公开(公告)号：EP1421614B1

公开(公告)日：2015-02-25

申请号：EP02751499.1

申请日：2002-08-02

申请人： Gemalto SA ,  Schlumberger Malco, Inc.

发明人： BONVALOT, Béatrice

IPC分类号： H01L21/60 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/08112 ,  H01L2224/08123 ,  H01L2224/08145 ,  H01L2224/08148 ,  H01L2224/13078 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/17107 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/80203 ,  H01L2224/81203 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/9202 ,  H01L2224/9212 ,  H01L2224/92127 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/80

公开(公告)号：EP1540729A1

公开(公告)日：2005-06-15

申请号：EP03797468.0

申请日：2003-09-17

申请人： Axalto SA ,  Schlumberger Malco, Inc.

发明人： LEIBENGUTH, Joseph ,  BONVALOT, Béatrice ,  THEVENOT, Benoît ,  LEMOULLEC, Laurent ,  DEPOUTOT, Frédéric ,  REIGNOUX, Yves

IPC分类号： H01L23/58 ,  G06K19/073 ,  G06K19/077 ,  H01L25/18

CPC分类号： G06K19/07747 ,  G06K19/072 ,  G06K19/077 ,  G06K19/07745 ,  G06K19/07749 ,  G06K19/0775 ,  G06K19/07769 ,  H01L21/50 ,  H01L23/49855 ,  H01L24/45 ,  H01L24/48 ,  H01L2224/451 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/01055 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

摘要： A method of manufacturing a wafer assembly comprising a chip wafer onto which a cover wafer is deposited, the chip wafer comprising an active face and an inactive face, the active face comprising chip elements, the cover wafer being provided with a chip-element-receiving cavity located above a chip element, comprises the following steps: - a cover-wafer-depositing step, in which a cover wafer is deposited on the active face so as to obtain a wafer assembly, the cover wafer being provided with a plurality of chip-receiving cavities, a chip-receiving cavity being located above a chip element, the cover wafer being made of an organic material; - a wafer assembly thinning step, in which the inactive face of the chip wafer is thinned; - an assembling step, in which a chip is placed in the cavity of the cover wafer stacked above the chip wafer.

公开(公告)号：EP1442477A1

公开(公告)日：2004-08-04

申请号：EP02783363.1

申请日：2002-11-06

申请人： SCHLUMBERGER Systèmes ,  Schlumberger Malco, Inc.

发明人： BONVALOT, Béatrice ,  BARBE, Sylvie ,  LEMOULLEC, Laurent ,  LEYDIER, Robert

IPC分类号： H01L21/58

CPC分类号： H01L25/50 ,  H01L24/26 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14

摘要： A sealing-object (4) is fixed to a base-object (10). The sealing-object comprises a through-hole (5). The objects are fixed to each other in the following manner. In a preparation step, a fixing layer (1,2,3) is provided between the base-object and the seali ng-object. In addition an evacuation device (6) equipped with an evacuation channel (7) is placed onto the sealing-object. The through-hole of the sealing object has a first extremity opening out on the evacuation channel and a second extremity opening out on the fixing layer. In a fixing step, the fixing layer is heated which causes the fixing layer to release gas. The gas is at least partially evacuated via the through-hole of the sealing-object and the evacuation channel of the evacuation device.

公开(公告)号：EP1451865A2

公开(公告)日：2004-09-01

申请号：EP02781477.1

申请日：2002-11-06

申请人： SCHLUMBERGER Systèmes ,  Schlumberger Malco, Inc.

发明人： BONVALOT, Béatrice ,  BARBE, Sylvie ,  LEMOULLEC, Laurent ,  LEYDIER, Robert

IPC分类号： H01L21/58

CPC分类号： H01L25/50 ,  H01L24/26 ,  H01L24/83 ,  H01L2224/8319 ,  H01L2224/8385 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01033 ,  H01L2924/07802 ,  H01L2924/14

摘要： A plurality of assemblies is manufactured. Each assembly comprises a sealing slice that is fixed to a base slice. The plurality of assemblies is manufactured in the following manner. In a preparation step, a stack is formed. The stack comprises a plurality of pre-assemblies. Each pre-assembly comprises a base slice, a sealing slice and a fixing layer provided between the base slice and the sealing slice. The stack further comprises at least one supple buffer layer. The supple buffer layer has a mechanical rigidity, which is substantially less than that of the base slices and that of the sealing slices. The supple buffer layer thus enables to compensate for variations in thickness of the base slices and of the sealing slices. In a fixing step, the stack is pressed which causes the sealing slice of each pre-assembly to be fixed to the base-slice of the pre-assembly.

公开(公告)号：EP1421614A2

公开(公告)日：2004-05-26

申请号：EP02751499.1

申请日：2002-08-02

申请人： SCHLUMBERGER Systèmes ,  Schlumberger Malco, Inc.

发明人： BONVALOT, Béatrice

IPC分类号： H01L21/60 ,  H01L21/56

CPC分类号： H01L24/85 ,  H01L24/05 ,  H01L24/08 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/48 ,  H01L24/80 ,  H01L24/81 ,  H01L24/92 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05556 ,  H01L2224/05599 ,  H01L2224/05624 ,  H01L2224/08112 ,  H01L2224/08123 ,  H01L2224/08145 ,  H01L2224/08148 ,  H01L2224/13078 ,  H01L2224/16112 ,  H01L2224/16145 ,  H01L2224/16148 ,  H01L2224/17107 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2224/80203 ,  H01L2224/81203 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2224/85399 ,  H01L2224/9202 ,  H01L2224/9212 ,  H01L2224/92127 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49147 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49204 ,  H01L2224/78 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2224/85 ,  H01L2224/80

摘要： A method of manufacturing an electrical device that is electrically and mechanically connectable to another electrical device, the electrical device having a face equipped with contact pads, the method being characterised in that it includes:- a layer-application step in which an adhesive layer is applied on the face equipped with contact pads, the adhesive layer being composed of a substance with adhesive properties; - an opening-creation step in which an opening is created through the adhesive layer at the level of a contact pad; - an opening-filing step in which the opening is filled with a conductive material so that the opening is substantially filled with the conductive material so as to form a conductive path the volume of which is defined by the opening.

公开(公告)号：EP1053531B2

公开(公告)日：2010-09-29

申请号：EP99902596.8

申请日：1999-02-04

申请人： Gemalto SA

发明人： BONVALOT, Béatrice ,  SERVEL, Eric ,  LEYDIER, Robert

IPC分类号： G06K19/07 ,  G06K19/073

CPC分类号： G06K19/073 ,  G06F2207/7219 ,  G06K19/07 ,  H01L2924/0002 ,  H01L2924/00