公开(公告)号：EP0428870A2

公开(公告)日：1991-05-29

申请号：EP90119995.0

申请日：1990-10-18

Applicant: HITACHI, LTD.

Inventor： Imabayashi, Shinichiro ,  Oka, Hitoshi ,  Tanaka, Isamu ,  Kikuchi, Hiroshi ,  Watanabe, Makio

IPC: G03F7/038 ,  H05K3/46 ,  H05K3/18 ,  G03F7/004

CPC classification number: H05K3/185 ,  G03F7/004 ,  G03F7/028 ,  H05K3/0023 ,  H05K3/426 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2201/0145 ,  H05K2201/092 ,  H05K2201/09845

Abstract: A resin composition for forming conductor patterns comprising a photo curable resin, a photo­polymerization initiator, a thermosetting resin, photosensitive semiconductor particles, and if necessary a polyfunc­tional unsaturated compound is suitable for forming very fine conductor patterns in a build-up method.

Abstract translation: 用于形成导体图案，其包括光固化树脂，光聚合引发剂，热固性树脂，光敏半导体颗粒，以及如果需要，多官能不饱和化合物的树脂组合物是适合于在增层法形成非常精细的导体图案。

公开(公告)号：EP0420208A2

公开(公告)日：1991-04-03

申请号：EP90118499.4

申请日：1990-09-26

Applicant: SHOWA DENKO KABUSHIKI KAISHA

Inventor： Suzuki, Noboru, c/o Showa Denko K.K. ,  Yoshida, Masaharu, c/o Showa Denko K.K. ,  Noda, Satoshi, c/o Showa Denko K.K. ,  Takaishi, Minoru, c/o Showa Denko K.K. ,  Takiguchi, Kenichiro, c/o Showa Denko K.K. ,  Uchida, Hiroshi, c/o Showa Denko K.K. ,  Onoda, Takeshi, c/o Showa Denko K.K.

IPC: C08J5/24 ,  C08J5/06

CPC classification number: C08J5/24 ,  C08F299/0485 ,  C08J5/06 ,  C08J2367/07 ,  H05K1/0366 ,  H05K3/386 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10S428/901 ,  Y10T428/31522 ,  Y10T428/3162 ,  Y10T428/31652 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703 ,  Y10T428/3179 ,  Y10T428/31794 ,  Y10T442/3415

Abstract: Resin compositions for laminated sheets and laminated sheets produced therefrom are disclosed, the compositions comprising at least one allyl ester resin composed of a polybasic acid and a polyhydric alcohol, wherein an allyl ester group of said resin is bonded to at least one of terminals thereof.

Abstract translation: 公开了用于层压片材和层压片材的树脂组合物，所述组合物包含至少一种由多元酸和多元醇组成的烯丙基酯树脂，其中所述树脂的烯丙基酯基团与其末端中的至少一个结合。

公开(公告)号：EP0227002A1

公开(公告)日：1987-07-01

申请号：EP86117457.1

申请日：1986-12-16

Applicant: Advanced Interconnection Technology, Inc.

Inventor： Friedrich, Marju Laube

IPC: C09J167/00 ,  C09J163/00 ,  C09J175/00 ,  H05K3/22

CPC classification number: C09J171/00 ,  C08G59/18 ,  C09J163/00 ,  G02B6/3801 ,  H05K3/103 ,  H05K3/386 ,  H05K7/06 ,  H05K2201/0145 ,  H05K2201/10287 ,  H05K2203/0285 ,  H05K2203/1105

Abstract: A non-tacky, solid, adhesive composition which can be activated without C-staging the polymeric resin, upon application of sufficient heat or ultrasonic energy for a time period less than one second, comprising a) at least one film forming polymeric resin of number average molecular weight (M n ) of at least about 10 000 and having a hydroxyl, epoxide or unsaturated function­ality greater than about 7, the polymeric resin being selected from the group of polyols consisting of poly­esters, polyurethanes, phenoxies, epoxies and mixtures thereof; b) a plasticizer present in an amount which permits the activation without C-staging of the polymeric resin; c) a curing agent which is capable of cross­linking and curing the polymeric resin to a C-stage, the curing agent being present in an amount sufficient to C-stage the polymeric resin.

