Molded metallized articles and processes for making the same
    88.
    发明公开
    Molded metallized articles and processes for making the same 失效
    对于它们的制备金属化合适的模塑制品和过程。

    公开(公告)号:EP0192233A2

    公开(公告)日:1986-08-27

    申请号:EP86102055.0

    申请日:1986-02-18

    Abstract: Molded, one-piece articles having selected surfaces suitable for adherent metallization, molded, metallized, one-piece articles, and processes for making the said articles are disclosed. The molded one-piece articles may be formed by molding into a first mold cavity a first portion of the article using a first electrically insulating material which is adhesion promotable by an adhesion promotion process and is catalytic for adherent metallization, or is capable of being rendered catalytic for adherent metallization by an activating process; inserting the first portion into a second mold cavity; and molding into the second mold cavity a second portion of the article using a second electrically insulating material, leaving selected surface areas of the first portion exposed. The second material is resistant to the adhesion promotion process employed for the first material, or is non-catalytic for, and incapable of being rendered catalytic for, adherent metallization by the activating process employed for the first material. The exposed surface areas of the first portion of the article may then be metallized, for example, by electroless deposition to form the metallized one-piece article.

    Abstract translation: 具有选定的模制的单件物品适合于贴壁的金属化的表面,模制的,金属化的,单件物品,和制备的所述制品游离缺失光盘。 模制的单件制品可通过使用第一电绝缘材料的所有其粘附可提升通过在粘合增进过程,并且催化对粘附金属化,或能够被渲染成型为第一模腔的制品的第一部分上形成 催化贴壁金属化通过在激活过程; 插入所述第一部分到第二模腔中; 并成型为第二模腔使用的第二电绝缘材料的制品的第二部分,留下暴露的第一部分的选定的表面区域。 所述第二材料是用于第一材料所采用的粘合增进耐处理,或是非催化对,并且不能被用于渲染的催化,通过对所述第一材料所采用的活化处理贴壁金属化。 所述制品的所述第一部分的暴露的表面区域可随后被金属化,例如,通过无电沉积以形成金属化的单件物品。

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