摘要:
Objects are to provide a novel azole silane compound, a synthesis method thereof, and a silane coupling agent containing the azole silane compound as a component, and to provide a surface treatment solution using the azole silane compound, a surface treatment method, and a bonding method of two materials different in the quality of material. The azole silane compound of the present invention is a compound represented by the specific chemical formula (I-1) or (II-1).
摘要:
The invention provides a glycoluril represented by the general formula (Z):
wherein the group Z represents a carboxyalkyl, a glycidyl or an allyl group; R 1 and R 2 each independently represents a hydrogen atom, a lower alkyl or a phenyl group; R 3 , R 4 and R 5 each independently represents a hydrogen atom or the group identical with the group Z; however, when the group Z is a carboxyalkyl group, R 3 , R 4 and R 5 are the same carboxyalkyl groups as the group Z; and when the group Z is an allyl group, R 5 represents a hydrogen atom. The invention further provides various resin compositions, for example, polyester resin compositions, epoxy resin compositions, and silicone resin compositions each comprising the glycoluril.
摘要翻译:本发明提供由通式(Z)表示的甘脲:其中基团Z表示羧基烷基,缩水甘油基或烯丙基; R 1和R 2各自独立地表示氢原子,低级烷基或苯基; R 3,R 4和R 5各自独立地表示氢原子或与基团Z相同的基团; 然而,当基团Z是羧基烷基时,R 3,R 4和R 5是与基团Z相同的羧基烷基; 当基团Z为烯丙基时,R 5表示氢原子。 本发明还提供了各种树脂组合物,例如聚酯树脂组合物,环氧树脂组合物和各自包含甘脲的有机硅树脂组合物。
摘要:
A surface treating composition for copper or a copper alloy comprising an imidazole compound and means for using the composition in the soldering of electronic parts to printed wiring boards are disclosed.
摘要:
A surface treating agent for copper and a copper alloy, comprising an aqueous solution containing an imidazole compound or a benzimidazole compound, a complexon, and iron ions. The agent forms a chemical film selectively on the surface of copper while forming no film on other metals.
摘要:
A water-based agent suitable for treating copper or copper alloys on printed wiring boards (PWB) is provided. The chemical layer formed on the PWB shows excellent heat-resistance and moisture-resistance. Therefore, the treated PWB preserves excellent solderability for a long time. The water-based agent comprises, as an active ingredient, a 2-arylimidazole of formula (I)
wherein n is 0 or 1; R is a hydrogen atom or a methyl group; R¹ and R², which may be the same or different, are hydrogen atoms, lower alkyl groups or halogen atoms; and R³ and R⁴, which may be the same or different, are hydrogen atoms, lower alkyl groups, halogen atoms, lower alkoxy groups, di-lower alkylamino groups, cyano groups or nitro groups; with the proviso that when n is 1, R and R¹-R⁴ may not all be hydrogen atoms; for treating a copper or copper alloy surface.
摘要翻译:提供一种适用于在印刷电路板(PWB)上处理铜或铜合金的水性试剂。 形成在PWB上的化学层显示出优异的耐热性和耐湿性。 因此,处理后的PWB长时间保持良好的可焊性。 作为活性成分,水性剂包括式(I)的2-芳基咪唑,其中n为0或1; R是氢原子或甲基; R 1和R 2可以相同或不同,是氢原子,低级烷基或卤原子; R 3和R 4可以相同或不同,为氢原子,低级烷基,卤素原子,低级烷氧基,二低级烷基氨基,氰基或硝基; 条件是当n为1时,R和R 1 -R 4不能都是氢原子; 用于处理铜或铜合金表面