摘要:
A curable organic resin composition comprising (A) 100 parts by weight of a curable organic resin and (B) 0.01 to 100 parts by weight of a thiocyanato-containing organohydrocarbonxysilane or isothiocyanato-containing organohydrocarbonoxysilane represented by the general formula: X-R>1 2 3 1 2 3
摘要:
Disclosed is a composite dielectric sheet used for manufacturing a multilayer electronic component. This composite dielectric sheet has not only flexibility and high dielectric constant but also high withstand voltage. Specifically disclosed is a composite dielectric sheet (3) containing a polyvinyl acetal resin, a high dielectric constant filler which is present in the polyvinyl acetal resin in a dispersed state and surface-treated with a coupling agent, and a crosslinking agent having two or more functional groups which are reactive with both the polyvinyl acetal resin and the high dielectric constant filler surface. Such a composite dielectric sheet (3) can be used for a multilayer electronic component such as a multilayer capacitor (1).
摘要:
A Cr-free steel sheet includes a Zn-based electroplated steel sheet, a Cr-free layer which is formed by a Cr-free treatment liquid coated on the steel sheet, the Cr-free treatment liquid containing silicate of 3 to 40 parts by weight, silane of 0.5 to 10 parts by weight, titanium compound of 0.2 to 8 parts by weight, binder resin of 10 to 50 parts by weight, the binder resin being selected from the group consisting of urethane resin, epoxy resin and a combination thereof, and phosphoric ester of 1 to 5 parts by weight based on the Cr-free treatment liquid of 100 parts by weight, and a resin layer which is formed by a resin treatment liquid coated on the Cr-free layer, the resin treatment liquid containing melamine resin of 3 to 25 parts by weight, colloidal silica of 10 to 20 parts by weight, metal powder of 5 to 40 parts by weight, and phosphoric ester of 1 to 5 parts by weight based on phenoxy resin of 100 parts by weight.
摘要:
Water absorption resistant polyimide/epoxy-based compositions, like pastes (or solutions), are particularly useful to make electronic screen-printable materials and electronic components. A group of hydrophobic epoxies (and soluble polyimides) was discovered to be particularly resistant to moisture absorption. The polyimide/epoxy pastes made with these epoxies (and these polyimides) may optionally contain thermal crosslinking agents, adhesion promoting agents, blocked isocyanates, and other inorganic fillers. The polyimide/epoxy pastes of the present invention can have a glass transition temperature greater than 250° C., a water absorption factor of less than 2%, and a positive solubility measurement.
摘要:
The invention concerns a coextrusion binder comprising a mixture of at least one ethylene homo- or copolymer (A1) of density ranging between 0.940 and 0.980 g/cm3 with at least one propylene homo- or copolymer (B), said mixture being grafted by at least one functional monomer and optionally diluted in at least one non-grafted ethylene homo- or copolymer (A2) of density ranging between 0.940 and 0.980 g/cm3, the grafting rate of said coextrusion binder being less than 0.5 wt. % based on the total weight of said binder; the density of said binder ranging between 0.940 and 0.980 g/cm3. The invention also concerns a structure comprising said type of binder as well as its use.
摘要:
The present invention provides a composite dielectric sheet used to manufacture a multilayer electronic component. The composite dielectric sheet is flexible and has a high dielectric constant and high dielectric strength. The composite dielectric sheet contains a polyvinyl acetal resin; a high-dielectric constant filler, surface-treated with a coupling agent, dispersed in the polyvinyl acetal resin; and a crosslinking agent having two or more functional groups reactable with the polyvinyl acetal resin and the surface-treated high-dielectric constant filler. The composite dielectric sheet (3) is suitable for use in a multilayer electronic component such as a monolithic capacitor (1).
摘要:
An epoxy resin composition for printed wiring boards which comprises an epoxy resin, a phenolic novolak, a curing accelerator, and a silica filler, characterized in that the silica filler has a shape having at least two planes and has an average particle diameter of 0,3 to 10 µm and a specific surface area of 8 to 30 m 2 /g. The epoxy resin composition has a higher apparent viscosity than the resins and can hence be inhibited from sagging in a drying oven. This composition reloins the intact property of infiltrating into reinforcements because the viscosity of the resins themselves has not increased today. The composition hence produces the effect of improving the appearance of a prepreg.
摘要:
A magnetic encoder, which comprises a stainless steel sheet ; and an under coat adhesive containing epoxy resin and organopolysiloxane, a top coat adhesive containing phenol resin, or phenol resin and epoxy resin, and a rubber magnet, as successively laid one upon another on the stainless steel sheet, has distinguished water resistance and saline water resistance, and thus can be effectively used particularly as a magnetic encoder in wheel speed sensors.
摘要:
The invention provides protective articles comprising a backing that comprises a fluorinated polymer and a curable adhesive on at least one layer of the backing. The protective articles of the invention may be used to provide substrates or articles of the invention having a fluorinated surface. The invention also provides methods of preparing such articles, methods of repairing appliqués, and methods of edge sealing appliqués.