公开(公告)号：EP1095975A2

公开(公告)日：2001-05-02

申请号：EP00122892.3

申请日：2000-10-20

Applicant: Sony Chemicals Corporation

Inventor： Kuniyoshi, Atsushi, c/o Sony Chem. Corp. ,  Fujii, Takato, c/o Sony Chem. Corp. ,  Kumakura, Masayuki, c/o Sony Chem. Corp.

IPC: C08K5/5353 ,  C09J167/00

CPC classification number: H05K3/386 ,  C08K5/5205 ,  C08K5/5353 ,  C08L2666/28 ,  C09J167/00 ,  H05K3/281 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2203/124 ,  C08L67/00

Abstract: Flame-retardant adhesives for circuit materials which are harmless to the environment, show excellent thermo-humidity resistant electrical characteristics and have high flame retardancy.
These flame-retardant adhesives contain a saturated polyester resin and a flame retarder containing a component having P-C bond in its molecule and a component having nitrogen in its molecule, and the content of the flame retardant amounts to 90 parts by weight or more per 100 parts by weight of the saturated polyester resin.

Abstract translation: 对环境无害的电路材料的阻燃粘合剂，具有优异的耐热电阻特性，具有高阻燃性。 这些阻燃性粘合剂含有饱和聚酯树脂和含有其分子中具有PC键的成分和分子中具有氮的成分的阻燃剂，阻燃剂的含量相对于100重量份为90重量份以上 的饱和聚酯树脂。

公开(公告)号：EP1019246A1

公开(公告)日：2000-07-19

申请号：EP98949433.1

申请日：1998-09-23

Applicant: Fibermark, Inc.

Inventor： KEMPF, Ulrich

IPC: B32B5/00 ,  B32B5/08

CPC classification number: D21H21/54 ,  B32B27/04 ,  C08J5/24 ,  D21H13/24 ,  D21H13/40 ,  D21H17/52 ,  D21H25/06 ,  H05K1/0366 ,  H05K1/0373 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0251 ,  H05K2201/0254 ,  H05K2201/0278 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/249994 ,  Y10T428/25 ,  Y10T428/27 ,  Y10T428/2933 ,  Y10T428/2962 ,  Y10T428/31663

Abstract: A pre-preg substrate, having a low dielectric constant and containing a substantially uniformly distributed hollow-glass-microsphere filler, and method for making the same. The pre-preg substrate is treated with impregnation and lamination techniques to form a laminate with a low dielectric constant, and good mechanical and electrical properties, suitable as a base material for surface mounted devices in high performance circuits. Improved pre-pregs for making high performance circuit boards and for making surface mounted integrated circuits. Improved high performance circuit boards for making surface mounted integrated circuits.

公开(公告)号：EP1009200A1

公开(公告)日：2000-06-14

申请号：EP98911183.6

申请日：1998-04-02

Applicant: Nitto Denko Corporation

Inventor： MIYAKE, Yasufumi ,  TERADA, Tetsuya ,  YAGURA, Kenkichi ,  MIYAAKE, Chiharu ,  SUGIMOTO, Toshihiko

IPC: H05K1/03 ,  H05K3/38

CPC classification number: H05K3/386 ,  H05K1/0326 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/281 ,  H05K3/361 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0355

Abstract: The present invention provides a rigid circuit member obtained by bending a composite laminate comprising a circuit conductor made of a metal foil interposed between plastic films having an elastic modulus of not less than 450 kg/mm 2 with an adhesive, characterized in that as said plastic film there is used a polyethylene naphthalate film. The present invention also provides a circuit board adapted to be connected to a conductor on a rigid substrate, characterized in that said circuit conductor is interposed between polyethylene naphthalate films. The present invention further provides a printed circuit board, comprising a polyethylene naphthalate film having an elastic modulus of not less than 500 kg/mm 2 , not more than 1.5 x 10 -5 /°C, a hygroscopic expansion coefficient of not more than 1.2 x 10 -5 /%RH, a water vapor permeability of not more than 15 g/m 2 /mil·day, a percent water absorption of not more than 2% and a melting point of not higher than 280°C and a conductor circuit integrated into a laminate with an adhesive layer provided interposed therebetween.

公开(公告)号：EP0915125A2

公开(公告)日：1999-05-12

申请号：EP98120989.3

申请日：1998-11-05

Applicant: OJI PAPER CO., LTD.

