LIQUID SOLDER RESIST COMPOSITION AND PRINTED CIRCUIT BOARD

    公开(公告)号:EP3264176A4

    公开(公告)日:2018-03-28

    申请号:EP16894285

    申请日:2016-10-12

    发明人: SAKAI YOSHIO

    IPC分类号: G03F7/004 G03F7/027 H05K3/28

    CPC分类号: G03F7/004 G03F7/027 H05K3/28

    摘要: The present invention aims to provide a liquid solder resist composition in which a solder resist layer formed with the liquid solder resist composition can have a matte surface due to resin components in the composition. A liquid solder resist composition according to the present invention contains a carboxyl group-containing resin (A), a thermosetting component (B), a photopolymerizable component (C), a photopolymerization initiator (D), and a coloring agent (E). The thermosetting component (B) contains a powdery epoxy compound (B11) represented by following formula (1). An amount of the epoxy compound (B11) with respect to a total amount of the carboxyl group-containing resin (A), the thermosetting component (B), and the photopolymerizable component (C) is within a range of 15 to 40 weight%

    LIQUID SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD
    56.
    发明公开
    LIQUID SOLDER RESIST COMPOSITION AND COVERED PRINTED WIRING BOARD 审中-公开
    液体焊料抗蚀剂组合物和覆盖印刷线路板

    公开(公告)号:EP3232269A1

    公开(公告)日:2017-10-18

    申请号:EP14907950.1

    申请日:2014-12-10

    摘要: A liquid solder resist composition contains: a carboxyl group-containing resin; a photopolymerizable compound which contains one or more kinds of compounds selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer; a photopolymerization initiator; an epoxy compound; and titanium dioxide. The carboxyl group-containing resin is obtained by polymerization of a monomer composition which contains: a carboxyl group-containing monomer represented by following formula (1); and a maleimide compound represented by following formula (2). The carboxyl group-containing resin does not contain a photopolymerizable functional group. In the formula (1), X represents R a -COO.

    摘要翻译: 液态阻焊剂组合物含有:含羧基树脂; 含有一种或多种选自光聚合性单体和光聚合性预聚物的化合物的光聚合性化合物; 光聚合引发剂; 环氧化合物; 和二氧化钛。 含羧基树脂通过使含有下述式(1)所示的含羧基单体的单体组合物聚合而得到。 和由下式(2)表示的马来酰亚胺化合物。 含羧基树脂不含光聚合性官能团。 式(1)中,X表示Ra-COO。

    SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD
    57.
    发明公开
    SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD 审中-公开
    焊料组合物和涂层印刷线路板

    公开(公告)号:EP3232267A1

    公开(公告)日:2017-10-18

    申请号:EP15868034.8

    申请日:2015-08-17

    摘要: A solder resist composition includes: (A) a carboxyl group-containing resin; (B) an epoxy compound; (C) titanium dioxide; (D) a photopolymerization initiator; and (E) an antioxidant. The component (B) contains a hydroquinone epoxy compound represented by following formula (1). The component (D) contains (D1) a bisacylphosphine oxide-based photopolymerization initiator and (D2) an α-hydroxy alkylphenone-based photopolymerization initiator.

    摘要翻译: 一种阻焊剂组合物包括:(A)含羧基的树脂; (B)环氧化合物; (C)二氧化钛; (D)光聚合引发剂; 和(E)抗氧化剂。 组分(B)含有由下式(1)表示的氢醌环氧化合物。 成分(D)含有(D1)双酰基氧化膦系光聚合引发剂和(D2)α-羟基烷基苯基酮系光聚合引发剂。

    LIQUID SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD
    58.
    发明公开
    LIQUID SOLDER RESIST COMPOSITION AND COATED PRINTED WIRING BOARD 有权
    FLÜSSIGELÖTSTOPPLACKZUSAMMENSETZUNGUND BESCHICHTETE LEITERPLATTE

    公开(公告)号:EP3163373A4

    公开(公告)日:2017-09-06

    申请号:EP14907731

    申请日:2014-12-10

    摘要: The present invention aims to provide a liquid solder resist composition that has high reflectivity and is capable of forming a solder resist layer with suppressed deterioration especially due to light. A liquid solder resist composition according to the present invention contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, a titanium dioxide, and a compound having a cyclic ether skeleton. The titanium dioxide contains both of a rutile titanium dioxide manufactured by a sulfuric acid method and a rutile titanium dioxide manufactured by a chlorine method.

    摘要翻译: 本发明的目的在于提供一种液体阻焊剂组合物,其具有高反射率并且能够形成特别是由于光而劣化受到抑制的阻焊层。 根据本发明的液体阻焊剂组合物含有含羧基树脂,含有至少一种选自可光聚合单体和可光聚合预聚物的化合物的光聚合性化合物,光聚合引发剂,二氧化钛和 具有环状醚骨架的化合物。 二氧化钛含有通过硫酸法制造的金红石型二氧化钛和通过氯法制造的金红石型二氧化钛。