INKJET RECORDING INK, INK CARTRIDGE, INKJET RECORDING METHOD, INKJET RECORDING DEVICE AND INK RECORDED MATTER
    4.
    发明公开
    INKJET RECORDING INK, INK CARTRIDGE, INKJET RECORDING METHOD, INKJET RECORDING DEVICE AND INK RECORDED MATTER 审中-公开
    喷墨打印墨水,墨盒,记录过程中油墨,喷墨记录装置和记录资料INK

    公开(公告)号:EP2970703A4

    公开(公告)日:2016-03-23

    申请号:EP14763710

    申请日:2014-02-27

    摘要: An inkjet recording ink, including: water; a water-soluble organic solvent; a pigment; and a phosphate group-containing copolymer, wherein the phosphate group-containing copolymer contains a structural unit represented by the following General Formula (1) and a structural unit represented by the following General Formula (2): where R1 denotes a hydrogen atom or a methyl group; M+ denotes an alkali metal ion, an organic amine ion, or a hydrogen ion; half or more of M+ in the copolymer is the alkali metal ion or the organic amine ion, the remainder of M+ is the hydrogen ion; n and m each denote an integer of 0 to 6, provided that both of n and m are not 0; and a block of (C2H4O) and a block of (C3H6O) may be exchanged with each other, where R2 denotes a hydrogen atom or a methyl group.

    摘要翻译: 一种喷墨记录用油墨,包括:水; 水溶性有机溶剂; 颜料; 和共聚物,worin的含磷酸基共聚物中的含磷酸基的含有由以下通式表示的结构单元(1)和由以下通式表示的结构单元(2):其中,R 1表示氢原子或 甲基; M +表示碱金属离子,有机胺离子或氢离子; 一半或更多M +在共聚物是碱金属离子或有机胺离子,所述M +的其余部分是氢离子; n和m各自表示在0至6的整数,并提供两个n和m的不是0; 和的(C2H4O)的块和(C3H6O)块可以与海誓山盟进行交换,其中R 2表示氢原子或甲基。

    ULTRAVIOLET-CURABLE RESIN COMPOSITION AND PHOTOSOLDER RESIST INK CONTAINING THE COMPOSITION
    9.
    发明公开
    ULTRAVIOLET-CURABLE RESIN COMPOSITION AND PHOTOSOLDER RESIST INK CONTAINING THE COMPOSITION 有权
    UV-AUSHÄRTBAREHARZZUSAMMENSETZUNG UNDPHOTOLÖT-RESISTFARBSTOFF MIT DER ZUSAMMENSETZUNG

    公开(公告)号:EP1324135A1

    公开(公告)日:2003-07-02

    申请号:EP01965640.4

    申请日:2001-09-14

    摘要: An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.

    摘要翻译: 紫外线固化树脂组合物包含(A)通过使包含具有环氧基的烯属不饱和单体(i)的烯属不饱和单体组分与含有环氧基的烯属不饱和单体(i)聚合的环氧基聚合物(a)与通式 烯键式不饱和单体(b),具有羧基,然后使得到的中间产物与饱和或不饱和多元酸酐(c)反应; (B)分子中具有至少两个环氧基的环氧化合物; (C)光聚合引发剂; 和(D)稀释剂紫外线固化树脂在1kg中包含0.3〜10mol的可聚合不饱和基团。 含有该树脂组合物的光阻焊油墨具有提供优异的柔软性和耐焊锡性的永久性膜的能力,优选用于制造柔性印刷电路板。

    PHOTOSOLDER RESIST INK, PRINTED CIRCUIT BOARD, AND PROCESS FOR PRODUCING THE SAME
    10.
    发明公开
    PHOTOSOLDER RESIST INK, PRINTED CIRCUIT BOARD, AND PROCESS FOR PRODUCING THE SAME 失效
    阻焊,抗蚀油墨的组成,线路板印刷方法

    公开(公告)号:EP0733683A1

    公开(公告)日:1996-09-25

    申请号:EP95932964.0

    申请日:1995-10-02

    摘要: Disclosed herein is a photosensitive solder resist ink capable of development with a dilute alkaline solution. It has a wide pre-curing latitude. It permits the pre-cured board to be stored for a long period of time. It is superior in resolution, sensitivity, and solder resistance. Disclosed also herein is a printed circuit board having good adhesion, chemical resistance, electrical properties, gold plating resistance, solder heat resistance, and electrocorrosion resistance. Disclosed also herein is a process for producing said printed circuit board by using said solder resist ink.
    The photosensitive solder resist ink comprises (A) an ultraviolet-curable resin containing 0-20 wt% of aromatic ring moiety which is obtained by reacting a polymer composed of (a) 40-100 mol% of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol% of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.2 equivalents per epoxy equivalent of said polymer and with a saturated or unsaturated polybasic acid anhydride; (B) an epoxy compound soluble in a diluent; (C) a photopolymerization initiator; and (D) a diluent.