公开(公告)号：EP0628642B1

公开(公告)日：2001-03-21

申请号：EP94902089.5

申请日：1993-12-08

申请人： Osaka Diamond Industrial Co.

发明人： MATSUMOTO, Yasushi Osaka Diamond Industrial Co Ltd ,  NISHIMURA, Kazuhito ,  TOMIMORI, Hiroshi Osaka Diamond Industrial Co Ltd ,  HARA, Akio Osaka Diamond Industrial Co., Ltd.

IPC分类号： C23C16/02 ,  C23C16/26

CPC分类号： C23C16/0227 ,  C23C16/0209 ,  C23C16/0218 ,  C23C16/271 ,  Y10T428/12576

摘要： This invention provides a superhard film-coated material consisting of a superhard film of diamond or the like, and a superhard alloy base material to which the film is fixed firmly; and a method of producing the same. According to the present invention, a superhard alloy base material is heat treated so as to deposit hemispherically on the surface of the base material a combined metal in the portion of the base material which is close to the surface therhof. This invention is characterized in that diamond and/or diamond-like carbon is formed by a chemical vapor phase synthesis on the surface of the base material by leaving the deposited metal as it is or removing the deposited metal partially or wholly. Owing to the formation of this deposited metal, the combining force of the superhard film and superhard alloy base material increases remarkably, and the formation of a thick film becomes possible.

公开(公告)号：EP0672637B1

公开(公告)日：2000-09-06

申请号：EP95100820.0

申请日：1995-01-21

申请人： DORNIER GmbH

发明人： Haug, Tilman, Dr.rer.nat. ,  Gödecke, Holger, Dipl.-Ing. ,  Greil, Peter, Prof. ,  Suttor, Daniel, Dipl.-Ing.

IPC分类号： C04B35/80 ,  C04B35/571 ,  C04B35/563 ,  C04B35/583

CPC分类号： C04B35/571 ,  C04B35/806 ,  Y10T428/12576 ,  Y10T428/29 ,  Y10T428/2916 ,  Y10T428/294

公开(公告)号：EP1010778A2

公开(公告)日：2000-06-21

申请号：EP99123331.3

申请日：1999-11-23

申请人： MASCO CORPORATION OF INDIANA

发明人： Jonte, Patrick B. ,  Grant, William K.

IPC分类号： C25D5/14 ,  C23C28/02

CPC分类号： C25D5/14 ,  C23C28/00 ,  Y10T428/12549 ,  Y10T428/12576 ,  Y10T428/12632 ,  Y10T428/12806

摘要： An article having a coating comprising at least one nickel layer, a chrome layer, a sandwich layer comprised of titanium compound or titanium alloy compound, layers alternating with titanium or titanium alloy layers, and a zirconium compound or zirconium alloy compound layer.

摘要翻译： 具有包含至少一层镍层，铬层，由钛化合物或钛合金化合物构成的夹心层，与钛或钛合金层交替的层以及锆化合物或锆合金化合物层的涂层的制品。

公开(公告)号：EP0966910A1

公开(公告)日：1999-12-29

申请号：EP99111291.3

申请日：1999-06-10

申请人： Clad Metals LLC

发明人： Groll, William A.

IPC分类号： A47J36/02

CPC分类号： A47J36/025 ,  A47J36/02 ,  B32B15/012 ,  B32B15/013 ,  C23C4/02 ,  C23C14/0641 ,  C23C28/321 ,  C23C28/322 ,  C23C28/34 ,  C23C28/347 ,  Y10T29/49982 ,  Y10T428/12576

摘要： A method for making a stick resistant cook surface or cooking vessel having the stick resistance in which a hard substrate metal (6) is buffed/polished to a high luster surface finish of less than 20 micro inches and then coated with a layer of zirconium nitride (20). The method further includes the step of polishing a stamped blank to the desired surface smoothness prior to the drawing/shaping step to provide a stick resistant surface in cooking vessels having side walls, such as pots and pans, which are otherwise difficult to buff in the interior due to the side wall geometry.

摘要翻译： 一种用于制造具有耐粘性的耐粘烤面或烹饪容器的方法，其中将硬质基底金属（6）抛光/抛光至小于20微英寸的高光泽表面光洁度，然后涂覆有一层氮化锆 （20）。 该方法还包括在拉伸/成型步骤之前将冲压的坯料抛光到所需的表面光滑度的步骤，以在具有侧壁的烹饪容器（例如罐和平底锅）中提供耐粘性表面，否则这些表面难以在 内部由于侧壁几何形状。

公开(公告)号：EP0962963A1

公开(公告)日：1999-12-08

申请号：EP98940589.9

申请日：1998-08-27

申请人： MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

发明人： KITABATAKE, Makoto ,  UCHIDA, Masao ,  TAKAHASHI, Kunimasa

IPC分类号： H01L21/205 ,  H01L21/203 ,  H01L21/20 ,  H01L29/80

CPC分类号： H01L29/1608 ,  C30B23/02 ,  C30B29/36 ,  H01L29/045 ,  H01L29/1075 ,  H01L29/66068 ,  Y10S117/913 ,  Y10T428/12576 ,  Y10T428/12674