Inventor： Kato, Yoshihisa ,  Adachi, Takekazu ,  Murata, Mamoru

IPC: C08J5/24 ,  C08J5/04 ,  B32B27/02

CPC classification number: B32B5/26 ,  B32B5/022 ,  B32B5/28 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0269 ,  B32B2457/08 ,  C08J5/048 ,  C08J5/24 ,  C08J2361/06 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10T428/12569 ,  Y10T428/31594 ,  Y10T428/31725

Abstract: The present invention relates to a method of producing a laminate base material useful for preparing a prepreg or a laminate for electronic equipment such as printed board. The method comprises the steps of:

(1) preparing a slurry comprising para-aramid fibers and curable phenolic resin fibers;
(2) preparing a sheet from said slurry;
(3) adding a resin binder to said sheet so as to bond the fibers with each other, thereby to form a combined non-woven fabric and
(4) compressing said non-woven fabric under heating.

According to the present invention, a prepreg or laminate is obtained which has an improved high-frequency characteristics and much less warp.

Abstract translation: 本发明涉及一种制造层压基材的方法，所述层压基材用于制备用于诸如印刷板的电子设备的预浸料或层压体。 该方法包括以下步骤：（1）制备包含对位芳族聚酰胺纤维和可固化酚醛树脂纤维的浆料; （2）由所述浆料制备片材; （3）在所述片材中加入树脂粘合剂以将纤维相互粘合，从而形成组合的无纺织物，和（4）在加热下压缩所述无纺织物。 根据本发明，获得具有改善的高频特性和更小的翘曲的预浸料或层压材料。

公开(公告)号：EP0740013A4

公开(公告)日：1998-07-08

申请号：EP95938007

申请日：1995-11-15

Applicant: MITSUBISHI GAS CHEMICAL CO ,  JAPAN VILENE CO LTD

Inventor： KINBARA HIDENORI ,  NOZAKI MITSURU ,  MIZOGUCHI MASANOBU ,  KIMURA KOJI ,  SHIMONO NAOHIKO

IPC: C08J5/04 ,  C08J5/24 ,  D04H1/42 ,  D04H1/46 ,  D04H1/48 ,  D04H1/58 ,  D04H1/64 ,  D04H13/00 ,  H05K1/03 ,  D06M10/02 ,  C08J5/06 ,  D04H1/54

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D04H1/435 ,  D04H1/48 ,  D04H1/49 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/31 ,  Y10T428/31786 ,  Y10T442/689

Abstract: A sheet for a laminate comprising an unwoven fabric composed mainly of a liquid crystal polyester fiber subjected to processes for (1) cohesion, (2) adhesion to a thermosetting resin and (3) surface modification. Such sheets are impregnated with a thermosetting resin and dried to form prepregs for laminates. The sheet has a low dielectric constant, low hygroscopicity, strong adhesion and light weight, and it is easily impregnated with thermosetting resin.

公开(公告)号：EP0781501A1

公开(公告)日：1997-07-02

申请号：EP95931048.0

申请日：1995-09-05

Applicant: HOECHST CELANESE CORPORATION ,  Kuraray Co., Ltd.

Inventor： JESTER, Randy, D. ,  CULBERTSON, Edwin, C. ,  FRANK, Detlef, M. ,  ROUNSVILLE, Sherman, H. ,  PENOYER, John, A. ,  TSUDAKA, Takeichi ,  ONODERA, Mioru ,  SATO, Toshiaki ,  SANEFUJI, Toru

IPC: B32B7 ,  C08L67 ,  H05K1 ,  H05K3

CPC classification number: H05K3/4632 ,  H05K3/28 ,  H05K3/386 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/10378

Abstract: The invention provides a multilayer microelectronic circuit board comprising a laminate of a plurality of circuit layers containing conductive vias (12) within the layers or a combination of conductive vias (12) and conductive wiring patterns (16) on a surface of the layers, said layers comprising a first liquid crystal polymer (10) and, interposed between said circuit layers, a layer of second liquid crystal polymer (21) having a melting point of at least about 10 °C lower than the melting point of said first liquid crystal polymer (10). The boards are produced by stacking a plurality of circuit layer sheets (10) in appropriate electrical alignment such that they are separated by an interposed layer (21) of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers (22) in contact with the higher melting point polymer (23) of the circuit layers.

公开(公告)号：EP0740013A1

公开(公告)日：1996-10-30

申请号：EP95938007.2

申请日：1995-11-15

Applicant: MITSUBISHI GAS CHEMICAL COMPANY, LTD. ,  JAPAN VILENE COMPANY, LTD.

Inventor： KINBARA, Hidenori, Mitsubishi Gas Chemical Co.Ltd. ,  NOZAKI, Mitsuru, Mitsubishi Gas Chemical Co., Ltd. ,  MIZOGUCHI, Masanobu Japan Vilene Company, Ltd. ,  KIMURA, Koji Japan Vilene Company, Ltd. ,  SHIMONO, Naohiko Japan Vilene Company, Ltd.

