公开(公告)号：EP1204304A2

公开(公告)日：2002-05-08

申请号：EP01125895.1

申请日：2001-10-30

Applicant: Visteon Global Technologies, Inc.

Inventor： Achari, Achyuta ,  Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R.

IPC: H05K3/02

CPC classification number: B32B15/018 ,  B32B15/017 ,  C23C2/26 ,  C23C2/28 ,  C23C26/00 ,  H05K3/022 ,  H05K2201/0361

Abstract: A tri-metallic material for use in the manufacture of printed circuit boards is described. and the process for its manufacture is described. The tri-metallic material is a sandwich wherein a copper layer is essential the "bread" of the sandwich and an aluminum layer is the filling between both slices of bread. A metallic bonding and/or barrier layer is spread on the aluminum and is selected for its highly non-corrosive properties as well as its bonding, and diffusion inhibiting capabilities.

Abstract translation: 描述了用于制造印刷电路板的三金属材料。 描述了其制造过程。 三金属材料是夹层，其中铜层是三明治的“面包”必不可少的，并且铝层是两片面包之间的填充物。 金属粘合和/或阻挡层散布在铝上，并且因其高度非腐蚀性以及其粘合和扩散抑制能力而被选择。

公开(公告)号：EP1187519A2

公开(公告)日：2002-03-13

申请号：EP01121371.7

申请日：2001-09-06

Applicant: Visteon Global Technologies, Inc.

Inventor： Shi, Zhong-You (Joe) ,  Glovatsky, Andrew Z. ,  Goenka, Lakhi N.

IPC: H05K3/40 ,  H05K3/46

CPC classification number: H05K3/4038 ,  H05K3/062 ,  H05K3/445 ,  H05K3/4641 ,  H05K2201/0305 ,  H05K2201/0361 ,  H05K2201/0373 ,  H05K2201/0394 ,  H05K2201/0397 ,  H05K2201/09581 ,  H05K2203/1438 ,  Y10T29/49117 ,  Y10T29/49126 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

Abstract: A method for forming connections within a multi-layer electronic circuit board. The method includes forming an aperture within the circuit board and selectively coating the interior surface of the aperture with a polar solder mask material that is effective to bond with solder that is selectively inserted into the aperture, thereby retaining the solder within the aperture and improving the electrical connection provided by the solder.

Abstract translation: 一种用于在多层电子电路板内形成连接的方法。 该方法包括在电路板内形成孔，并用极性焊料掩模材料选择性地涂覆孔的内表面，该极性焊料掩模材料有效地与选择性地插入到孔中的焊料结合，从而将焊料保持在孔内并改善 由焊料提供的电气连接。

公开(公告)号：EP1006765A2

公开(公告)日：2000-06-07

申请号：EP99309654.4

申请日：1999-12-01

Applicant: Ford Motor Company

Inventor： Goenka, Lakhi Nandlal ,  Paruchuri, Mohan R.

IPC: H05K3/46

CPC classification number: H05K3/4685 ,  H05K3/062 ,  H05K3/205 ,  H05K3/386 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: A multi-layer circuit board having strengthened air bridge crossover structures, and additive and subtractive methods for producing the same, wherein the circuit includes specially designed metallic fortifying layers (52,54) to mechanically and/or electrically fortify the circuit. A preferred embodiment includes air bridge structures (90) having generally T-shaped cross-sections (99), which provide strengthened, mechanically robust air bridges (33) which are especially resistant to damage from flexure and displacement due to physical impact, bending, thermal excursions, and the like.

Abstract translation: 一种具有加强的空气桥交叉结构的多层电路板及其制造方法，其中电路包括专门设计的金属防腐层（52,54），以机械和/或电气强化电路。 优选的实施例包括具有大致T形横截面（99）的空气桥结构（90），其提供加强的机械坚固的空气桥（33），其特别地抵抗由于物理冲击，弯曲， 热偏移等。

公开(公告)号：EP0929208A2

公开(公告)日：1999-07-14

申请号：EP99300207.0

申请日：1999-01-12

Applicant: Ford Motor Company

Inventor： Zitzmann, Alice Dawn ,  McLeskey, Edward P. ,  Belke, Robert Edward, Jr. ,  Trublowski, John

IPC: H05K3/46 ,  H05K3/40 ,  H05K3/44 ,  H05K3/00

CPC classification number: H05K3/4046 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/0058 ,  H05K3/022 ,  H05K3/3447 ,  H05K3/386 ,  H05K3/403 ,  H05K3/4084 ,  H05K3/4092 ,  H05K3/445 ,  H05K3/4614 ,  H05K3/4623 ,  H05K3/4632 ,  H05K3/4635 ,  H05K3/4685 ,  H05K2201/0129 ,  H05K2201/0361 ,  H05K2201/0397 ,  H05K2201/10303 ,  Y10T29/49126 ,  Y10T29/49156

Abstract: A method of manufacturing an improved multi-layer printed circuit assembly having at least two conductor patterns. The method includes providing a first layer having a first metal surface a second layer having a second metal surface. A thin flexible carrier is placed between the first and second layers. The first and second layers are attached to opposite surfaces of the carrier. The first and second metal surfaces are etched to form first and second conductor patterns. The conductor patterns form the electrical traces interconnecting components on an electronic circuit assembly. The first and second conductor patterns are electrically connected to form an electronic circuit assembly that includes electronic traces on both sides of the circuit board.