摘要： A silicon carbide thin film is epitaxially grown by an MBE or the like method with silicon atoms 2 being maintained to be in excess of carbon atoms on a growth surface 1a of a silicon carbide crystal in a substrate 1. A silicon carbide substrate with a good crystallinity is thereby achieved at a low temperature with a good reproducibility. This crystal growth is possible at a low temperature of 1300 °C or lower, and the productions of a high-concentration doped film, a selectively grown film, and a grown film of a cubic silicon carbide on a hexagonal crystal are achieved. In crystallizing a cubic silicon carbide on a hexagonal crystal, the use of an off-cut surface inclined towards a 〈1 1 ¯ 00〉 direction is effective to prevent an occurrence of twin.

公开(公告)号：EP0935286A1

公开(公告)日：1999-08-11

申请号：EP98921813.6

申请日：1998-05-26

申请人： Sumitomo Electric Industries, Ltd.

发明人： SASAKI,Kazutaka, Itami Works,Sumitomo Elec.Ind.Ltd ,  NAKATA,Hirohiko, Itami Works,Sumitomo Elec.Ind.Ltd

IPC分类号： H01L23/12 ,  H05K1/09

CPC分类号： H05K1/0271 ,  C04B35/111 ,  C04B35/581 ,  C04B35/587 ,  C04B35/62655 ,  C04B37/026 ,  C04B2235/3208 ,  C04B2235/3225 ,  C04B2235/5445 ,  C04B2235/6567 ,  C04B2235/658 ,  C04B2235/723 ,  C04B2235/77 ,  C04B2235/96 ,  C04B2235/9607 ,  C04B2237/122 ,  C04B2237/125 ,  C04B2237/343 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/407 ,  C04B2237/66 ,  C04B2237/704 ,  C04B2237/708 ,  H01L23/3735 ,  H01L2224/48091 ,  H05K1/0306 ,  H05K3/38 ,  H05K2201/09145 ,  H05K2201/098 ,  Y10T428/12535 ,  Y10T428/12576 ,  Y10T428/24917 ,  H01L2924/00014

摘要： A highly reliable copper circuit-joined board that, in mounting a semiconductor element, a lead frame or the like on a ceramic substrate, enables the semiconductor element, the lead frame or the like to be strongly joined to the substrate without breaking or deformation of the substrate found in conventional joining methods, such as brazing and joining using a copper/copper oxide eutectic crystal.
Any one of an interposing layer comprising a brazing material layer comprising silver and/or copper as a main component and an active metal or an interposing layer having a two-layer structure comprising a first interposing layer comprising the brazing material layer or a high-melting metallizing layer and a second interposing layer, having a melting point of 1,000°C or below, comprising Ni, Fe, or Cu as a main component in that order from the substrate side, is formed on a ceramic substrate, and a conductor layer, comprising copper as a main component, which, in both the lengthwise and widthwise directions, is at least 0.05 mm shorter than the interposing layer, is formed on the interposing layer to prepare a copper circuit-joined board.
The copper circuit-joined board may comprise the base board having thereon an outer layer comprising Ni as a main component. A semiconductor element is mounted on the copper circuit-joined board to prepare a semiconductor device.

摘要翻译： 一种高度可靠的铜电路接合板，其在将半导体元件，引线框架等安装在陶瓷基板上时能够使半导体元件，引线框架等牢固地接合到基板而不会断裂或变形 在常规接合方法中发现的基板，例如使用铜/铜氧化物共晶晶体的钎焊和接合。 包含含有银和/或铜作为主要成分的钎焊材料层的中间层中的任何一个以及具有两层结构的活性金属或插层，包括由钎焊材料层构成的第一中间层或高熔点 在陶瓷基板上形成有从基板侧依次包含Ni，Fe或Cu作为主要成分的熔点为1000℃以下的金属化层和第二中间层，以及导体层， 包括铜作为主要成分，其在长度方向和宽度方向上比中间层短至少0.05mm，形成在插层上以制备铜电路接合板。 铜电路接合板可以包括其上具有包含Ni作为主要成分的外层的基板。 半导体元件安装在铜电路接合板上以制备半导体器件。

公开(公告)号：EP0798402B1

公开(公告)日：1999-05-12

申请号：EP97200888.2

申请日：1997-03-24

申请人： PLANSEE Aktiengesellschaft

发明人： Martinz, Hans-Peter, Dr. ,  Sulik, Manfred ,  Disam, Joachim Dr. Ing.

