstract translation: 首先，为了wässrige溶液（103），所述氧化膜去除的被布置在第一金属板（101）的结区。 然后，用留在第一金属板（101）的wässrige溶液（103），第二金属板（102）被放置在第一金属板（101）。 有后，负载被施加到第一金属板（101）和在垂直方向上的第二金属板（102），从而连接所述第一金属板（101）和所述第二金属板（102）一起形成的结区 的接合部分（110）。 以这种方式，一个结合体制造。

公开(公告)号：EP2613892A1

公开(公告)日：2013-07-17

申请号：EP11823908.6

申请日：2011-07-20

Applicant: MacDermid Acumen, Inc.

Inventor： TOSCANO, Lenora, M. ,  LONG, Emest ,  PAW, Witold ,  KOLOGE, Donna, M. ,  KOYASU, Katsutsugu ,  NISHU, Keisuke

IPC: B05D3/00

CPC classification number: B23K1/203 ,  B23K1/0012 ,  B23K2201/42 ,  C23C18/1651 ,  C23C18/1653 ,  C23C18/34 ,  C23C18/36 ,  C23C18/54 ,  H01L33/60 ,  H01L2933/0025 ,  Y10T428/12896

Abstract: A method for treating a metal surface to reduce corrosion thereon and/or to increase the reflectance of the treated surface, the method comprising a) plating a metal surface with an electroless nickel plating solution; and thereafter b) immersion plating silver on the electroless nickel plated surface, whereby corrosion of the metal surface is substantially prevented and/or the reflectance of the silver plated surface is substantially improved. The treating method is useful for increasing the solderability of the metal surface, for example, in electronic packaging applications.

公开(公告)号：EP2402102A4

公开(公告)日：2013-07-03

申请号：EP10746120

申请日：2010-02-17

Applicant: SENJU METAL INDUSTRY CO

Inventor： ICHIKAWA HIROKAZU ,  OHTASHIRO TADAYOSHI ,  KIMOTO SHUNSUKE

IPC: B23K1/08 ,  B23K101/42 ,  H05K3/34

CPC classification number: B23K1/0016 ,  B23K1/085 ,  B23K3/0653 ,  B23K2201/42

公开(公告)号：EP2127800B9

公开(公告)日：2013-05-29

申请号：EP09006994.9

申请日：2009-05-26

Applicant: GAS - Automation GmbH

Inventor： Lorenz, Stefan ,  Rosenfelder, Frank ,  Heilmann, Matthias ,  Goedecke, Wolf-Dieter

IPC: B23K37/04 ,  B25B11/00 ,  H05K3/00 ,  H05K13/00

CPC classification number: H05K3/0052 ,  B23K26/083 ,  B23K26/0876 ,  B23K37/0408 ,  B23K2201/42 ,  B25B11/002 ,  H05K13/0069 ,  H05K2203/0165 ,  H05K2203/104

公开(公告)号：EP2202021B1

公开(公告)日：2013-05-22

申请号：EP09252890.0

申请日：2009-12-23

Applicant: Senju Metal Industry Co., Ltd

Inventor： Sato, Issaku ,  Takaguchi, Akira

IPC: B23K1/00 ,  B23K1/20 ,  B23K3/08 ,  B05B13/02 ,  B05B13/04 ,  B05C5/02 ,  H05K3/34

CPC classification number: B23K3/082 ,  B23K1/0016 ,  B23K1/203 ,  B23K3/087 ,  B23K2201/42 ,  H05K3/3447 ,  H05K3/3489 ,  H05K2203/0763 ,  H05K2203/1361

公开(公告)号：EP2106318A4

公开(公告)日：2013-05-01

申请号：EP07844124

申请日：2007-10-11

Applicant: FRY METALS INC

Inventor： ARORA SANYOGITA ,  FINKE MARTINUS N ,  SINGH BAWA ,  LEWIS BRIAN ,  MARCZI MICHAEL T ,  HOLTZER MITCHELL

IPC: B23K35/34

CPC classification number: B23K35/3613 ,  B23K35/362 ,  B23K2201/42 ,  C08K11/00 ,  H05K3/3489 ,  Y10T428/31504

Abstract: Flux formulations that remain pliable after deposition are disclosed. In certain examples, the flux comprises a first component and an effective amount of a second component to provide a pliable flux after deposition. The flux may also include activators, plasticizers and the like.

