Abstract:
Verfahren zum Beschichten eines Kunststoff-Gegenstandes mit einer dünnen Edelmetallschicht, dadurch gekennzeichnet, dass der Kunststoff-Gegenstand einen feinteiligen, homogen verteilten Füllstoff ausgewählt aus der Gruppe bestehend aus MnO, NiO, Cu₂O, SnO und Bi₂O₃ enthält und dieser Kunststoff-Gegenstand mit einer sauren wässrigen Lösung eines Edelmetallsalzes behandelt wird.
Abstract:
A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.
Abstract:
A process for producing a printed wiring board characterized by forming a nickel layer by electroless plating and a copper layer formed thereon by electroless plating, or forming a copper undercoating layer before the nickel layer by electroless plating can produce printed circuit boards excellent in resistance to electrolytic corrosion and suitable for mounting parts in high density.
Abstract:
Molded, one-piece articles having selected surfaces suitable for adherent metallization, molded, metallized, one-piece articles, and processes for making the said articles are disclosed. The molded one-piece articles may be formed by molding into a first mold cavity a first portion of the article using a first electrically insulating material which is adhesion promotable by an adhesion promotion process and is catalytic for adherent metallization, or is capable of being rendered catalytic for adherent metallization by an activating process; inserting the first portion into a second mold cavity; and molding into the second mold cavity a second portion of the article using a second electrically insulating material, leaving selected surface areas of the first portion exposed. The second material is resistant to the adhesion promotion process employed for the first material, or is non-catalytic for, and incapable of being rendered catalytic for, adherent metallization by the activating process employed for the first material. The exposed surface areas of the first portion of the article may then be metallized, for example, by electroless deposition to form the metallized one-piece article.
Abstract:
Circuits imprimés sur des supports injectés obtenus à partir de compositions polymériques contenant de 10 à 70% d'oxyde métallique non conducteur, le circuit conducteur étant révélé par réduction sélective avec un composé boro hydrure. Ces circuits ont une conductibilité thermique amélio rée.
Abstract:
The present disclosure provides a metal compound. The metal compound is represented by a formula (I): Cu2AαB2-αO4-β (I). A contains at least one element selected from the groups 6 and 8 of the periodic table. B contains at least one element selected from the group 13 of the periodic table, 0