公开(公告)号：EP0965408A3

公开(公告)日：2001-10-17

申请号：EP99110547.9

申请日：1999-06-01

Applicant: Heraeus Noblelight GmbH

Inventor： Mittelstädt, Norbert ,  Höfler, Karl ,  Stehling, Ronald

IPC: B23K1/008

CPC classification number: B23K1/008 ,  B23K2201/42

Abstract: Durchlaufofen zum Löten von auf Leiterplatten montierten Bauelementen, der ein durch ein Ofeninnengehäuse geführtes Förderband aufweist, das die Leiterplatten von einer Einlaufzone über eine Vorheizzone, eine Reflowzone und eine Kühlzone zu einer Auslaufzone führt, wobei entlang des Förderbands im Bereich der Vorheiz-, Reflow- und Kühlzone eine Prozeßgasströmung aufrechterhalten wird und wobei entlang der Förderstrecke mindestens eine Kondensationseinrichtung, die mittels eines Fluids gekühlte Kondensationsflächen sowie einen Kondensat-Sammelbehälter aufweist, vorgesehen ist, die flüchtige Bestandteile der Leiterplatten und/oder der Lötpasten aus der Prozeßgasströmung auskondensiert, der dadurch gekennzeichnet ist, daß die Kondensationseinrichtung als Moduleinheit mit Gehäuse ausgebildet ist, wobei das Gehäuse einen Prozeßgaszulauf und einen Prozeßgasablauf aufweist, die jeweils einem entsprechenden Prozeßgasablauf und einen entsprechenden Prozeßgaszulauf des Ofeninnengehäuses über lösbare Schnellverbindungen zugeordnet sind, und daß jeweils in dem Prozeßgasablauf und dem Prozeßgaszulauf des Ofeninnengehäuses eine Absperreinheit vorgesehen ist.

公开(公告)号：EP0914230B1

公开(公告)日：2001-09-19

申请号：EP97930693.3

申请日：1997-07-21

Applicant: Ford Global Technologies, Inc.

Inventor： GAO, Guilian ,  GOENKA, Lakhi, Nandlal

IPC: B23K35/363 ,  B23K1/20

CPC classification number: B23K1/206 ,  B23K35/3618 ,  B23K2201/42 ,  H05K3/3489

Abstract: A flux formulation without a surfactant for use in the assembly of electronic circuit boards as a no-clean formulation. The formulation comprises a flux solution having a fluxing agent consisting essentially of one or more weak organic acids and a solvent consisting essentially of water. The flux solution serves to transport the fluxing agent before deposition thereof upon a soldering site for reliability improvement engendered by a lack of hygroscopic residue and for avoidance of environmental degradation engendered by a lack of volatile organic chemicals (VOCs). The method comprises the step of heating the flux solution and dispersing it as a fine spray.

公开(公告)号：EP0934792A3

公开(公告)日：2001-09-05

申请号：EP99108330.4

申请日：1993-11-15

Applicant: MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.

Inventor： Taniguchi, Masahiro ,  Nakamura, Youichi ,  Ishimoto, Kazumi ,  Kuwabara, Kimihito ,  Ando, Manabu ,  Mimura, Toshinori ,  Hamasaki, Kurayasu ,  Nakano, Kenichi

IPC: B23K1/012 ,  B23K1/008 ,  H02K3/34

CPC classification number: H02K3/34 ,  B23K1/008 ,  B23K1/012 ,  B23K2201/40 ,  B23K2201/42

Abstract: The present invention provides a reflow apparatus and method which can make the running direction of the internal gas flow in a heating section within a reflow furnace constant. A circulating gas path is formed in a heating unit (U) which collects and moves the gas flow (B) from a sirocco fan (11) up to the rear side of the heating unit (U) and at the same time, drops the raised gas flow towards a circuit board (2) on a transfer path from the front side of the heating unit (U). Moreover, a plurality of straightening plates (16) are arranged above the transfer path of the heating unit (U) so as to guide down the hot gas flow (B) running forward to the circuit board (2) on the transfer path. A blow-down nozzle (17) is further constituted of a plurality of plate materials (19) aligned in rows in the transferring direction of circuit boards and having an inverse U-shaped cross section. The blow-down nozzle (17) is arranged below the straightening plates (16) to feed the hot gas flow (B) to the whole surface of the circuit board (1) in the vertical direction uniformly.