公开(公告)号：EP2541594A1

公开(公告)日：2013-01-02

申请号：EP10846493.4

申请日：2010-02-24

Applicant: Toyota Jidosha Kabushiki Kaisha

Inventor： MIZUNO Hiroki

IPC: H01L23/40 ,  B23K1/19 ,  B23K31/02

CPC classification number: B23K1/0016 ,  B23K1/0012 ,  B23K1/002 ,  B23K1/005 ,  B23K1/0056 ,  B23K1/012 ,  B23K9/16 ,  B23K2201/14 ,  B23K2201/42 ,  B23K2203/10 ,  B23K2203/12 ,  B23K2203/18 ,  H01L21/4882 ,  H01L23/3735 ,  H01L23/473 ,  H01L24/32 ,  H01L24/48 ,  H01L24/75 ,  H01L24/83 ,  H01L2224/291 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2224/7525 ,  H01L2224/75251 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/75261 ,  H01L2224/75264 ,  H01L2224/755 ,  H01L2224/75502 ,  H01L2224/83192 ,  H01L2224/832 ,  H01L2224/8322 ,  H01L2224/83224 ,  H01L2224/83237 ,  H01L2224/83815 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/0132 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/12042 ,  H01L2924/13055 ,  H01L2924/3025 ,  H01L2924/35121 ,  H01L2924/00 ,  H01L2924/01014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In the disclosed method for manufacturing a semiconductor module (100), a metal layer (20) and a cooler (30), which have different coefficients of thermal expansion from each other, are joined into a single unit via an insulating resin sheet (40). A work (1), comprising a semiconductor element (10) placed on the metal layer (20) with solder (15) interposed therebetween, is fed into a reflow furnace (200). The work, in that state, is heated in the reflow furnace (200), thereby mounting the semiconductor element (10) to the metal layer (20). The heating is carried out such that the temperature of the cooler (30) and the temperature of the metal layer (20) differ by an amount that make the cooler (30) and the metal layer (20) undergo the same amount of thermal expansion as each other.

Abstract translation: 在所公开的半导体模块（100）的制造方法中，具有不同的热膨胀系数的金属层（20）和冷却器（30）经由绝缘树脂片（40） ）。 包括置于其上的焊料（15）放置在金属层（20）上的半导体元件（10）的工件（1）被馈送到回流炉（200）中。 在该状态下的工件在回流炉（200）中加热，从而将半导体元件（10）安装到金属层（20）上。 进行加热，使得冷却器（30）的温度和金属层（20）的温度相差一定量，使得冷却器（30）和金属层（20）经受相同量的热膨胀 作为对方

公开(公告)号：EP2011599B1

公开(公告)日：2012-11-21

申请号：EP07741875.4

申请日：2007-04-18

Applicant: Hitachi Zosen Corporation

Inventor： FUKUDA, Naoaki ,  KUNISHIO, Kazuyoshi ,  NAKAYAMA, Shigeaki

IPC: B23K26/06 ,  B23K26/08 ,  H05K3/00 ,  H05K3/08 ,  B23K101/42

CPC classification number: B23K26/0604 ,  B23K26/0006 ,  B23K26/0608 ,  B23K26/0676 ,  B23K2201/42 ,  B23K2203/00 ,  B23K2203/56 ,  H05K3/0026 ,  H05K3/027 ,  H05K2201/0338 ,  H05K2203/108

公开(公告)号：EP2490514A1

公开(公告)日：2012-08-22

申请号：EP11008197.3

申请日：2011-10-11

Applicant: Mitsubishi Electric Corporation

Inventor： Miura, Tsuyoshi ,  Namikoshi, Kazuo

IPC: H05K3/34 ,  B23K1/08 ,  H05K1/11

CPC classification number: H05K3/3468 ,  B23K1/0016 ,  B23K1/085 ,  B23K1/203 ,  B23K2201/42 ,  H05K1/111 ,  H05K3/3421 ,  H05K2201/094 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10689 ,  H05K2203/046 ,  Y02P70/613

Abstract: A printed wiring board (1) has a solder-land group (5, 6) for placing a quad flat package IC (3), and the solder-land group (5, 6) consists of front solder-land groups (5) and rear solder-land groups (6). The printed wiring board 1 includes rear solder-drawing lands (9) that are positioned adjacent to rear solder-land groups (6), that have front edges each of which is substantially parallel to a longitudinal direction of rear solder lands (6a, 6b) constituting the rear solder-land group (6) and has a length approximately equal to or longer than that of the solder lands in the longitudinal direction, that are separated into two parts in a horizontal direction with respect to a traveling direction of solder flow such that a gap between the respective two separate lands (9) is made wider in its rearward portion than that in its frontward portion, and that have a slit (9a) substantially parallel to the longitudinal direction near the front edge.

Abstract translation: 印刷电路板（1）具有用于放置四边形扁平封装IC（3）的焊锡焊盘组（5,6），并且焊接焊盘组（5,6）由前焊接焊盘组（5）组成， 和后焊接组（6）。 印刷电路板1包括位于与后焊接台组（6）相邻的后焊盘（9），前后焊盘（9）具有大致平行于后焊盘（6a，6b）的纵向方向的前边缘 ），其长度大致等于或长于焊锡焊盘的长度方向的长度，相对于焊料流的行进方向在水平方向分离成两部分 使得相应的两个分离的平台（9）之间的间隙在其后部比其前部更宽，并且具有在前边缘附近基本上平行于纵向的狭缝（9a）。