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    COPPER PARTICLE DISPERSION, CONDUCTIVE FILM FORMATION METHOD, AND CIRCUIT SUBSTRATE
    3.
    发明公开
    COPPER PARTICLE DISPERSION, CONDUCTIVE FILM FORMATION METHOD, AND CIRCUIT SUBSTRATE 审中-公开
    KUPFERPARTIKELDISPERSION，HERSTELLUNGSVERFAHRENFÜRLEITFÄHIGENFILM UND SCHALTSUBSTRAT

    公开(公告)号：EP2738772A4

    公开(公告)日：2015-05-06

    申请号：EP12849326

    申请日：2012-01-04

    申请人： ISHIHARA CHEMICAL CO LTD ,  APPLIED NANOTECH HOLDINGS INC

    发明人： KAWATO YUICHI ,  MAEDA YUSUKE ,  KUDO TOMIO

    IPC分类号： H01B1/02 ,  H01B1/22 ,  H01L23/498 ,  H05K1/09 ,  H05K3/12

    CPC分类号： H05K1/097 ,  C09D11/52 ,  H01B1/026 ,  H01B1/22 ,  H01L23/49883 ,  H01L2924/0002 ,  H05K3/00 ,  H05K3/1283 ,  H05K2203/107 ,  Y10T428/31678 ,  H01L2924/00

    摘要： An object is to provide the formulation of a copper particulate dispersion in which copper particulates are dispersed. The copper particulate dispersion includes copper particulates, at least one kind of a dispersion vehicle containing the copper particulates, and at least one kind of dispersant which allows the copper particulates to disperse in the dispersion vehicle. The copper particulates have a center particle diameter of 1 nm or more and less than 100 nm. The dispersion vehicle is a polar dispersion vehicle. The dispersant is a compound having at least one acidic functional group, which has a molecular weight of 200 or more and 100,000 or less, or a salt thereof. Whereby, the dispersant has compatibility with dispersion vehicle and a surface of copper particulates is coated with dispersant molecules, and thus the copper particulates are dispersed in the dispersion vehicle.

    摘要翻译： 目的是提供其中分散有铜颗粒的铜颗粒分散体的配方。 铜颗粒分散体包括铜颗粒，至少一种含有铜微粒的分散载体，以及允许铜颗粒分散在分散载体中的至少一种分散剂。 铜颗粒的中心粒径为1nm以上且小于100nm。 分散载体是极性分散载体。 分散剂是具有至少一个分子量为200以上且100,000以下的酸性官能团的化合物或其盐。 由此，分散剂与分散载体具有相容性，并且用分散剂分子涂覆铜颗粒的表面，因此将铜微粒分散在分散载体中。