Abstract translation: 本发明提供一种能够使回流炉内的加热部内部气体的流动方向恒定的回流装置和方法。 循环气体路径形成在加热单元（U）中，该加热单元（U）将气流（B）从西洛克风扇（11）收集并移动到加热单元（U）的后侧，并且同时将 从加热单元（U）的前侧向传送路径上的电路板（2）提升气流。 此外，在加热单元（U）的输送路径的上方配置有多个矫直板（16），以将传送路径上向前延伸到电路基板（2）的热气流（B）向下引导。 吹扫喷嘴（17）还由电路板的传送方向上排成行的多个平板材料（19）构成，并具有相反的U形横截面。 排气喷嘴（17）布置在矫直板（16）下方，以将热气流（B）沿垂直方向均匀地供给到电路板（1）的整个表面。

公开(公告)号：EP1090706A1

公开(公告)日：2001-04-11

申请号：EP00121803.1

申请日：2000-10-06

Applicant: MOLEX INCORPORATED

Inventor： Godwin, Michael S.

IPC: B23K1/002 ,  B23K3/047 ,  H01R43/02

CPC classification number: H01R43/0256 ,  B23K1/002 ,  B23K3/0475 ,  B23K2201/38 ,  B23K2201/42 ,  H01R43/0207 ,  H01R43/0249 ,  H01R43/0263 ,  H05K3/3494 ,  H05K3/363 ,  H05K2203/101

Abstract: An apparatus (10) and method is provided for conductively bonding at least two conductors (48) together. An inductive coil (34,36) generates a magnetic field when electrical current is run therethrough. A magnetic concentrator (42) is disposed on or near the inductive coil (34,36) and adjacent which the two conductors (48) can be positioned for concentrating the magnetic field on the conductors. The concentrator is independent of the conductors. Pressure is applied to the conductors. The concentrator concentrates the magnetic field generated by the inductive coil on the conductors, thereby heating the conductors under pressure and electrically bonding the conductors together.

Abstract translation: 提供了一种用于将至少两个导体（48）导电地接合在一起的装置（10）和方法。 当电流通过时，感应线圈（34,36）产生磁场。 磁性集中器（42）设置在感应线圈（34,36）上或附近，并且邻近于两个导体（48）可定位用于将磁场集中在导体上。 集中器独立于导体。 对导体施加压力。 集中器将由感应线圈产生的磁场集中在导体上，从而在压力下加热导体并将导体电连接在一起。

公开(公告)号：EP1086771A2

公开(公告)日：2001-03-28

申请号：EP00125259.2

申请日：1992-11-09

Applicant: OMRON CORPORATION

Inventor： Kobayashi, Shigeki, Omron Inst. Life Science Inc. ,  Yamamoto, Norihito, Omron Inst. Life Science Inc.

IPC: B23K1/005

CPC classification number: H05K13/0486 ,  B23K1/0016 ,  B23K3/033 ,  B23K3/08 ,  B23K2201/42 ,  B25J9/16 ,  G05B19/41865 ,  G05B19/41875 ,  G05B19/41885 ,  G05B2219/31096 ,  G05B2219/31296 ,  G05B2219/31355 ,  G05B2219/31446 ,  G05B2219/32121 ,  G05B2219/32127 ,  G05B2219/32145 ,  G05B2219/32146 ,  G05B2219/32147 ,  G05B2219/32148 ,  G05B2219/32151 ,  G05B2219/32173 ,  G05B2219/32174 ,  G05B2219/32175 ,  G05B2219/32186 ,  G05B2219/32192 ,  G05B2219/32229 ,  G05B2219/32231 ,  G05B2219/32232 ,  G05B2219/45235 ,  G05B2219/50064 ,  H05K13/08 ,  Y02P90/04 ,  Y02P90/10 ,  Y02P90/20 ,  Y02P90/22 ,  Y02P90/26 ,  Y02P90/265

Abstract: A teaching apparatus for an automatic soldering apparatus is provided, comprising first memory means (26) in which soldering condition information is stored in advance for each classification of parts; second memory means (24) in which identification codes of parts, which are to be mounted on a board, are stored in advance for each board; means (20, 21, 22, 23) for correlating the identification codes of the parts; input means (22) for entering an identification code of a board; and creating means (20, 21) for reading all parts, which are to be mounted on the board.

