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1.发明公开CONDUCTIVE FILM FORMING METHOD, COPPER FINE PARTICLE-DISPERSED LIQUID, AND CIRCUIT BOARD 审中-公开导电薄膜，香料颗粒分散液体和PCB的生产方法
公开(公告)号：EP2787796A4
公开(公告)日：2015-09-09
申请号：EP12862999
申请日：2012-08-13
Applicant: ISHIHARA CHEMICAL CO LTD , APPLIED NANOTECH HOLDINGS INC
Inventor： KAWATO YUICHI , MITA TOMOHIRO , MAEDA YUSUKE , KUDO TOMIO
CPC classification number: H05K1/092 , C09D11/52 , H05K1/0306 , H05K1/032 , H05K1/0346 , H05K1/0366 , H05K1/05 , H05K1/097 , H05K3/108 , H05K3/1283 , H05K3/185 , H05K3/241 , H05K3/246 , H05K3/381 , H05K2201/0129 , H05K2201/0145 , H05K2201/2072 , H05K2203/1105
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2.发明公开
公开(公告)号：EP2869677A4
公开(公告)日：2016-06-15
申请号：EP13808900
申请日：2013-02-28
Applicant: ISHIHARA CHEMICAL CO LTD
Inventor： KAWATO YUICHI , MITA TOMOHIRO , MAEDA YUSUKE , KUDO TOMIO
CPC classification number: H05K3/38 , H05K1/0296 , H05K1/0313 , H05K1/097 , H05K3/245 , H05K3/246 , H05K3/386 , H05K2201/0129 , H05K2201/0137 , H05K2201/0154 , H05K2201/032 , H05K2203/1126 , H05K2203/1131 , Y10T29/49163
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