IPC: D06M10/02 ,  D04H1/48 ,  D04H1/54 ,  H05K1/03 ,  C08J5/06

CPC classification number: C08J5/046 ,  B32B5/28 ,  C08J5/24 ,  D04H1/435 ,  D04H1/48 ,  D04H1/49 ,  D04H1/587 ,  D04H1/64 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  H05K2203/1105 ,  Y10S428/901 ,  Y10T428/31 ,  Y10T428/31786 ,  Y10T442/689

Abstract: A substrate for a laminate which comprises a nonwoven fabric which is composed mainly of a liquid crystal polyester fiber, and which is subjected to (1) an entangling treatment, (2) a heating treatment to impart adhesivity to a thermosetting resin, and (3) a surface-modifying treatment, and a laminate containing at least one prepreg prepared by impregnating the substrate with a thermosetting resin and drying are disclosed. The substrate of the present invention has low dielectric constant, is light, exhibits low hygroscopicity, and has good properties to be impregnated with the thermosetting resin and good adhesiveness to the thermosetting resin.

Abstract translation: 将其进行（1）至缠结处理为，它包括一个非织造织物层压件的基质的，全部这主要的液晶聚酯纤维构成的，并且所有的，（2）加热处理，以赋予粘合性的热固性树脂，和（3 ）的表面改性处理，和含有由含浸热固性树脂和干燥基片制备的至少一种半固化片一个层压体游离缺失光盘。 本发明的基片具有低的介电常数，轻，低吸湿性，并且具有与热固性树脂和良好的粘合性，以热固性树脂浸渍良好的特性。

公开(公告)号：EP0603745A1

公开(公告)日：1994-06-29

申请号：EP93120294.9

申请日：1993-12-16

Applicant: GRANMONT INCORPORATED

Inventor： Vancho, Vincent M. ,  Wu, Hak H. ,  Ma, Yutao ,  Jorgensen, Erik Lund

IPC: H05K1/03 ,  C08J5/04

CPC classification number: H05K1/0366 ,  C08J5/04 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/24917

Abstract: Composite printed circuit board substrates having fiber reinforcement in a polymer matrix are disclosed. The fibres may be thermotropic melt processable liquid crystal polymer fibers.

Abstract translation: 公开了在聚合物基质中具有纤维增强的复合印刷电路板基底。 纤维可以是热致熔融加工的液晶聚合物纤维。

公开(公告)号：EP0592937A2

公开(公告)日：1994-04-20

申请号：EP93116195.4

申请日：1993-10-06

Applicant: NITTO DENKO CORPORATION

Inventor： Ichikawa, Hiroki, c/o Nitto Denko Corporation ,  Okuno, Toshimitsu, c/o Nitto Denko Corporation ,  Aizawa, Kaoru, c/o Nitto Denko Corporation

IPC: H01B3/30

CPC classification number: H05K1/036 ,  H05K1/0254 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0158 ,  H05K2201/0209

Abstract: A tracking resistant material wherein a carbonized product forming ratio [(energy necessary for forming the carbonized product)/(energy necessary for thermal decomposition)] is 0.45 or less, and comparative tracking indexes of the front surface and the back surface thereof by a tracking resistance test of an IEC method are at least 400 V.

Abstract translation: 碳化产物形成率[（形成碳化物所需的能量）/（热分解所需的能量）]为0.45以下的耐追踪材料，其跟踪的前表面及背面的比较追踪指标 IEC方法的电阻测试至少为400V。

公开(公告)号：EP0576169A3

公开(公告)日：1994-04-13

申请号：EP93304408.3

申请日：1993-06-07

Applicant: IMPERIAL CHEMICAL INDUSTRIES PLC

Inventor： Higgins, David Edward ,  Wright, Martin

IPC: C08J7/04 ,  C09D133/06 ,  B32B27/08

CPC classification number: C08J7/047 ,  C08J5/124 ,  C08J2367/02 ,  C08J2433/00 ,  H05K1/036 ,  H05K2201/0145 ,  Y10T428/24901 ,  Y10T428/31797 ,  Y10T428/31913 ,  Y10T428/3192

Abstract: A polymeric film has a polyester substrate layer and an adherent layer of an acrylic resin and a phthalate ester. The adherent layer preferably contains an additional cross-linking agent. The adherent layer exhibits improved adhesion to the substrate and to a range of subsequently applied layers, such as inks and lacquers, vinyl chloride polymer.

Abstract translation: 聚合物膜具有聚酯基底层和丙烯酸树脂和邻苯二甲酸酯的粘合层。 粘附层优选含有另外的交联剂。 该粘合层对基材和一系列随后施加的层如油墨和油漆，氯乙烯聚合物表现出改进的粘合性。