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    SOLDERING PROCESS DEVICE
    1.
    发明公开
    SOLDERING PROCESS DEVICE 审中-公开

    公开(公告)号：EP3272449A4

    公开(公告)日：2018-05-23

    申请号：EP16764956

    申请日：2016-03-15

    申请人： AND CO LTD

    发明人： EBISAWA MITSUO

    IPC分类号： B23K3/06 ,  B23K1/00 ,  B23K3/00 ,  B23K3/02 ,  B23K3/03 ,  B23K101/42 ,  H05K3/34

    CPC分类号： B23K3/0615 ,  B23K1/0016 ,  B23K3/02 ,  B23K3/03 ,  B23K3/063 ,  B23K2201/42 ,  H05K3/34

    摘要： A substantially tubular iron tip (5) that can be heated and that is extended vertically and a solder piece supply portion that supplies a first solder piece (Whl) and a second solder piece (Wh2) in which a layer of a flux (72) is provided within a tubular solder layer in this order from above into the iron tip are provided, within the iron tip, the solder pieces are erected such that on the first solder piece, the second solder piece rides and the heat of the iron tip is used to melt the first solder piece and the second solder piece such that the molten solder is supplied downward. In this way, it is possible to more reliably heat and melt the solder pieces in a posture in which they are erected within the iron tip.

    SOLDERING DEVICE
    2.
    发明公开
    SOLDERING DEVICE 审中-公开
    焊接设备

    公开(公告)号：EP3275584A1

    公开(公告)日：2018-01-31

    申请号：EP16768920.7

    申请日：2016-03-25

    申请人： AND Co,. Ltd.

    发明人： EBISAWA, Mitsuo

    IPC分类号： B23K3/02 ,  B23K1/00 ,  B23K3/06 ,  H05K3/34 ,  B23K101/42

    CPC分类号： B23K1/002 ,  B23K3/02 ,  B23K3/0315 ,  B23K3/06 ,  B23K3/0615 ,  B23K3/063 ,  H05K3/34

    摘要： In a solder processing device (A) which includes: a substantially tubular iron tip (5) that can be heated and that is extended vertically; and a solder piece supply portion (2, 6) that supplies a solder piece (Wh) from above into the iron tip (5), and in which the heat of the iron tip (5) is used to melt the solder piece (Wh) such that the molten solder is supplied downward, the supplied solder piece (Wh) is forcefully brought into contact with the inner wall of the iron tip (5). In this way, it is possible to more reliably heat and melt the solder piece (Wh) by use of the heat of the iron tip (5).

    摘要翻译： 在一种焊料加工装置（A）中，该焊料加工装置（A）包括：一个可被加热并且被垂直延伸的大致管状的铁尖端（5） 以及从上方向烙铁头（5）供给焊锡片（Wh）的钎焊片供给部（2,6），烙铁头（5）的热量用于熔化焊锡片（Wh ），使得熔化的焊料向下供应，供应的焊料（Wh）强力地接触烙铁头（5）的内壁。 以这种方式，可以利用烙铁头（5）的热量更可靠地加热和熔化焊片（Wh）。

    Optical measuring system
    5.
    发明公开
    Optical measuring system 有权
    光学测量系统

    公开(公告)号：EP1850100A3

    公开(公告)日：2009-02-25

    申请号：EP07015552.8

    申请日：2004-12-09

    申请人： THOMAS SWAN AND CO., LTD.

    发明人： Holmes, Melanie

    IPC分类号： G01J9/00 ,  G02B27/46 ,  G02B26/06 ,  G06E3/00

    CPC分类号： G01J9/00 ,  G02B26/06 ,  G02B27/46

    摘要： Apparatus and methods are described for calibrating an optical system having a Spatial Light Modulator, SLM, the method comprising a comparison of: a phase and/or amplitude distribution of at least one beam incident on the SLM, this phase and/or amplitude distribution measured by means of phase modulating elements on the SLM; with at least one known feature of the beam.