Abstract translation: 一种非粘性，固体，粘合剂组合物，其可以在不足够的热或超声波能量的情况下施加足够长的时间来活化而不进行聚合树脂的分级活化，所述组合物包含：a）至少一种成膜聚合树脂 平均分子量（Mn）至少约为10000，具有大于约7的羟基，环氧化物或不饱和官能团，聚合物树脂选自聚酯，聚氨酯，苯氧基，环氧化合物及其混合物组成的多元醇; b）存在的增塑剂，其量允许活化而不使聚合物树脂进行C分级; c）能够将聚合树脂交联并固化至C阶段的固化剂，所述固化剂以足以使聚合物树脂C阶段存在的量存在。

公开(公告)号：EP0124800A3

公开(公告)日：1987-05-13

申请号：EP84104209

申请日：1984-04-13

Applicant: HÜLS TROISDORF AKTIENGESELLSCHAFT

Inventor： Spielau, Paul, Dr. ,  Fassbender, Helmut, Dr. ,  Weiss, Richard, Dr.

IPC: H05K01/03

CPC classification number: B32B15/14 ,  B32B5/26 ,  B32B5/28 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2457/08 ,  H05K1/024 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2201/0278 ,  Y10S428/901 ,  Y10T428/31511 ,  Y10T428/31518 ,  Y10T428/31522 ,  Y10T428/31525 ,  Y10T428/31529 ,  Y10T442/3423 ,  Y10T442/3431 ,  Y10T442/3439 ,  Y10T442/3512 ,  Y10T442/352 ,  Y10T442/656 ,  Y10T442/669

公开(公告)号：EP0031852B1

公开(公告)日：1985-11-21

申请号：EP80900418.7

申请日：1980-01-04

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： OIZUMI, Masayuki ,  GOTO, Masana ,  AZUMI, Ichiro ,  UOZUMI, Shoji ,  UEKITA, Masakazu ,  ABE, Masaharu Dorumi Nada 604, 1-1 Oishi ,  FUSHIKI, Yasuo ,  ISHIKI, Minoru ,  KAWASAKI, Kunio

IPC: B32B15/08 ,  H05K1/03

CPC classification number: B32B38/08 ,  B32B5/26 ,  B32B7/12 ,  B32B15/14 ,  B32B15/20 ,  B32B2260/021 ,  B32B2260/023 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/101 ,  B32B2305/72 ,  B32B2307/206 ,  B32B2457/08 ,  H05K1/036 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0145 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2203/068 ,  H05K2203/1476

Abstract: A method of and device for continuously fabricating a printed circuit laminate or electrically insulating laminate. The method comprises the steps of continuously conveying sheet-like substrates (6) impregnated with a thermosetting resin liquid which produces almost no by-products such as gas, liquid, etc. during the hardening reaction process, laminating the substrates (6), applying coatings (11) to both sides of the laminated substrates at the same time as the laminating step or thereafter, and then allowing the resin to set without the application of pressure.

公开(公告)号：EP0047534B1

公开(公告)日：1984-10-10

申请号：EP81107623.1

申请日：1980-02-01

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Oizumi, Masayuki ,  Goto, Masana ,  Ishiki, Minoru ,  Uozumi, Shoji

IPC: B32B31/12

CPC classification number: B32B15/12 ,  B32B15/20 ,  B32B27/10 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/062 ,  B32B2305/08 ,  B32B2307/206 ,  B32B2457/00 ,  H01B3/48 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/269 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/3162 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31703 ,  Y10T428/31786 ,  Y10T428/3179 ,  Y10T428/31906 ,  Y10T428/31964 ,  Y10T428/31967 ,  Y10T442/3431

公开(公告)号：EP0014444B1

公开(公告)日：1984-05-16

申请号：EP80100515.8

申请日：1980-02-01

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Oizumi, Masayuki ,  Goto, Masana ,  Ishiki, Minoru ,  Uozumi, Shoji