IPC分类号： C23C30/00

CPC分类号： C23C30/00 ,  Y10T428/12576 ,  Y10T428/12604 ,  Y10T428/12625 ,  Y10T428/12819 ,  Y10T428/12826 ,  Y10T428/1284 ,  Y10T428/31678

公开(公告)号：EP0899060A2

公开(公告)日：1999-03-03

申请号：EP98202796.3

申请日：1998-08-21

申请人： NORTON COMPANY

发明人： Andrews, Richard M. ,  Miller, Bradley J. ,  Skeem, Marcus R. ,  Shiue, Ren-Kae

IPC分类号： B24D3/06 ,  B24D3/34 ,  B24D5/16

CPC分类号： B23K35/302 ,  B22F2998/00 ,  B23K2201/20 ,  B24D3/08 ,  B24D18/00 ,  C22C26/00 ,  Y10T428/12056 ,  Y10T428/12063 ,  Y10T428/12576 ,  Y10T428/12625 ,  C22C29/16

摘要： A bond for a single layer metal bond abrasive tool can be easily chemically and electrochemically stripped from the metal core of a recovered used tool to facilitate reuse of the core. Relative to conventionally bonded tools, the speed of stripping the novel bond is quick, and the stripped core has a smooth, clean surface which needs only minimal mechanical repair prior to reuse. In one aspect, the novel bond consists essentially of a ternary bond composition of copper, tin and titanium, in which the copper and tin are pre-alloyed and the pre-alloy and titanium component are incorporated in the bond composition as fine particle size powders. In another aspect, the bond is a quaternary bond composition consisting essentially of copper, tin, titanium and silver. The powder components can be used dry or mixed with a fugitive liquid binder as a paste.
The novel bond can be brazed at lower temperature than copper/tin/titanium bonds prepared otherwise. The bond composition forms a good melt at braze temperature that flows smoothly, evenly over a tool preform and provides consistent quality bonding of abrasive from tool to tool.

公开(公告)号：EP0804634B1

公开(公告)日：1998-12-23

申请号：EP95942671.9

申请日：1995-12-15

申请人： Forschungszentrum Karlsruhe GmbH

发明人： SCHIER, Veit ,  HOLLECK, Helmut

IPC分类号： C23C28/00

CPC分类号： C23C28/044 ,  B32B18/00 ,  C04B2237/36 ,  C04B2237/361 ,  C04B2237/363 ,  C04B2237/366 ,  C04B2237/368 ,  C04B2237/704 ,  C23C28/42 ,  Y10T428/12576

摘要： A wearing protection layer consists of a plurality of individual layers. A first individual layer made of a metallic hard material is directly applied on a substrate and the other individual layers are applied on the first individual layer in a periodically repeated sequence of a hard metallic material and another hard material. The object of the invention is to develop a wearing protection layer of the above-mentioned type having a plurality of alternating individual layers that allows the mechanical, physical and chemical properties of hard metallic materials to be combined to those of other hard materials. For that purpose, the other hard material is a covalent hard material and the periodically repeated sequence of individual layers that form a composite material consists of three individual layers. Two individual layers are made of two different hard metallic materials and one individual layer is made of covalent hard material.

公开(公告)号：EP0875596A1

公开(公告)日：1998-11-04

申请号：EP98107802.5

申请日：1998-04-29

申请人： MASCO CORPORATION

发明人： Welty, Richard P. ,  Peterson, John H. ,  Jonte, Patrick ,  Trendelman, Carl W.

IPC分类号： C23C28/00

CPC分类号： C23C28/321 ,  C23C28/322 ,  C23C28/34 ,  C23C28/345 ,  C23C28/3455 ,  C23C28/347 ,  C23C28/42 ,  Y10T428/12535 ,  Y10T428/12549 ,  Y10T428/12576 ,  Y10T428/12583 ,  Y10T428/1259 ,  Y10T428/12611 ,  Y10T428/12618 ,  Y10T428/12632 ,  Y10T428/12806 ,  Y10T428/12812 ,  Y10T428/12854 ,  Y10T428/12944

摘要： An article is coated with a multi-layer coating comprising a nickel layer, a chrome layer, a refractory metal layer, preferably zirconium layer, a sandwich layer comprised of a plurality of alternating layers of a refractory metal compound and a refractory metal compound layer, preferably zirconium nitride layer, and a refractory metal oxide layer or a layer comprised of the reaction products of refractory metal, oxygen and nitrogen. The coating provides the color of polished brass to the article and also provides abrasion protection, corrosion protection, and improved acid resistance.

摘要翻译： 一种制品涂覆有多层涂层，包括镍层，铬层，难熔金属层，优选锆层，由难熔金属化合物和难熔金属化合物层的多个交替层组成的夹层， 优选氮化锆层，以及难熔金属氧化物层或由难熔金属，氧和氮的反应产物组成的层。 涂层为产品提供抛光黄铜的颜色，并提供磨损保护，防腐蚀和改善的耐酸性。