公开(公告)号：EP0926267A1

公开(公告)日：1999-06-30

申请号：EP98310604.8

申请日：1998-12-22

Applicant: Ford Motor Company

Inventor： Achari, Achyuta ,  Li, Delin

IPC: C23F1/36

CPC classification number: H05K3/062 ,  C23F1/36 ,  H05K3/067 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: An etchant useful for chemically milling aluminium from tri-metal layers of copper-aluminium-copper being copper circuit patterns present on opposing surfaces of an aluminium foil, one of the copper patterns being laminated onto a substrate, the etchant comprising an aqueous solution of: (1) 60 to 500 g/l base selected from (a) sodium hydroxide, (b) potassium hydroxide, and (c) their mixture; and (2) 70 to 500 g/l of a nitrate salt.

Abstract translation: 用于从由铜电路图案本铝箔的相对的表面上的铜 - 铝 - 铜的三金属层化学蚀刻铝的蚀刻剂是有用的，所述铜图形中的一个被层压到基材中，蚀刻剂包括wässrige溶液： （1）选自（a）氢氧化钠，（b）中的氢氧化钾，和（c）它们的混合物中选择60〜500克/升底座; 和（2）70至500克/升硝酸的盐。

公开(公告)号：EP0926266A1

公开(公告)日：1999-06-30

申请号：EP98310448.0

申请日：1998-12-18

Applicant: Ford Motor Company

Inventor： Paruchuri, Mohan R. ,  Achari, Achyuta

IPC: C23F1/36

CPC classification number: C23F1/36 ,  H05K3/062 ,  H05K3/067 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4685 ,  H05K2201/0361 ,  H05K2201/0394 ,  H05K2203/0152 ,  H05K2203/0369 ,  H05K2203/0376

Abstract: An etchant useful for chemically milling aluminium from tri-metal layers of copper-aluminium-copper being copper circuit patterns present on opposing surfaces of an aluminium foil, one of the copper patterns being laminated onto a substrate, the etchant comprising an aqueous solution of: (1) 60 to 500 g/l base selected from (a) sodium hydroxide, (b) potassium hydroxide, and (c) their mixture; and (2) 30 to 500 g/l of a nitrite salt, borate salt, a bromate salt, or a mixture of any of them.

Abstract translation: 用于从由铜电路图案本铝箔的相对的表面上的铜 - 铝 - 铜的三金属层化学蚀刻铝的蚀刻剂是有用的，所述铜图形中的一个被层压到基材中，蚀刻剂包括wässrige溶液： （1）选自（a）氢氧化钠，（b）中的氢氧化钾，和（c）它们的混合物中选择60〜500克/升底座; 和（2）30至500克/升亚硝酸盐，硼酸盐，溴酸盐，或它们的任意混合物。

公开(公告)号：EP0545328A3

公开(公告)日：1993-11-18

申请号：EP92120367.5

申请日：1992-11-28

Applicant: Hitachi Chemical Co., Ltd.

Inventor： Fukutomi, Naoki ,  Nakayama, Hajime ,  Tsubomatsu, Yoshiaki ,  Kaitou, Kouichi ,  Yoshidomi, Yasunobu ,  Takahashi, Yoshihiro

IPC: H05K3/00 ,  H05K3/06

CPC classification number: H05K3/428 ,  H05K3/04 ,  H05K3/205 ,  H05K3/4647 ,  H05K3/4652 ,  H05K3/4658 ,  H05K2201/0355 ,  H05K2201/0361 ,  H05K2201/09509 ,  H05K2201/09563 ,  H05K2201/09781 ,  H05K2203/0152 ,  H05K2203/025 ,  H05K2203/0376 ,  H05K2203/0384 ,  H05K2203/0726 ,  H05K2203/0733 ,  H05K2203/1476 ,  Y10S29/016 ,  Y10T29/49156 ,  Y10T29/49158

Abstract: A wiring board is fabricated through the following steps:
(A) forming, on one side of an elongated carrier metal foil made of a first metal, a thin layer with a second metal whose etching conditions are different from those of the first metal; (B) forming, on a surface of the thin layer, a desired wiring pattern with a third metal whose etching conditions are different from those of the second metal; (C) superposing the carrier metal foil on an insulating substrate with the side of the wiring pattern being positioned inside, whereby the wiring pattern is embedded in the insulating substrate; and (D) etching off the carrier metal foil and the thin layer at desired parts thereof.