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    ADHESIVE AND CIRCUIT MATERIAL USING THE ADHESIVE
    71.
    发明公开
    ADHESIVE AND CIRCUIT MATERIAL USING THE ADHESIVE 审中-公开
    KLEBEMITTEL UND VERWENDUNG DESSELBEN IN EINER SCHALTUNGSANORDUNG

    公开(公告)号：EP0999253A1

    公开(公告)日：2000-05-10

    申请号：EP99919580.3

    申请日：1999-05-14

    Applicant: Sony Chemicals Corporation

    Inventor： KUMAKURA, Masayuki, Sony Chemicals Corp.

    IPC: C09J167/00 ,  C09J7/02 ,  H01B3/00 ,  H01B7/08 ,  H05K1/03

    CPC classification number: H05K3/386 ,  C09J167/00 ,  H05K1/0393 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0769 ,  H05K2201/1028 ,  H05K2203/122 ,  H05K2203/1545 ,  Y10T428/2933 ,  Y10T428/2938 ,  Y10T428/2958

    Abstract: When an adhesive is applied on a metallic wiring, the metal forming the metallic wiring film dissolutes as ions into the adhesive with time. If the adhesive is based on a polyester resin and placed in an environment of high temperature or high temperature and high humidity, adhesion and insulation are deteriorated by the free metallic ions. However, adhesives of the present invention contain a cation scavenger to scavenge the free metallic ions in the adhesives. Thus, highly durable flat cables can be obtained.
    Thus, flat cables with reduced loss in adhesive strength and insulation are provided.

    Abstract translation: 当将粘合剂施加在金属布线上时，形成金属布线膜的金属随时间溶解成粘合剂中的离子。 如果粘合剂基于聚酯树脂并且放置在高温或高温和高湿度的环境中，则通过游离的金属离子使粘合和绝缘劣化。 然而，本发明的粘合剂含有阳离子清除剂以清除粘合剂中的游离金属离子。 因此，可以获得高度耐用的扁平电缆。 因此，提供了具有降低的粘合强度和绝缘损失的扁平电缆。

    Process for partial electroless plating
    72.
    发明公开
    Process for partial electroless plating 审中-公开
    。。。。。。。。。。。。。

    公开(公告)号：EP0967299A1

    公开(公告)日：1999-12-29

    申请号：EP99111356.4

    申请日：1999-06-10

    Applicant: Takagi, Kaneyuki

    Inventor： Takagi, Kaneyuki ,  Sato, Kazuya

    IPC: C23C18/20

    CPC classification number: H05K3/387 ,  C23C18/1608 ,  C23C18/1641 ,  C23C18/30 ,  H05K3/181 ,  H05K2201/0145

    Abstract: An efficient process for partial electroless plating that causes plating film to deposit only a specific part of substrate which needs plating, without requiring the corrosion step. The process includes five steps of forming a coating film on which electroless plating is performed, activating said coating film, imparting a catalyst to said coating film, activating said catalyst, and performing electroless plating, and said coating film is formed from any one of the following four resin compositions.

    1. composed of a low-molecular weight compound having an N-H bond, an adhesive polymer having a C=C double bond, and a polybasic acid having a C=C double bond.
    2. composed of an adhesive polymer dense with N-H bonds, and a polybasic acid compatible with said polymer or a monobasic acid having a C=C double bond.
    3. composed of a resin component which gives rise to an N-H bond upon curing reaction, and a polybasic acid having a C=C double bond.
    4. composed of a resin component which gives rise to an N-H bond upon curing reaction, an adhesive polymer having a C=C double bond in the main chain, and a polybasic acid having a C=C double bond.

    Abstract translation: 用于部分无电镀的有效方法，其使得镀膜仅沉积需要电镀的基板的特定部分，而不需要腐蚀步骤。 该方法包括形成其上进行化学镀的涂膜的五个步骤，活化所述涂膜，向所述涂膜施加催化剂，活化所述催化剂，并进行无电镀，并且所述涂膜由 以下四种树脂组合物。 1.由具有N-H键的低分子化合物，具有C = C双键的粘合剂聚合物和具有C = C双键的多元酸构成。 2.由具有N-H键的粘合剂聚合物和与所述聚合物相容的多元酸或具有C = C双键的一元酸构成。 由在固化反应时产生N-H键的树脂组分和具有C = C双键的多元酸组成。 由在固化反应时产生N-H键的树脂组分，在主链中具有C = C双键的粘合剂聚合物和具有C = C双键的多元酸组成。

    Nonwoven reinforcement for printed wiring base board and process for producing the same
    73.
    发明公开
    Nonwoven reinforcement for printed wiring base board and process for producing the same 有权
    非织造增强产品的印刷电路板，以及它们的制备方法

    公开(公告)号：EP0908559A2

    公开(公告)日：1999-04-14

    申请号：EP98118922.8

    申请日：1998-10-07

    Applicant: MITSUBISHI GAS CHEMICAL COMPANY, INC. ,  Kuraray Co., Ltd.

    Inventor： Gaku, Morio c/o Mitsubishi Gas Chemical Co., Inc. ,  Nozaki, Mitsuru c/o Mitsubishi Gas Chem. Co., Inc. ,  Saimen, Kenji c/o Kuraray Co., Ltd. ,  Esaki, Tamemaru c/o Kuraray Co., Ltd.

    IPC: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/00

    CPC classification number: D21H13/24 ,  D21H17/53 ,  D21H25/06 ,  H05K1/0366 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0278 ,  H05K2201/0293 ,  Y10T428/24322 ,  Y10T442/2475

    Abstract: There are disclosed a nonwoven reinforcement for a printed wiring base board which nonwoven reinforcement comprises a wet-system nonwoven fabric constituted of thermotropic cystalline polyester fiber having a melting point of 290°C or higher( component A ) and a thermotropic cystalline polyester binder which has a melting point of 290°C or higher and is in the form of a film having holes including at least 5 holes /mm 2 each with an area of opening of 400 to 10000 µm 2 ( component B ), the component A being fixed by the component B; a process for producing the above nonwoven reinforcement; a printed wiring base board produced from the above nonwoven reinforcement; and a printed wiring board produced from the above printed wiring base board. The nonwoven reinforcement and the printed wiring ( base) board are excellent in various performances such as uniformity, dimensional stability, heat resistance and electrical characteristics such as dielectric constasnt and dielectric loss tangent.

    Abstract translation: 有圆盘游离缺失的印刷电路基板的非织造增强件的非织造增强件包括一个湿体系无纺布构成热嗜cystalline聚酯纤维的具有290℃或更高（A成分）的熔点，且具有热嗜cystalline聚酯粘合 的290℃或更高的熔点，是在具有通孔包括至少5个孔/毫米<2>各自具有在400至10000微米<2>（B成分）开口的面积的膜的形式，所述 A组分被固定由组分B; 生产上述非织造增强的工序; 从上述非织造增强所产生的印刷配线基板; 和印刷电路板由上述印刷布线基板制造。 非织造增强件和印刷电路（基极）板具有优异的各种性能：如均匀性，尺寸稳定性，耐热性和检查介电constasnt和介电损耗角正切的电特性。

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