公开(公告)号：EP0655183B1

公开(公告)日：1997-07-09

申请号：EP93917736.6

申请日：1993-08-03

申请人： AMP-Akzo LinLam VOF

发明人： MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrik

IPC分类号： H05K3/46

CPC分类号： B32B37/12 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4626 ,  H05K2201/0195 ,  H05K2201/0287

摘要： A process for manufacturing a multi-layer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate based on a UD-reinforced synthetic material, provided on either side with traces, is combined with and bonded to a back-up substrate, wherein during the laminating process the back-up substrate is added to the basic substrate, the base substrate and the back-up substrate comprising a UD-reinforced cured core layer, the base substrate having been provided at least on the side facing the back-up substrate with a still plastically deformable (flowable) adhesive layer, and such a pressure is exerted on the laminate as to bring said back-up substrate into contact or practically into contact with the conducting traces of the basic substrate, and the space between these traces is filled with the adhesive material, so bonding the basic substrate and the back-up substrate.

公开(公告)号：EP0587644B1

公开(公告)日：1996-07-17

申请号：EP92911164.9

申请日：1992-05-19

申请人： AMP-Akzo LinLam VOF

发明人： MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrik

IPC分类号： H05K1/03 ,  B32B5/28 ,  B32B7/12 ,  B32B5/12

CPC分类号： H05K1/036 ,  B32B5/12 ,  H05K1/0366 ,  H05K2201/0236 ,  H05K2201/0287 ,  Y10T428/24058 ,  Y10T428/24124 ,  Y10T428/24917 ,  Y10T442/656

摘要： The invention relates to a method of manufacturing a supporting board for printed circuits and to the board so obtainable, the method comprising the following steps: manufacturing an electrically non-conducting synthetic layer reinforced with unidirectionally oriented fibres, which will not be made to flow during the subsequent steps; coating at least part of the aforementioned unidirectional laminate with an adhesive on one or both sides; stacking the laminates which have at any rate been coated in part with an adhesive in such a way that there is at least one layer of adhesive between each pair of layers and practically the same amount of material of even thickness and composition is disposed in the virtually perpendicularly intersecting orientation directions; bonding the stacked UD-laminates by activating the adhesive layers.

公开(公告)号：EP0751866B1

公开(公告)日：1999-04-21

申请号：EP95907614.2

申请日：1995-01-25

申请人： AMP-Akzo LinLam VOF

发明人： MIDDELMAN, Erik ,  SERAPHIM, Donald, Philip

IPC分类号： B29C70/22 ,  B29C70/50 ,  B29C70/68 ,  B32B31/00 ,  B32B15/08 ,  H05K1/03

CPC分类号： B29C70/504 ,  B29C70/088 ,  B29C70/202 ,  B29K2105/108 ,  B32B15/14 ,  B32B37/02 ,  B32B37/1027 ,  B32B37/226 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/0287

摘要： The invention relates to a method of manufacturing a composite laminate having a plurality of UD layers, i.e., layers of matrix material reinforced with unidirectionally oriented fibres, and at least one inner metal layer, i.e., a metal layer that does not form an outer surface of the laminate, the layers being arranged so as to give a balanced and symmetric laminate. The method comprises passing through a laminating zone, preferably a double-belt press, unidirectionally oriented (UD) fibres provided with not yet consolidated matrix material and consolidating the matrix material. In a first step a non-flowing sandwich laminate of at least three layers is formed, the at least three layers being UD and metal layers, the sandwich laminate being formed by passing UD fibres provided with not yet consolidated matrix material through the laminating zone together with metal foil, and in a second step the non-flowing sandwich laminate is provided on its outer surfaces with UD layers, with additional UD layers optionally being added in subsequent steps.

公开(公告)号：EP0651696B1

公开(公告)日：1998-08-05

申请号：EP93915962.0

申请日：1993-07-20

申请人： AMP-Akzo LinLam VOF

发明人： MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrick

IPC分类号： B29C70/02 ,  B32B31/00 ,  H05K1/03

CPC分类号： B32B37/02 ,  B29C70/083 ,  B29C70/202 ,  B29C70/504 ,  B29K2105/0845 ,  B29K2105/108 ,  B29L2031/3425 ,  B32B37/1027 ,  B32B37/226 ,  B32B2305/10 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/022 ,  H05K3/4626 ,  H05K2201/0287 ,  Y10S428/901 ,  Y10T156/1084 ,  Y10T428/24074 ,  Y10T428/24132 ,  Y10T428/24802 ,  Y10T428/24917

公开(公告)号：EP0782500A1

公开(公告)日：1997-07-09

申请号：EP95932765.0

申请日：1995-09-18

申请人： AMP-Akzo LinLam VOF

发明人： MIDDELMAN, Erik

IPC分类号： C08J5 ,  B29C70 ,  B32B15 ,  B32B17 ,  B32B37 ,  H05K1 ,  H05K3 ,  B29K105

CPC分类号： B32B37/24 ,  B29C70/088 ,  B29K2105/101 ,  B29K2105/108 ,  B29K2105/243 ,  B29K2105/256 ,  B29K2705/00 ,  B32B5/024 ,  B32B5/12 ,  B32B5/18 ,  B32B15/08 ,  B32B15/095 ,  B32B15/20 ,  B32B27/38 ,  B32B27/40 ,  B32B38/08 ,  B32B2260/021 ,  B32B2260/046 ,  B32B2262/0284 ,  B32B2262/101 ,  B32B2307/514 ,  B32B2311/12 ,  B32B2363/00 ,  H05K1/0366 ,  H05K2201/0287

摘要： The invention relates to a basic material for making a PWB laminate, which is a foiled UD-prepreg comprising a layer of a conductive metal foil bonded to a layer made up of parallel, unidirectionally oriented reinforcing fibres, having a diameter of below 30 νm, impregnated with not yet fully consolidated matrix resin. The foiled UD-prepreg can be used to manufacture UD-crossply PWB laminates by stacking and pressing them together with, in between, other UD-layers, which may be either non-foiled UD-prepreg layers, or non-flowing UD composite layers.

