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    CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
    2.
    发明公开
    CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES 审中-公开
    REINIGUNGSFORMULIERUNG ZUR ENTFERNUNG VONRÜCKSTÄNDENAUFOBERFLÄCHEN

    公开(公告)号：EP3080240A4

    公开(公告)日：2017-07-19

    申请号：EP14868924

    申请日：2014-12-09

    申请人： FUJIFILM ELECTRONIC MAT USA INC

    发明人： KNEER EMIL A

    IPC分类号： H01L21/311 ,  C11D3/00 ,  C11D7/08 ,  C11D7/10 ,  C11D11/00

    CPC分类号： C11D11/0047 ,  C11D3/0073 ,  C11D7/08 ,  C11D7/10 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/02071 ,  H01L21/3065

    摘要： This disclosure relates to a cleaning composition that contains 1) HF; 2) substituted or unsubstituted boric acid; 3) ammonium sulfate; 4) at least one metal corrosion inhibitor; 5) water; and 6) optionally, at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

    摘要翻译： 本公开涉及一种清洁组合物，其包含1）HF; 2）取代或未取代的硼酸; 3）硫酸铵; 4）至少一种金属腐蚀抑制剂; 5）水; 和6）任选地，至少一种pH调节剂，该pH调节剂是不含金属离子的碱。 本公开还涉及使用上述组合物来清洁半导体衬底的方法。

    CLEANING FORMULATIONS FOR REMOVING RESIDUES ON SURFACES
    5.
    发明公开
    CLEANING FORMULATIONS FOR REMOVING RESIDUES ON SURFACES 有权
    REINIGUNGSFORMULIERUNGEN ZUR ENTFERNUNG VONRÜCKSTÄNDENAUFOBERFLÄCHEN

    公开(公告)号：EP3060642A4

    公开(公告)日：2017-07-19

    申请号：EP14855311

    申请日：2014-09-15

    申请人： FUJIFILM ELECTRONIC MAT USA INC

    发明人： DORY THOMAS ,  DU BING ,  TAKAHASHI TOMONORI ,  KNEER EMIL A

    IPC分类号： H01L21/311 ,  C11D3/00 ,  C11D7/32 ,  C11D7/50 ,  C11D11/00 ,  G03F7/42

    CPC分类号： C11D11/0047 ,  C11D3/0073 ,  C11D3/2003 ,  C11D3/2068 ,  C11D3/2072 ,  C11D3/2079 ,  C11D3/2082 ,  C11D3/2086 ,  C11D3/2093 ,  C11D7/3245 ,  C11D7/3281 ,  C11D7/5022 ,  G03F7/425 ,  G03F7/426 ,  H01L21/02063

    摘要： This disclosure relates to a cleaning composition that contains 1) at least one chelating agent, the chelating agent being a polyaminopolycarboxylic acid; 2) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 3) at least one monocarboxylic acid containing a primary or secondary amino group and at least one additional basic group containing nitrogen; 4) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; and 5) water. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

    摘要翻译： 本公开涉及一种清洁组合物，其包含1）至少一种螯合剂，所述螯合剂是聚氨基多羧酸; 2）至少一种选自水溶性醇，水溶性酮，水溶性酯和水溶性醚的有机溶剂; 3）至少一种含有伯或仲氨基和至少一种附加的含碱性基团的氮的一元羧酸; 4）至少一种金属腐蚀抑制剂，所述金属腐蚀抑制剂为取代或未取代的苯并三唑; 和5）水。 本公开还涉及使用上述组合物来清洁半导体衬底的方法。

    CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES
    7.
    发明公开
    CLEANING FORMULATION FOR REMOVING RESIDUES ON SURFACES 审中-公开
    REINIGUNGSFORMULIERUNG ZUR ENTFERNUNG VONRÜCKSTÄNDENAUFOBERFLÄCHEN

    公开(公告)号：EP3077129A4

    公开(公告)日：2017-10-04

    申请号：EP14867771

    申请日：2014-12-03

    申请人： FUJIFILM ELECTRONIC MAT USA INC

    发明人： TAKAHASHI TOMONORI ,  DU BING ,  WOJTCZAK WILLIAM A ,  DORY THOMAS ,  KNEER EMIL A

    IPC分类号： H01L21/311 ,  C11D3/00 ,  C11D7/32 ,  C11D7/50 ,  C11D11/00 ,  H01L21/02

    CPC分类号： C11D11/0047 ,  C11D3/0073 ,  C11D7/3218 ,  C11D7/3245 ,  C11D7/3281 ,  C11D7/5022 ,  H01L21/0206 ,  H01L21/02063 ,  H01L21/02068 ,  H01L21/02071 ,  H01L21/0273 ,  H01L21/31133

    摘要： This disclosure relates to a cleaning composition that contains 1) at least one redox agent; 2) at least one first chelating agent, the first chelating agent being a polyaminopolycarboxylic acid; 3) at least one second chelating agent different from the first chelating agent, the second chelating agent containing at least two nitrogen-containing groups; 4) at least one metal corrosion inhibitor, the metal corrosion inhibitor being a substituted or unsubstituted benzotriazole; 5) at least one organic solvent selected from the group consisting of water soluble alcohols, water soluble ketones, water soluble esters, and water soluble ethers; 6) water; and 7) optionally, at least one pH adjusting agent, the pH adjusting agent being a base free of a metal ion. This disclosure also relates to a method of using the above composition for cleaning a semiconductor substrate.

    摘要翻译： 本公开涉及一种清洁组合物，其包含1）至少一种氧化还原剂; 2）至少一种第一螯合剂，第一螯合剂是聚氨基多羧酸; 3）至少一种不同于第一螯合剂的第二螯合剂，第二螯合剂含有至少两个含氮基团; 4）至少一种金属腐蚀抑制剂，所述金属腐蚀抑制剂为取代或未取代的苯并三唑; 5）至少一种选自水溶性醇，水溶性酮，水溶性酯和水溶性醚的有机溶剂; 6）水; 和7）任选地，至少一种pH调节剂，该pH调节剂是不含金属离子的碱。 本公开还涉及使用上述组合物来清洁半导体衬底的方法。