摘要:
A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ±-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second ±-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.
摘要:
A liquid solder resist composition contains a carboxyl group-containing resin, a photopolymerizable compound containing at least one compound selected from a group consisting of a photopolymerizable monomer and a photopolymerizable prepolymer, a photopolymerization initiator, and a titanium dioxide. The photopolymerization initiator contains a bisacylphosphine oxide-based photopolymerization initiator, a first ±-hydroxyalkyl phenone-based photopolymerization initiator that is a liquid at 25°C, and a second ±-hydroxyalkyl phenone-based photopolymerization initiator that is a solid at 25°C.
摘要:
An inkjet recording ink, including: water; a water-soluble organic solvent; a pigment; and a phosphate group-containing copolymer, wherein the phosphate group-containing copolymer contains a structural unit represented by the following General Formula (1) and a structural unit represented by the following General Formula (2): where R1 denotes a hydrogen atom or a methyl group; M+ denotes an alkali metal ion, an organic amine ion, or a hydrogen ion; half or more of M+ in the copolymer is the alkali metal ion or the organic amine ion, the remainder of M+ is the hydrogen ion; n and m each denote an integer of 0 to 6, provided that both of n and m are not 0; and a block of (C2H4O) and a block of (C3H6O) may be exchanged with each other, where R2 denotes a hydrogen atom or a methyl group.
摘要:
The present invention provides an electroconductive paste for electron beam curing that allows the formation of a circuit board having an electroconductive layer that has superior hardness and bendability as well as superior adhesion to a plastic base even if used in a high-temperature environment. The present invention is an electroconductive paste for electron beam curing comprising an electroconductive powder, a radical polymerizable composition and a plasticizer, wherein the plasticizer is incorporated at a ratio of 5 parts by mass to 20 parts by mass based on 100 parts by mass of the radical polymerizable composition.
摘要:
Disclosed is a carboxyl group-containing resin which is obtained by reacting a monocarboxylic acid (b) with epoxy groups of a resin (a), which has two or more epoxy groups in a molecule, in an amount of 0.3-0.85 mole per equivalent of the epoxy group in the resin (a), then reacting a polybasic acid (d) with epoxy groups of the thus-obtained reaction product (c) in an amount of 0.15-0.95 mole per equivalent of the epoxy group in the reaction product (c), and then further reacting a monocarboxylic acid (f) with epoxy groups of the thus-obtained reaction product (e) in an amount of 1.0-5.0 moles per equivalent of the epoxy group in the reaction product (f). The thus-obtained carboxyl group-containing resin has an acid value of 20-200 mgKOH/g, and is soluble in organic solvents.
摘要:
An ultraviolet-curable resin composition which is excellent in developped-line width and resolution and satisfactory in soldering heat resistance and gold plating resistance. The resin composition comprises (A) an ultraviolet-curable resin obtained by polymerizing an ethylenic monomer ingredient comprising an epoxidized ethylenic monomer (i), reacting the resultant epoxidized polmymer (a) with a carboxylated ethylenic monomer (b), and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c); (B) an epoxy compound having two or more epoxy groups per molecule; (C) a photopolymerization initiator; (D) a diluent; and (E) an ultraviolet-curable resin which is obtained by reacting a novolak epoxy compound (e) with a carboxylated ethylenic monomer (b) and reacting the resultant intermediate with an (un)saturated polybasic acid anhydride (c) and which has an acid value of 10 to 45 mgKOH/g, excluding 45 mgKOH/g.
摘要:
An ultraviolet curable resin composition comprises (A) an ultraviolet curable resin obtained by reacting an epoxy group containing polymer (a), which is prepared by polymerizing an ethylenically unsaturated monomer component including an ethylenically unsaturated monomer (i) having an epoxy group, with an ethylenically unsaturated monomer (b) having a carboxyl group, and then reacting a resultant intermediate product with a saturated or unsaturated polybasic acid anhydride (c); (B) an epoxy compound having at least two epoxy groups in molecule; (C) a photopolymerization initiator; and (D) a diluent The ultraviolet curable resin includes 0.3 to 10 mol of a polymerizable unsaturated group in 1 kg thereof. A photo solder resist ink containing this resin composition has the capability of providing a permanent film with excellent flexibility and solder heat resistance, and is preferably used to manufacture flexible printed circuit boards.
摘要:
Disclosed herein is a photosensitive solder resist ink capable of development with a dilute alkaline solution. It has a wide pre-curing latitude. It permits the pre-cured board to be stored for a long period of time. It is superior in resolution, sensitivity, and solder resistance. Disclosed also herein is a printed circuit board having good adhesion, chemical resistance, electrical properties, gold plating resistance, solder heat resistance, and electrocorrosion resistance. Disclosed also herein is a process for producing said printed circuit board by using said solder resist ink. The photosensitive solder resist ink comprises (A) an ultraviolet-curable resin containing 0-20 wt% of aromatic ring moiety which is obtained by reacting a polymer composed of (a) 40-100 mol% of ethylenically unsaturated monomer having an epoxy group and (b) 0-60 mol% of ethylenically unsaturated monomer capable of copolymerization therewith, with (meth)acrylic acid in an amount of 0.7-1.2 equivalents per epoxy equivalent of said polymer and with a saturated or unsaturated polybasic acid anhydride; (B) an epoxy compound soluble in a diluent; (C) a photopolymerization initiator; and (D) a diluent.