公开(公告)号：EP0751866A1

公开(公告)日：1997-01-08

申请号：EP95907614.0

申请日：1995-01-25

申请人： AMP-Akzo LinLam VOF

发明人： MIDDELMAN, Erik ,  SERAPHIM, Donald, Philip

IPC分类号： B29C70 ,  B32B15 ,  B32B37 ,  H05K1 ,  B29K105 ,  H05K3

CPC分类号： B29C70/504 ,  B29C70/088 ,  B29C70/202 ,  B29K2105/108 ,  B32B15/14 ,  B32B37/02 ,  B32B37/1027 ,  B32B37/226 ,  B32B2307/202 ,  B32B2307/302 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4611 ,  H05K2201/0287

摘要： The invention relates to a method of manufacturing a composite laminate having a plurality of UD layers, i.e., layers of matrix material reinforced with unidirectionally oriented fibres, and at least one inner metal layer, i.e., a metal layer that does not form an outer surface of the laminate, the layers being arranged so as to give a balanced and symmetric laminate. The method comprises passing through a laminating zone, preferably a double-belt press, unidirectionally oriented (UD) fibres provided with not yet consolidated matrix material and consolidating the matrix material. In a first step a non-flowing sandwich laminate of at least three layers is formed, the at least three layers being UD and metal layers, the sandwich laminate being formed by passing UD fibres provided with not yet consolidated matrix material through the laminating zone together with metal foil, and in a second step the non-flowing sandwich laminate is provided on its outer surfaces with UD layers, with additional UD layers optionally being added in subsequent steps.

公开(公告)号：EP0741636A1

公开(公告)日：1996-11-13

申请号：EP95907613.0

申请日：1995-01-25

申请人： AMP-Akzo LinLam VOF

发明人： MIDDELMAN, Erik

IPC分类号： B32B5 ,  B29B15 ,  B29C70 ,  H05K1 ,  H05K3

CPC分类号： B29C70/506 ,  B29B15/122 ,  H05K1/0366 ,  H05K3/022 ,  H05K2201/0209 ,  H05K2201/0287 ,  Y10S428/901 ,  Y10T156/1084 ,  Y10T428/24058 ,  Y10T428/24074 ,  Y10T428/24124 ,  Y10T428/24132 ,  Y10T428/24322 ,  Y10T428/24802 ,  Y10T428/24917 ,  Y10T428/2905 ,  Y10T428/30 ,  Y10T428/31721 ,  Y10T442/656

摘要： The invention relates to a method of making a composite laminate comprising the steps of providing unidirectionally oriented parallel fibres (UD filaments) (3) with a resin matrix to form a composite UD layer and laminating a plurality of UD layers to form a UD crossply laminate (18). In the method of the invention, the UD filaments are impregnated with a melt of a resin which in the uncured form solidifies below a certain temperature (Tm). Thereupon the UD filaments-containing resin is cooled to a temperature below Tm to produce said composite UD layer. The produced composite UD layer is irreversibly cured before or after lamination. Notably latent curing resins are suitable. The impregnation is preferably conducted by coating a process belt (8) with solid resin (6), laying the UD filaments onto the resin, and heating the resin so as to form the resin melt. The heating of the resin is preferably conducted by means of IR irradiation (11).

公开(公告)号：EP0587634B1

公开(公告)日：1996-06-19

申请号：EP92911019.5

申请日：1992-05-19

申请人： AMP-Akzo LinLam VOF

发明人： MIDDELMAN, Erik ,  ZUURING, Pieter, Hendrik

IPC分类号： H05K3/46

CPC分类号： H05K3/4655 ,  B32B37/12 ,  B32B2457/08 ,  H05K1/0366 ,  H05K3/386 ,  H05K3/4652 ,  H05K2201/0195 ,  H05K2201/0287 ,  H05K2203/0759 ,  Y10S428/901 ,  Y10T29/49126 ,  Y10T29/49146 ,  Y10T29/49158 ,  Y10T428/24917 ,  Y10T428/249951 ,  Y10T428/249994

摘要： A process for manufacturing a multilayer printed wire board, also referred to as a multilayer, comprising at least two electrically insulating substrates with electrically conductive traces or layers provided on at least three surfaces thereof, in which process, by means of lamination under pressure, a cured basic substrate (8) based on a UD-reinforced synthetic material, provided on either side with traces (7), is combined with and bonded to a back-up substrate (9), wherein during the laminating process the back-up substrate (9) is added to the basic substrate, the back-up substrate (9) comprising a UD-reinforced cured core layer provided at least on the side facing the conducting traces of the basic substrate with a still plastically deformable (flowable) adhesive layer (15), and such a pressure is exerted on the laminate as to bring said cured core layer of the back-up substrate into contact or practically into contact with the conducting traces (7) of the basic substrate (8), and the space between these traces is filled with the adhesive material, so bonding the basic substrate (8) and the back-up substrate (9).