Abstract translation: 提供了一种用于自动焊接装置的示教装置，包括：第一存储器装置（26），其中针对每个部件的分类预先存储焊接状态信息; 第二存储器装置（24），其中预先为每个板存储要安装在板上的部件的识别码; 用于将各部分的识别码相关联的装置（20,21,22,23） 输入装置（22），用于输入电路板的识别码; 和创建装置（20,21），用于读取要安装在板上的所有部件。

公开(公告)号：EP0861136B1

公开(公告)日：2001-01-24

申请号：EP96942008.2

申请日：1996-11-12

Applicant: NORDSON CORPORATION

Inventor： SMITH, James, C. ,  HOGAN, Patrick, T. ,  SAIDMAN, Laurence, B.

IPC: B23K1/20

CPC classification number: B05C5/001 ,  B05C5/02 ,  B05C5/0225 ,  B05C11/1034 ,  B23K1/203 ,  B23K3/0607 ,  B23K2201/36 ,  B23K2201/42 ,  G01F13/006 ,  H05K3/1241

Abstract: Apparatus and methods for dispensing droplets of liquid or viscous material are disclosed. A valve is opened to dispense a stream of the heated liquid or viscous material through an elongated orifice of a nozzle. The stream of material being dispensed from the elongated orifice is broken into droplets by rapidly closing the valve. Furthermore, a method for varying the height of a droplet of liquid or viscous material is disclosed by which two or more droplets combine to form a droplet of a desired height. A method for applying a plurality of droplets of material onto a substrate so that the droplets flow together to form a uniform film of desired thickness and shape is also disclosed. A second embodiment of the invention relates to dispensing apparatus with a heater assembly removably attached to the dispenser housing. Another modification of the invention relates to a modified seat assembly wherein the valve has three positions with respect to the valve seat and a modified nozzle assembly wherein the nozzle is constructed of a thin walled tube.

公开(公告)号：EP1061789A2

公开(公告)日：2000-12-20

申请号：EP00305142.2

申请日：2000-06-16

Applicant: NOKIA MOBILE PHONES LTD.

Inventor： Koleda, Eugen

IPC: H05K9/00

CPC classification number: H05K9/0032 ,  B23K1/0016 ,  B23K2201/42

Abstract: A shielding can for a printed circuit board comprise a frame with side walls and a lid with means to increase flexibility of the lid. The flexibility means are slits on the sides of the lid. These slits enable a flexible contraction, when soldering the shielding can onto the printed circuit board. The invention also includes a method for mounting the shielding can onto printed circuit boards. The shielding can is placed onto the printed circuit board and heated slowly to melt the solder paste to solder the shielding can to the printed circuit board. The heating phase is followed by a fast cooling phase, and the flexible means (the slits on the shielding can) reduces the internal stress, which occurs when the shielding can is exposed to different temperatures at the same time, without any permanent deformations.

Abstract translation: 用于印刷电路板的屏蔽罐包括具有侧壁的框架和具有增加盖子的柔性的装置的盖子。 柔性装置是在盖的侧面上的狭缝。 当将屏蔽罐焊接到印刷电路板上时，这些狭缝能够灵活地收缩。 本发明还包括将屏蔽罐安装到印刷电路板上的方法。 将屏蔽罐放置在印刷电路板上并缓慢加热以熔化焊膏以将屏蔽罐焊接到印刷电路板。 加热阶段之后是快速冷却阶段，并且柔性装置（屏蔽罐上的狭缝）减少了当屏蔽罐同时暴露于不同温度时发生的内部应力，而没有任何永久变形。

公开(公告)号：EP0936018A3

公开(公告)日：2000-09-27

申请号：EP99250044.7

申请日：1999-02-12

Applicant: NEC CORPORATION

Inventor： Kurihara, Mitsuru

IPC: B23K1/005 ,  H05K13/04 ,  H05K3/34 ,  H01L21/60 ,  H01L21/68

CPC classification number: B23K1/0056 ,  B23K2201/42 ,  H01L24/81 ,  H01L2224/16225 ,  H05K3/3421 ,  H05K3/3494

Abstract: To provide parts soldering apparatus (1) and method which improve the productivity during parts soldering and increase the mounting accuracy of parts on a circuit board, the parts soldering apparatus (1) has: a stage (2) for positioning a circuit board (10) thereon, which has a solder tip (11) mounted thereon; a loading arm (6) made of a light-transmitting material, for loading a part onto the solder tip (11); a fluctuating mechanism (4) for pressing the loading arm (6) toward the circuit board (10); and an optical source (3) for irradiating light (S) onto the part through the loading arm (6) and for melting the solder tip (11) by the conductive heat of the light irradiated onto the part.