IPC: B32B29/00 ,  H05K1/03 ,  H01B3/48

CPC classification number: B32B15/12 ,  B32B15/20 ,  B32B27/10 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/062 ,  B32B2305/08 ,  B32B2307/206 ,  B32B2457/00 ,  H01B3/48 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/269 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/3162 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31703 ,  Y10T428/31786 ,  Y10T428/3179 ,  Y10T428/31906 ,  Y10T428/31964 ,  Y10T428/31967 ,  Y10T442/3431

公开(公告)号：EP0079608A3

公开(公告)日：1984-04-04

申请号：EP82110542

申请日：1982-11-15

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Fushiki, Yasuo ,  Oizumi, Masayuki ,  Abe, Masaharu ,  Watanabe, Makoto

IPC: B32B15/08 ,  H05K01/02 ,  D21H05/00

CPC classification number: B32B15/12 ,  B32B15/08 ,  B32B27/18 ,  B32B27/36 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2307/3065 ,  B32B2457/08 ,  H05K1/034 ,  H05K1/0373 ,  H05K3/386 ,  H05K2201/012 ,  H05K2201/0145 ,  H05K2201/0209 ,  H05K2201/0284 ,  H05K2201/0293 ,  H05K2201/0355 ,  H05K2203/122 ,  Y10S428/92 ,  Y10S428/921 ,  Y10T428/31522 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31703

Abstract: A flame retarded copper clad laminate is provided comprising a plurality of paper substrate layers each impregnated with a halogen-containing unsaturated polyester resin containing about 1% to about 30% by weight of a basic filler, and a copper cladding adhesively bonded onto at least one side of the laminate.

公开(公告)号：EP0014444A1

公开(公告)日：1980-08-20

申请号：EP80100515.8

申请日：1980-02-01

Applicant: KANEGAFUCHI KAGAKU KOGYO KABUSHIKI KAISHA

Inventor： Oizumi, Masayuki ,  Goto, Masana ,  Ishiki, Minoru ,  Uozumi, Shoji

IPC: B32B29/00 ,  H05K1/03 ,  H01B3/48

CPC classification number: B32B15/12 ,  B32B15/20 ,  B32B27/10 ,  B32B2260/028 ,  B32B2260/046 ,  B32B2262/062 ,  B32B2305/08 ,  B32B2307/206 ,  B32B2457/00 ,  H01B3/48 ,  H05K1/036 ,  H05K1/0366 ,  H05K2201/0145 ,  H05K2201/0166 ,  H05K2201/0195 ,  H05K2201/0284 ,  H05K2201/0293 ,  Y10T428/269 ,  Y10T428/31515 ,  Y10T428/31518 ,  Y10T428/3162 ,  Y10T428/31627 ,  Y10T428/31681 ,  Y10T428/31688 ,  Y10T428/31692 ,  Y10T428/31699 ,  Y10T428/31703 ,  Y10T428/31786 ,  Y10T428/3179 ,  Y10T428/31906 ,  Y10T428/31964 ,  Y10T428/31967 ,  Y10T442/3431

Abstract: This invention relates to an insulating laminate which consists of several sheets of reinforcements (1) impregnated with a curable resin and layers (2) of cured resin located between each reinforcement. Metal clad laminates are also disclosed which consist of reinforcements (1), layers (2) of cured resin and a metal foil (5) placed on the laminates. Each reinforcement (1) is substantially isolated by the resin layers (2).

公开(公告)号：EP3373712A1

公开(公告)日：2018-09-12

申请号：EP17305254.9

申请日：2017-03-09

Applicant: MGI Digital Technology ,  Inkjet Engine Technology

Inventor： Abergel, Edmond ,  Gautier La Boulch, Louis

IPC: H05K3/04

CPC classification number: H05K3/046 ,  H05K2201/0129 ,  H05K2201/0145 ,  H05K2203/013 ,  H05K2203/0156 ,  H05K2203/0522 ,  H05K2203/0528 ,  H05K2203/122 ,  H05K2203/1545

Abstract: La présente invention concerne un procédé d'impression comprenant une étape d'impression d'un motif sur le substrat, de préférence par jet d'encre, suivie d'une étape de « dorure » par contact entre le motif préimprimé à dorer et un dispositif de dépôt de « dorure », tel qu'une feuille métallique de préférence conductrice, par exemple un film multicouches comprenant une feuille métallique de préférence conductrice.