公开(公告)号：EP1002611A1

公开(公告)日：2000-05-24

申请号：EP99125770.0

申请日：1994-09-16

Applicant: International Business Machines Corporation

Inventor： Acocella, John ,  Banks, Donald Ray ,  Benenati, Joseph Angelo ,  Caulfield, Thomas ,  Corbin, John Saunders, Jr. ,  Hoebener, Karl Grant ,  Watson, David P.

IPC: B23K1/00

CPC classification number: B23K1/0008 ,  B23K1/0016 ,  B23K2201/36 ,  B23K2201/40 ,  B23K2201/42 ,  H01L21/4853 ,  H01L21/486 ,  H01L23/488 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81191 ,  H01L2224/814 ,  H01L2924/00013 ,  H01L2924/09701 ,  H05K1/114 ,  H05K3/3436 ,  H05K3/3452 ,  H05K3/3478 ,  H05K3/42 ,  H05K3/429 ,  H05K2201/0215 ,  H05K2201/10234 ,  H05K2201/10734 ,  H05K2201/10992 ,  H05K2203/0195 ,  H05K2203/0338 ,  H05K2203/041 ,  H05K2203/0415 ,  H05K2203/0455 ,  H05K2203/082 ,  Y02P70/613 ,  Y10T29/49126 ,  Y10T29/49144 ,  H01L2224/29099 ,  H01L2924/014

Abstract: High melting temperature Pb/Sn 95/5 solder balls (18) are connected to copper pads on the bottom of a ceramic chip carrier substrate (10) by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eutectic solder and raising its melting temperature. Then the module is placed on a fiberglass-epoxy circuit board with the solder balls on eutectic Pb/Sn solder bumps on copper pads of the board. The structure is reflowed to simultaneously melt the solder on both sides of the balls to allow each ball to center between the carrier pad and circuit board pad to form a more symmetric joint. This process results in structure that are more reliable under high temperature cycling. Also, to further improve reliability, the balls are made as large as the I/O spacing allows without bridging beam on balls; the two pads are about the same size with more solder on the smaller pad; the pads are at least 75% of the ball diameter; and the eutectic joints are made as large as possible without bridging between pads. For reliability at even higher temperature cycles or larger substrate sizes columns are used instead of balls.

Abstract translation: 高熔点温度Pb / Sn 95/5焊球（18）通过低熔点共晶Pb / Sn焊料连接到陶瓷芯片载体衬底（10）底部的铜焊盘。 通过快速回流进行连接，以防止将Pb溶解到共晶焊料中并提高其熔融温度。 然后将模块放置在玻璃纤维 - 环氧树脂电路板上，焊料球焊接在电路板铜焊盘上的共晶Pb / Sn焊料凸块上。 该结构被回流以同时熔化球的两侧上的焊料，以允许每个球在载体垫和电路板垫之间居中以形成更对称的接头。 该过程导致在高温循环下更可靠的结构。 此外，为了进一步提高可靠性，将球制成与I / O间隔一样大，而不会在球上桥接梁; 两个焊盘的尺寸大致相同，较小的焊盘上焊料更多; 垫片至少为球直径的75％; 并且使共晶接头制成尽可能大，而不会在焊盘之间桥接。 为了在更高的温度循环或更大的基板尺寸下的可靠性，使用色谱柱代替球。

公开(公告)号：EP0864391B1

公开(公告)日：2000-05-17

申请号：EP98101313.9

申请日：1998-01-26

Applicant: Rehm Anlagenbau GmbH + Co.

Inventor： Rehm, Johannes

IPC: B23K1/008

CPC classification number: F26B15/10 ,  B23K1/012 ,  B23K2201/42